Patents by Inventor Yu-Chih HSIAO

Yu-Chih HSIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923630
    Abstract: An electrical connector assembly includes: a bracket; and at least one transmission assembly mounted to the bracket and including an internal printed circuit board (PCB), a board-mount connector connected to a first row of conductive pads disposed at a bottom end portion of the PCB, and a plug-in connector connected to a second row of conductive pads disposed at a front end portion of the PCB, wherein the PCB has a third row of conductive pads disposed at a rear end portion thereof.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: March 5, 2024
    Assignees: FUDING PRECISION INDUSTRY (ZHENGZHOU) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shih-Wei Hsiao, Yu-San Hsiao, Yen-Chih Chang, Yu-Ke Chen, Na Yang, Wei-Hua Zhang
  • Patent number: 11852679
    Abstract: A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: December 26, 2023
    Assignee: MPI CORPORATION
    Inventors: Shih-Ching Chen, Jun-Liang Lai, Shung-Bo Lin, Ta-Cheng Liao, Yu-Chih Hsiao, Kun-Han Hsieh
  • Patent number: 11253867
    Abstract: Dry nano-sizing equipment with fluid mobility effect dryly processes viewable fine-grained substances into a nano-sized dimension by high-pressure airflow resulted from a pressure-generating unit, as well as high-speed fluid and high mechanical momentum generated in a pressure cylinder by high-speed rotation of a booster impeller.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: February 22, 2022
    Inventors: Chih-Yuan Hsiao, Yu-Chih Hsiao
  • Publication number: 20210053070
    Abstract: Dry nano-sizing equipment with fluid mobility effect dryly processes viewable fine-grained substances into a nano-sized dimension by high-pressure airflow resulted from a pressure-generating unit, as well as high-speed fluid and high mechanical momentum generated in a pressure cylinder by high-speed rotation of a booster impeller.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 25, 2021
    Inventors: Chih-Yuan HSIAO, Yu-Chih HSIAO