Abstract: A vacuum plate for a fabricating apparatus of a semiconductor device, the vacuum plate includes: a first vacuum panel having a plurality of exhaust holes, the plurality of exhaust holes having same area and same distance from a center of the first vacuum panel, the plurality of exhaust holes being symmetrical and spaced apart from each other; and a second vacuum panel having a sidewall, a pumping hole and an air-load block, the sidewall being vertically protruded along an edge of the second vacuum panel, the air-load block being vertically protruded and symmetrical, a bottom surface of the first vacuum panel contacting a top surface of the sidewall and a top surface of the air-load block, thereby the first and second vacuum panels being combined.

Abstract: The present invention provides a thin film deposition apparatus that prevent a wafer from the thermal budget so as to form a thin film without any damages. The thin film deposition apparatus includes a chamber where a wafer is loaded; a gas supplier containing a plurality of gases, the gas supplier connected with the chamber through at least a gas inflow pipe so as to supplying the plurality of gases into the chamber; an airtight reaction room in the chamber where the plurality of gases are reaction with one another so as to form a thin film on the wafer; and a gas pre-treatment device in the gas supplier, the gas pre-treatment device thermal-treating at least one of the plurality of gases at a temperature in the range of more than 300 to less than 2000 degrees centigrade; wherein the gas pre-treatment device is connected to at least a connecting pipe.

Abstract: A vacuum plate for a fabricating apparatus of a semiconductor device, the vacuum plate includes: a first vacuum panel having a plurality of exhaust holes, the plurality of exhaust holes having same area and same distance from a center of the first vacuum panel, the plurality of exhaust holes being symmetrical and spaced apart from each other; and a second vacuum panel having a sidewall, a pumping hole and an air-load block, the sidewall being vertically protruded along an edge of the second vacuum panel, the air-load block being vertically protruded and symmetrical, a bottom surface of the first vacuum panel contacting a top surface of the sidewall and a top surface of the air-load block, thereby the first and second vacuum panels being combined.