Patents by Inventor Yu-Chou Lin
Yu-Chou Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240113187Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Jhu-Min Song, Ying-Chou Chen, Yi-Kai Ciou, Chien-Chih Chou, Fei-Yun Chen, Yu-Chang Jong, Chi-Te Lin
-
Patent number: 11914429Abstract: An electronic device includes a host, a display, a sliding plate, and a keyboard. The host has an operating surface. The display is pivoted to the host. The sliding plate is slidably disposed in the host, where the display is mechanically coupled to the sliding plate, and the sliding plate includes a plat portion and a recess portion that are arranged side by side. The keyboard is integrated to the host. The keyboard includes a key structure, where the key structure includes a key cap and a reciprocating element, and the key cap is exposed from the operating surface of the host. The reciprocating element is disposed between the key cap and the sliding plate and has a first end connected to the key cap and a second end contacting the sliding plate. The second end is located on a sliding path of the plat portion and the recess portion.Type: GrantFiled: March 9, 2023Date of Patent: February 27, 2024Assignee: Acer IncorporatedInventors: Hung-Chi Chen, Shun-Bin Chen, Huei-Ting Chuang, Yen-Chieh Chiu, Yu-Wen Lin, Yen-Chou Chueh, Po-Yi Lee
-
Patent number: 11474035Abstract: An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.Type: GrantFiled: September 28, 2020Date of Patent: October 18, 2022Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Teck-Chai Goh, Yu-Chou Lin, Yi Zhang
-
Patent number: 11437539Abstract: A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.Type: GrantFiled: September 30, 2020Date of Patent: September 6, 2022Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Chien-Hsiu Huang, Yu-Chou Lin, Teck-Chai Goh
-
Publication number: 20220099571Abstract: An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.Type: ApplicationFiled: September 28, 2020Publication date: March 31, 2022Inventors: TECK-CHAI GOH, YU-CHOU LIN, YI ZHANG
-
Publication number: 20220102576Abstract: A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.Type: ApplicationFiled: September 30, 2020Publication date: March 31, 2022Inventors: CHIEN-HSIU HUANG, YU-CHOU LIN, TECK-CHAI GOH
-
Patent number: 11049991Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.Type: GrantFiled: September 9, 2019Date of Patent: June 29, 2021Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Suresh Basoor Nijaguna, Guo-Jun Xu, Kun-Lung Lee, Sin-Heng Lim, Teck-Chai Goh, Yu-Chou Lin
-
Publication number: 20210074874Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.Type: ApplicationFiled: September 9, 2019Publication date: March 11, 2021Inventors: Suresh Basoor Nijaguna, GUO-JUN XU, KUN-LUNG LEE, SIN-HENG LIM, TECK-CHAI GOH, YU-CHOU LIN
-
Patent number: 9705052Abstract: An LED package structure includes a substrate, a circuit layer and an insulating layer both disposed on the substrate, a light-emitting unit, and a reflective housing integrally formed with the insulating layer. The light-emitting unit includes an LED chip and a fluorescent body encapsulating the LED chip. The light-emitting unit is mounted on the insulating layer and the circuit layer. The fluorescent body of the light emitting unit is spaced apart from the circuit layer with a gap in a range of 3˜10 ?m. The reflective housing is formed on the insulating layer and the circuit layer and is further filled within the gap. A top plane of the reflective housing arranged away from the substrate is lower than or equal to that of the light-emitting unit, and a distance between the two top planes is in a range of 0˜30 ?m.Type: GrantFiled: October 28, 2016Date of Patent: July 11, 2017Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Yu-Chou Lin, Chen-Hsiu Lin, Chih-Yuan Chen
-
Patent number: 6235805Abstract: A process for producing static-free synthetic rubber includes mixing acrylonitrile-butadiene, Anti-static agent, Activated zinc oxide, Zinc stearate, HI-sil (EPDM), Plasticizer, and Stearic Acid prior to a kneading process at 140 degrees Celsius for 8 to 12 minutes. (DCP) Peroxides and Blowing agents are added to the kneeing mixture two minutes before the end of the kneeding process. After the kneeding process, the resultant mixture is fed through rollers to form a sheet of the synthetic rubber. The sheet is then cut into appropriately-sized pieces and put into a mold, where the pieces are subjected to high pressure and a temperature of 160 degrees Celsius. The pieces are then left to cool, and then be used for articles such as static-free footwear.Type: GrantFiled: August 22, 2000Date of Patent: May 22, 2001Inventors: Kuo-Hsiang Chang, Yu-Chou Lin