Patents by Inventor Yu-feng Chen
Yu-feng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240161818Abstract: The invention provides a layout pattern of static random access memory (SRAM), which at least comprises a plurality of gate structures located on a substrate and spanning the plurality of fin structures to form a plurality of transistors distributed on the substrate, wherein the plurality of transistors comprise two pull-up transistors (PU), two pull-down transistors (PD) to form a latch circuit, and two access transistors (PG) connected to the latch circuit. In each SRAM memory cell, the fin structure included in the pull-up transistor (PU) is defined as a PU fin structure, the fin structure included in the pull-down transistor (PD) is defined as a PD fin structure, and the fin structure included in the access transistor (PG) is defined as a PG fin structure, wherein a width of the PD fin structure is wider than a width of the PG fin structure.Type: ApplicationFiled: November 30, 2022Publication date: May 16, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Hsien Huang, Yu-Tse Kuo, Shu-Ru Wang, Li-Ping Huang, Yu-Fang Chen, Chun-Yen Tseng, Tzu-Feng Chang, Chun-Chieh Chang
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Patent number: 11984419Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.Type: GrantFiled: July 26, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
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Publication number: 20240136344Abstract: A display device includes a substrate, at least one light emitting unit bound on the substrate, a transparency controllable unit disposed on the substrate, and an integrated circuit unit overlapped with the substrate. The integrated circuit unit includes a semiconducting structure and a conductive structure overlapped with the semiconducting structure. The integrated circuit unit is electrically connected to the at least one light emitting unit and the transparency controllable unit.Type: ApplicationFiled: September 17, 2023Publication date: April 25, 2024Applicant: InnoLux CorporationInventors: Jia-Yuan CHEN, Yu-Chia HUANG, Tsung-Han TSAI, Kuan-Feng LEE
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Patent number: 11954259Abstract: Glasses with gesture recognition function include a glasses frame and a gesture recognition system. The gesture recognition system is disposed on the glasses frame and configured to detect hand gestures in front of the glasses thereby generating a control command. The gesture recognition system transmits the control command to an electronic device to correspondingly control the electronic device.Type: GrantFiled: March 8, 2021Date of Patent: April 9, 2024Assignee: PIXART IMAGING INC.Inventors: Horng-Goung Lai, En-Feng Hsu, Meng-Huan Hsieh, Yu-Hao Huang, Nien-Tse Chen
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Patent number: 11942358Abstract: The present disclosure describes a method of forming low thermal budget dielectrics in semiconductor devices. The method includes forming, on a substrate, first and second fin structures with an opening in between, filling the opening with a flowable isolation material, treating the flowable isolation material with a plasma, and removing a portion of the plasma-treated flowable isolation material between the first and second fin structures.Type: GrantFiled: March 12, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mrunal Abhijith Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, De-Yang Chiou, Yu-Yun Peng, Keng-Chu Lin
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Publication number: 20240096297Abstract: In some examples, a controller of a wearable device causes display by the wearable device of a test image, and adjusts a color property of the displayed test image. In response to an input provided by a user responsive to the displayed test image as the color property is adjusted, the controller determines a distribution of color wavelengths for an eye of the user, and detects a color vision deficiency of the user based on the determined distribution of color wavelengths. The controller provides control information to control a display device of the wearable device to compensate for the color vision deficiency.Type: ApplicationFiled: September 15, 2022Publication date: March 21, 2024Inventors: Hsiang-Ta Ke, Yu-Ren Chen, Chun-Feng Li
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Publication number: 20240097038Abstract: A semiconductor device, including a substrate, a first source/drain region, a second source/drain region, and a gate structure, is provided. The substrate has an extra body portion and a fin protruding from a top surface of the substrate, wherein the fin spans the extra body portion. The first source/drain region and the second source/drain region are in the fin. The gate structure spans the fin, is located above the extra body portion, and is located between the first source/drain region and the second source/drain region.Type: ApplicationFiled: October 13, 2022Publication date: March 21, 2024Applicant: United Microelectronics Corp.Inventors: Yi Chuen Eng, Tzu-Feng Chang, Teng-Chuan Hu, Yi-Wen Chen, Yu-Hsiang Lin
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Publication number: 20240087960Abstract: A method may include forming a mask layer on top of a first dielectric layer formed on a first source/drain and a second source/drain, and creating an opening in the mask layer and the first dielectric layer that exposes portions of the first source/drain and the second source/drain. The method may include filling the opening with a metal layer that covers the exposed portions of the first source/drain and the second source/drain, and forming a gap in the metal layer to create a first metal contact and a second metal contact. The first metal contact may electrically couple to the first source/drain and the second metal contact may electrically couple to the second source/drain. The gap may separate the first metal contact from the second metal contact by less than nineteen nanometers.Type: ApplicationFiled: November 13, 2023Publication date: March 14, 2024Inventors: Yu-Lien HUANG, Ching-Feng FU, Huan-Just LIN, Fu-Sheng LI, Tsai-Jung HO, Bor Chiuan HSIEH, Guan-Xuan CHEN, Guan-Ren WANG
