Patents by Inventor Yu-Chi Lin

Yu-Chi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10695381
    Abstract: A tissue repair material derived from fish skin and manufacturing method thereof is applied to provide the tissue repair material suitable for use as a patch, a cover, a carrier, a scaffold, an implant or a reagent in various tissues. The tissue repair material has collagens to improve the wounded tissue repair, and has particular characters for desired tissue repair application. Furthermore, so far the factors of the terrestrial animal transmitted disease (caused by virus) do not survive on the tissue repair material derived from fish skin.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: June 30, 2020
    Assignee: BODY ORGAN BIOMEDICAL CORP.
    Inventors: Horng-Ji Lai, Min-Chang Huang, Jui-Min Ho, Yun-Ting Hsu, Yu-Chi Lin, Ta-Wei Su, Kuan-Hao Huang, Yu-Wei Chang
  • Publication number: 20200132618
    Abstract: A gas sensor includes a first electrode, a gas detecting layer disposed on the first electrode, and an electric-conduction enhanced electrode unit being electrically connected to the first electrode and the gas detecting layer. The electric-conduction enhanced electrode unit includes an electric-conduction enhancing layer and a second electrode electrically connected to the electric-conduction enhancing layer. The electric-conduction enhancing layer is electrically connected to the gas detecting layer and is made of an electrically conductive organic material.
    Type: Application
    Filed: July 18, 2019
    Publication date: April 30, 2020
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Hsiao-Wen ZAN, Hsin-Fei MENG, Yu-Chi LIN, Shang-Yu YU, Ting-Wei TUNG, Yi-Chu WU, Yu-Nung MAO
  • Publication number: 20200111649
    Abstract: A semiconductor manufacturing method and semiconductor manufacturing tool for performing the same are disclosed. The semiconductor manufacturing tool includes a plasma chamber, a mounting platform disposed within the plasma chamber, a focus ring disposed within the plasma chamber, and at least one actuator mechanically coupled to the focus ring and configured to move the focus ring vertically. The actuator is configured to move the focus ring vertically when a plasma is present in the plasma chamber.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 9, 2020
    Inventors: Yu-Chi Lin, Yi-Wei Chiu, Hung Jui Chang, Chin-Hsing Lin
  • Publication number: 20200058513
    Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.
    Type: Application
    Filed: October 25, 2019
    Publication date: February 20, 2020
    Inventors: Yu-Chi Lin, Chin-Hsing Lin, Hung Jui Chang, Yi-Wei Chiu, Yu-Wei Kuo, Yu Lun Ke
  • Publication number: 20200051791
    Abstract: The present disclosure describes an exemplary etch process in a reactor that includes a shower head and an electrostatic chuck configured to receive a radio frequency (RF) power. The shower head includes a top plate and a bottom plate with one or more gas channels that receive incoming gases. The method can include (i) rotating the top plate or the bottom plate of the shower head to a first position to allow a gas to flow through the shower head; (ii) performing a surface modification cycle that includes: applying a negative direct current (DC) bias voltage to the shower head, applying an RF power signal to the wafer chuck; and (iii) performing an etching cycle that includes: removing the negative DC bias voltage from the shower head and lowering the RF power signal applied to the wafer chuck.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Yu-Chi LIN, Yi-Wei CHIU, Hung-Jui CHANG, Chin-Hsing LIN, Yu-Lun KE
  • Publication number: 20200043740
    Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.
