Patents by Inventor Yu-Ching Fang

Yu-Ching Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED Packaging Structure Having Stacked Arrangement Of Protection Element And LED Chip
    Publication number: 20170207375
    Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.
    Type: Application
    Filed: March 31, 2017
    Publication date: July 20, 2017
    Inventors: Tsung-Lin Lu, Jen-Hsiung Lai, Yu-Ching Fang, Chih-Min Lin, I-Chun Hung
  • LED packaging structure having stacked arrangement of protection element and LED chip
    Patent number: 9646957
    Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: May 9, 2017
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Tsung-Lin Lu, Jen-Hsiung Lai, Yu-Ching Fang, Chih-Min Lin, I-Chun Hung
  • LED Packaging Structure
    Publication number: 20160204090
    Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 14, 2016
    Inventors: Tsung-Lin Lu, Jen-Hsiung Lai, Yu-Ching Fang, Chih-Min Lin, I-Chun Hung