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Patent number: 11925457Abstract: A device for encouraging and guiding a spirometer user includes a housing, a main valve, a visual assembly, and a sound making assembly. The housing has a guiding channel, a first outlet channel, a second outlet channel, and an inlet channel. The main valve is disposed in a housing communicating with the guiding channel, the first outlet channel, the second outlet channel or the inlet channel and configured to regulate or control fluid flowing paths. The visual assembly includes a check valve in the second outlet channel, and at least one movable member. The sound making assembly includes a check valve and a sound maker. So, it can generate the visual and sound encouraging effects for learning how to use a spirometer correctly.Type: GrantFiled: February 17, 2021Date of Patent: March 12, 2024Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, CENTRAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Ming-Feng Wu, Yu-Hsuan Chen, Kuo-Chih Su, Chun-Hsiang Wang
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Publication number: 20240069304Abstract: A voice coil motor held immobile by magnetic attraction when not in use for photography purposes includes a base, a magnet fixed thereto, a carrier, a magnetic member, and a coil. The magnetic member is fixed to the carrier and is attracted by a permanent magnetic field (first MF) of the magnet on the base. The coil is fixed to the carrier and the magnetic member. When the voice coil motor is powered on, the coil generates a second magnetic field (second MF) opposing the first MF. The second MF reduces or eliminates the attractive force of the first MF of the magnet, to separate the carrier and its fittings and allow them to work freely. A lens module and an electronic device are further provided.Type: ApplicationFiled: September 30, 2022Publication date: February 29, 2024Inventors: YU-SHUAI LI, SHIN-WEN CHEN, KUN LI, JIAN-CHAO SONG, WU-TONG WANG, DING FENG
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Patent number: 11915064Abstract: The disclosure relates to processing application programming interface (API) requests. Embodiments include receiving, at an API wrapper, from a first caller, a first call to an API and sending the first call to the API. Embodiments include receiving, by the API wrapper, from one or more second callers, a second one or more calls to the API prior to receiving a response from the API to the first call. Embodiments include receiving, by the API wrapper, the response from the API to the first call and responding to the first call from the first caller with the response from the API to the first call. Embodiments include responding, by the API wrapper, to the second one or more calls from the one or more second callers with the response from the API to the first call without sending the second one or more calls to the API.Type: GrantFiled: February 17, 2022Date of Patent: February 27, 2024Assignee: VMware, Inc.Inventors: Yu Wu, Jin Feng, Sifan Liu, Zhiliang Zhang, Kai-chia Chen
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Publication number: 20230386975Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.Type: ApplicationFiled: August 8, 2023Publication date: November 30, 2023Inventors: Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen
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Publication number: 20230360426Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.Type: ApplicationFiled: July 7, 2023Publication date: November 9, 2023Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
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Publication number: 20230343133Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.Type: ApplicationFiled: June 28, 2023Publication date: October 26, 2023Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
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Publication number: 20230300510Abstract: An intermediary device and a wearable bridge are provided. The wearable bridge is detachably assembled with two wireless earbuds, and includes a headband, two ear cups respectively connected to two opposite ends of the headband, and a wireless module. Each ear cup includes an assembling slot and an electrical connector that is arranged in the assembling slot. Each assembling slot can be assembled with one of the two wireless earbuds so as to enable the corresponding electrical connector to be structurally and electrically connected to the one of the two wireless earbuds. The wireless module is electrically coupled to the electrical connector of each of the two ear cups, and the wireless module is configured to transmit sound signals from an external apparatus to the electrical connectors of the two ear cups, so that the two wireless earbuds are allowed to synchronously play.Type: ApplicationFiled: March 16, 2022Publication date: September 21, 2023Inventor: YU-FENG CHEN
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Patent number: 11741737Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.Type: GrantFiled: May 14, 2021Date of Patent: August 29, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
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Publication number: 20230262792Abstract: There is provided a wireless device including an earphone set and a charging cradle. The charging cradle is used as means for charging the earphone set. The charging cradle further records connection information of multiple external devices that have been BT connected to the charging cradle. The earphone set receives a connection command from the charging cradle to accordingly form an audio connection to one of the multiple external devices. The charging cradle is further used as a communication medium between the multiple external devices.Type: ApplicationFiled: February 16, 2022Publication date: August 17, 2023Inventors: Ping-Shun ZEUNG, Chih-Wei SUNG, Yu-Feng CHEN
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Patent number: 11727714Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.Type: GrantFiled: November 9, 2021Date of Patent: August 15, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu