Abstract: The present disclosure provides an exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas. The exhaust system includes: a main exhaust pipe positioned above the semiconductor manufacturing equipment and having a top surface and a bottom surface extending parallel to the top surface; a first branch pipe including an upstream end coupled to a source of a gas mixture and a downstream end connected to the main exhaust pipe through the top surface; a second branch pipe including an upstream end and a downstream end connected to the main exhaust pipe through the bottom surface; and a detector configured to detect presence of the hazardous gas in the second branch pipe.

Abstract: A memory device for CIM has a memory array including a plurality of memory cells arranged in an array of rows and columns. The memory cells have a first group of memory cells and a second group of memory cells. Each row of the array has a corresponding word line, with each memory cell of a row of the array coupled to the corresponding word line. Each column of the array has a corresponding bit line, with each memory cell of a column of the array coupled to the corresponding bit line. A control circuit is configured to select the first group of memory cells or the second group of memory cells in response to a group enable signal.

Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.

Abstract: In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode layer over the first IMD layer; forming a magnetic tunnel junction (MTJ) film stack over the bottom electrode layer; forming a first top electrode layer over the MTJ film stack; forming a protective mask covering a first region of the first top electrode layer, a second region of the first top electrode layer being uncovered by the protective mask; forming a second top electrode layer over the protective mask and the first top electrode layer; and patterning the second top electrode layer, the first top electrode layer, the MTJ film stack, the bottom electrode layer, and the first IMD layer with an ion beam etching (IBE) process to form a MRAM cell, where the protective mask is etched during the IBE process.

Abstract: An electrostatic discharge (ESD) circuit includes a first ESD detection circuit, a first discharging circuit and a first ESD assist circuit. The first ESD detection circuit is coupled between a first node having a first voltage and a second node having a second voltage. The first discharging circuit includes a first transistor. The first transistor has a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to the first ESD detection circuit by a third node. The first drain is coupled to the first node. The first source and the first body terminal are coupled together at the second node. The first ESD assist circuit is coupled between the second and third node, and configured to clamp a third voltage of the third node at the second voltage during an ESD event at the first or second node.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor wafer and a test structure. The semiconductor wafer has a substrate having a scribe line area, a first die area and a second die area. The first die area and the second die area are separated by the scribe line area extending along a first direction. The test structure is disposed in the scribe line area. The test structure includes a test device and a first test pad. The test device has a physical characteristic similar to a semiconductor device fabricated in the first die area or the second die area. The first test pad is electrically connected to the test device. A first distance between the first test pad and the first die area gradually increases from a center region to a peripheral region of the first test pad in the first direction.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.

Abstract: A method includes forming Magnetic Tunnel Junction (MTJ) stack layers, which includes depositing a bottom electrode layer; depositing a bottom magnetic electrode layer over the bottom electrode layer; depositing a tunnel barrier layer over the bottom magnetic electrode layer; depositing a top magnetic electrode layer over the tunnel barrier layer; and depositing a top electrode layer over the top magnetic electrode layer. The method further includes patterning the MTJ stack layers to form a MTJ; and performing a passivation process on a sidewall of the MTJ to form a protection layer. The passivation process includes reacting sidewall surface portions of the MTJ with a process gas comprising elements selected from the group consisting of oxygen, nitrogen, carbon, and combinations thereof.

Abstract: A package structure includes a first redistribution layer, a semiconductor die, and through vias. The first redistribution layer includes dielectric layers, first conductive patterns, and second conductive patterns. The dielectric layers are located in a core region and a peripheral region of the first redistribution layer. The first conductive patterns are embedded in the dielectric layers in the core region, wherein the first conductive patterns are arranged in the core region with a pattern density that gradually increases or decreases from a center of the core region to a boundary of the core region. The second conductive patterns are embedded in the dielectric layers in the peripheral region. The semiconductor die is disposed on the core region over the first conductive patterns. The through vias are disposed on the peripheral region and electrically connected to the second conductive patterns.

Abstract: A system for managing a report comprises a generating module, for receiving data of a first user and for generating a first report according to the data; an associating module, coupled to the generating module, for determine a first content of a second report according an association between the first report and the second report; and a notifying module, coupled to the associating module, for notifying a managing result of the first report and the second report to the first user and a second user, wherein the second user is associated with a project corresponding to the first report.

Abstract: A negative coupling structure applied in a dielectric waveguide filter includes an elongated blind hole formed on a first surface of a dielectric body for building the negative coupling structure, and tuning holes formed on the first surface or a second surface of the dielectric body. A first coupling portion configured to be corresponsive to a bottom wall of the elongated blind hole, a second coupling portion configured to be corresponsive to a side wall of the elongated blind hole, and a common coupling portion connected between the bottom wall and the side wall are provided to define a negative coupling structure in the dielectric body, so as to provide both capacitive coupling and inductive coupling and a negative coupling and achieve the effects of reducing the weight and volume of the dielectric waveguide filter and providing good performance, simple structure and easy manufacture.

