Patents by Inventor Yu-Ding Chen

Yu-Ding Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 8342055
    Abstract: This invention provides a precise positioning platform by using of toggle type principle, wherein the positioning platform can be single toggle type, double toggle type, or combination with multi-link to enhance positioning platform precision.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: January 1, 2013
    Assignee: Chung Yuan Christian University
    Inventors: Shih-Ming Wang, Yu-Ding Chen
  • Publication number: 20110259139
    Abstract: This invention provides a precise positioning platform by using of toggle type principle, wherein the positioning platform can be single toggle type, double toggle type, or combination with multi-link to enhance positioning platform precision.
    Type: Application
    Filed: April 25, 2011
    Publication date: October 27, 2011
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: SHIH-MING WANG, Yu-Ding Chen