    Type: Application
    Filed: October 7, 2019
    Publication date: February 6, 2020
    Inventors: Yu-Chi Lin, Chin-Hsing Lin, Hung Jui Chang, Yi-Wei Chiu, Yu-Wei Kuo, Yu Lun Ke
  • Patent number: 10529543
    Abstract: The present disclosure describes an exemplary etch process in a reactor that includes a shower head and an electrostatic chuck configured to receive a radio frequency (RF) power. The shower head includes a top plate and a bottom plate with one or more gas channels that receive incoming gases. The method can include (i) rotating the top plate or the bottom plate of the shower head to a first position to allow a gas to flow through the shower head; (ii) performing a surface modification cycle that includes: applying a negative direct current (DC) bias voltage to the shower head, applying an RF power signal to the wafer chuck; and (iii) performing an etching cycle that includes: removing the negative DC bias voltage from the shower head and lowering the RF power signal applied to the wafer chuck.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: January 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Chi Lin, Yi-Wei Chiu, Hung Jui Chang, Chin-Hsing Lin, Yu Lun Ke
  • Patent number: 10510516
    Abstract: A semiconductor manufacturing method and semiconductor manufacturing tool for performing the same are disclosed. The semiconductor manufacturing tool includes a plasma chamber, a mounting platform disposed within the plasma chamber, a focus ring disposed within the plasma chamber, and at least one actuator mechanically coupled to the focus ring and configured to move the focus ring vertically. The actuator is configured to move the focus ring vertically when a plasma is present in the plasma chamber.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chi Lin, Yi-Wei Chiu, Hung Jui Chang, Chin-Hsing Lin
  • Patent number: 10504738
    Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: December 10, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chi Lin, Chin-Hsing Lin, Hung Jui Chang, Yi-Wei Chiu, Yu-Wei Kuo, Yu-Lun Ke
  • Publication number: 20190333784
    Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.
    Type: Application
    Filed: April 30, 2018
    Publication date: October 31, 2019
    Inventors: Yu-Chi Lin, Chin-Hsing Lin, Hung Jui Chang, Yi-Wei Chiu, Yu-Wei Kuo, Yu-Lun Ke
  • Publication number: 20190148116
    Abstract: The present disclosure describes an exemplary etch process in a reactor that includes a shower head and an electrostatic chuck configured to receive a radio frequency (RF) power. The shower head includes a top plate and a bottom plate with one or more gas channels that receive incoming gases. The method can include (i) rotating the top plate or the bottom plate of the shower head to a first position to allow a gas to flow through the shower head; (ii) performing a surface modification cycle that includes: applying a negative direct current (DC) bias voltage to the shower head, applying an RF power signal to the wafer chuck; and (iii) performing an etching cycle that includes: removing the negative DC bias voltage from the shower head and lowering the RF power signal applied to the wafer chuck.
    Type: Application
    Filed: July 18, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Chi LIN, Yi-Wei Chiu, Hung Jui Chang, Chin-Hsing Lin, Yu Lun Ke
  • Publication number: 20190070224
    Abstract: A tissue repair material derived from fish skin and manufacturing method thereof is applied to provide the tissue repair material suitable for use as a patch, a cover, a carrier, a scaffold, an implant or a reagent in various tissues. The tissue repair material has collagens to improve the wounded tissue repair, and has particular characters for desired tissue repair application. Furthermore, so far the factors of the terrestrial animal transmitted disease (caused by virus) do not survive on the tissue repair material derived from fish skin.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 7, 2019
    Inventors: Horng-Ji Lai, Min-Chang Huang, Jui-Min Ho, Yun-Ting Hsu, Yu-Chi Lin, Ta-Wei Su, Kuan-Hao Huang, Yu-Wei Chang
  • Patent number: 10172891
    Abstract: A tissue repair material derived from fish skin and manufacturing method thereof is applied to provide the tissue repair material suitable for use as a patch, a cover, a carrier, a scaffold, an implant or a reagent in various tissues. The tissue repair material has collagens to improve the wounded tissue repair, and has particular characters for desired tissue repair application. Furthermore, so far the factors of the terrestrial animal transmitted disease (caused by virus) do not survive on the tissue repair material derived from fish skin.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: January 8, 2019
    Assignee: BODY ORGAN BIOMEDICAL CORP.
    Inventors: Horng-Ji Lai, Min-Chang Huang, Jui-Min Ho, Yun-Ting Hsu, Yu-Chi Lin, Ta-Wei Su, Kuan-Hao Huang, Yu-Wei Chang
  • Publication number: 20180151334
    Abstract: A semiconductor manufacturing method and semiconductor manufacturing tool for performing the same are disclosed. The semiconductor manufacturing tool includes a plasma chamber, a mounting platform disposed within the plasma chamber, a focus ring disposed within the plasma chamber, and at least one actuator mechanically coupled to the focus ring and configured to move the focus ring vertically. The actuator is configured to move the focus ring vertically when a plasma is present in the plasma chamber.
    Type: Application
    Filed: November 29, 2016
    Publication date: May 31, 2018
    Inventors: Yu-Chi Lin, Yi-Wei Chiu, Hung Jui Chang, Chin-Hsing Lin
  • Publication number: 20160287643
    Abstract: A tissue repair material derived from fish skin and manufacturing method thereof is applied to provide the tissue repair material suitable for use as a patch, a cover, a carrier, a scaffold, an implant or a reagent in various tissues. The tissue repair material has collagens to improve the wounded tissue repair, and has particular characters for desired tissue repair application. Furthermore, so far the factors of the terrestrial animal transmitted disease (caused by virus) do not survive on the tissue repair material derived from fish skin.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 6, 2016
    Inventors: Horng-Ji Lai, Min-Chang Huang, Jui-Min Ho, Yun-Ting Hsu, Yu-Chi Lin, Ta-Wei Su, Kuan-Hao Huang, Yu-Wei Chang
  • Publication number: 20160154432
    Abstract: A detachable electronic device includes an input module, a flexible connecting module and a display module. The input module has a signal input part. The flexible connecting module is connected to the input module. The display module is electrically connected to the input module, and has a display part and a slot located at a peripheral of the display part. The flexible connecting module is detachably assembled with the display module via the slot, and for supporting the display module. When the flexible connecting module is bent by an external force, the display module is driven to rotate relative to the input module, and a tilt angle of the display module is changed relative to the input module.
    Type: Application
    Filed: April 16, 2015
    Publication date: June 2, 2016
    Inventors: Yu-Chi Lin, Kuan-Yao Lee, Chun-Yuan Huang, Tse-Min Wang
  • Patent number: 9006105
    Abstract: A method of patterning a platinum layer includes the following steps. A substrate is provided. A platinum layer is formed on the substrate. An etching process is performed to pattern the platinum layer, wherein an etchant used in the etching process simultaneously includes at least a chloride-containing gas and at least a fluoride-containing gas.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: April 14, 2015
    Assignee: United Microelectronics Corp.
    Inventors: Hsin-Yi Lu, Yu-Chi Lin, Jeng-Ho Wang
  • Publication number: 20150037974
    Abstract: A method of patterning a platinum layer includes the following steps. A substrate is provided. A platinum layer is formed on the substrate. An etching process is performed to pattern the platinum layer, wherein an etchant used in the etching process simultaneously includes at least a chloride-containing gas and at least a fluoride-containing gas.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 5, 2015
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Yi Lu, Yu-Chi Lin, Jeng-Ho Wang
  • Publication number: 20140055354
    Abstract: A multi-mode interactive projection system includes a pointing device, an infrared capturing device, and a projection device. A timing generation module of the pointing device generates several timing signals, and controls the pointing device to execute one light emitting mode according to one timing signal. A light emitting module of the pointing device is controlled by the timing generation module, and generates infrared in a light emitting time according to the executed light emitting mode. In a detection time, the light emitting time corresponds to one light emitting mode. The infrared capturing device periodically captures the infrared. A projection module is controlled by a background image and a writing image outputted by a host device, and projects the image to screen. The host device determines the light emitting mode and continuously captures coordinate points of infrared by the infrared capturing device in the detection time.
    Type: Application
    Filed: December 14, 2012
    Publication date: February 27, 2014
    Applicant: EVEREST DISPLAY INC.
    Inventors: Hei-Tai HONG, Fu-Hsiung LEE, Yu-Chi LIN, Shih-Chieh LU
  • Publication number: 20130208406
    Abstract: An electronic device and its biaxial pivot, the biaxial pivot comprises a connecting element, a first coupling element, a second coupling element and an elastic element. The connecting element has a first shaft and a second shaft, the first shaft and the second shaft have different axes. The first coupling element is connected to the first shaft pivotally and the second coupling element is connected to the second shaft pivotally. Two ends of the elastic element are fixed at the first coupling element and the second coupling element respectively.
    Type: Application
    Filed: August 30, 2012
    Publication date: August 15, 2013
    Applicants: INVENTEC CORPORATION, INVENTEC (PUDONG) TECHNOLOGY CORPORATION
    Inventors: Yu-Chi Lin, Shih-Hsuan Wang