Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.

Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A front light module applied to full lamination includes a display, a front light guide plate, a light-emitting unit, a transparent medium, and a cover layer. The front light guide plate is located over the display and includes a micro-structure. The micro-structure is recessed from an upper surface of the front light guide plate. The light-emitting unit is adjacent to the front light guide plate. The transparent medium is located over the front light guide plate. A space is located between the front light guide plate and the transparent medium. The cover layer is located over the transparent medium.

Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.

Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.

Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.

Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.

Abstract: A method for detecting channels of a host to which hard disk controllers belong is used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.

Abstract: A hard disk device capable of detecting channels of a host to which hard disk controllers belong and are used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.

Abstract: A method for detecting channels of a host to which hard disk controllers belong is used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.

Abstract: A hard disk device capable of detecting channels of a host to which hard disk controllers belong and are used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.