Abstract: A biosensor structure is provided, which includes a substrate, a center conductor, a first ground conductor, a second ground conductor and a protection layer. The center conductor is disposed on the substrate and defines a detection area at the central area thereof for detection of cells or biomolecules. The first ground conductor is disposed on the substrate and is located opposite to a side of the center conductor. The second ground conductor is disposed on the substrate and is located opposite to another side of the center conductor. The protection layer is disposed on the substrate, the center conductor, the first ground conductor and the second ground conductor. In a thickness direction of the biosensor structure, the protection layer is disposed without substantially overlapping the detection area.

Abstract: Disclosure is a biosensor chip having precise count function comprising: a substrate, a plurality of ground wire waveguide layers, a signal waveguide layer and a protective layer. Wherein, the plurality of ground wire waveguide layers are located on two sides of the substrate, the signal waveguide layer is located on the substrate and between the plurality of ground wire waveguide layers, wherein the signal waveguide layer has a recess which forms a cell sensing region; and the protective layer covers a portion of the ground wire waveguide layers and a portion of the signal waveguide layer to expose the recess.

Abstract: A biosensor chip with nano-structures. The biosensor chip includes a RF biosensor, comprising an isolated substrate; a ground plane; a filtering circuit; at least one cell detection area with nano-structures and a protection layer. The RF biosensor can detect the existence of the cancer cells, high frequency biological effects and the cells relationship between transfers by noninvasive method. The RF biosensor according to the invention can provide high accuracy and sensitivity in cancer cells detection.

Abstract: A biosensor chip with nano-structures. The biosensor chip includes a RF biosensor, comprising an isolated substrate; a ground plane; a filtering circuit; at least one cell detection area with nano-structures and a protection layer. The RF biosensor can detect the existence of the cancer cells, high frequency biological effects and the cells relationship between transfers by noninvasive method. The RF biosensor according to the invention can provide high accuracy and sensitivity in cancer cells detection.

Abstract: An improved structure portable strapping machine in which a band is articulated via a strap pulling device, a swinging device, and a cutting device and then bound tight by a friction welding means to facilitate strapping objects of various shapes and dimensions that are difficult to ship. As such, utilization of the improved structure portable strapping machine of the present invention is easy, convenient, rapid, reliable, and safe.

Abstract: The invention herein relates to an improved tire structure comprised of a plurality of thin steel plates crisscrossingly arranged in the thick portion of a tire surface and an assembly of cover tire installed around the surface of said tire; the plurality of up and down crisscrossingly arranged thin steel plates form a shield along the circumference of tire that removes the worry of the tire being punctured by sharp objects on the roads when the vehicle travels, thus enhancing driving safety; the cover tire can be replaced after it is worn out without the need to change the whole tire, thus effectively reducing the consumption of rubber for tire production that makes the invention herein both economical and environmentally friendly.

Abstract: The invention herein relates to a composite tire comprised of a rubber tire mounted over a rim which is covered externally by an assembly of cover tire having the following features: the cover tire is internally lined with a steel jacket that totally removes the risk of puncture; said cover tire is supported by the inflated tire and in contact with ground surface in rubber material that allows its usage by vehicles completely barrier-free; in addition, said cover tire uses significantly less rubber than regular tires and is replaceable anytime after wear without the need to change the entire tire. It not only effectively lowers the consumption of rubber, thus is both economical and environmentally friendly.

Abstract: An improved clamp device structure for the clinching and conveyance of unusually shaped objects is provided and includes support rods equipped with steel clamp bars, of which the odd-numbered elements are fixed and the even-numbered elements are capable of leftward and rightward movement, or the even-numbered elements are fixed and the odd-numbered elements are capable of leftward and rightward movement. Installed at the upper extent of the support rods is a relief bar capable of the upward and downward movement that facilitates the clinching and conveyance of the unusually shaped objects. Since the steel clamp bars on the support rods are arrayed in a close configuration, the clinching range of the array is sufficient to accommodate a number of working objects and thereby enable the steel clamp bars to positively hold objects for conveyance.

Abstract: The invention herein relates to a kind of slug production device for brick-making machines, specifically referring to a kind of slug production device that is mainly comprised of a raw brick mixture filler trough and a vacuum trough, below which are the the parallel and horizontal members of two pressure tubes and two forming tubes, and positioned at the rear of the two pressure tubes and the two forming tubes are a pair of pressure mechanisms and, furthermore, at the bottom section of the raw brick mixture filler trough and the vacuum trough is a swing-type aggregate crushing mechanism such that after the raw brick mixture is loaded into the filler trough, the raw brick mixture is conveyed precisely into the pressure tubes and the pressure mechanism pistons at the rear of the two pressure tubes operate in a reciprocal movement to convey the raw brick material slugs into the vacuum trough then the raw brick material aggregate conveyed into the vacuum trough are guided into the forming tubes by the pressure me