Patents by Inventor Yu Hsiang Hsieh

Yu Hsiang Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194999
    Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.
    Type: Application
    Filed: February 21, 2024
    Publication date: June 13, 2024
    Inventors: CHEN-TING KAO, CHI-CHENG WEN, YU-SHENG CHANG, CHIH-CHENG LEE, CHIUNG-HSIANG WU, SHENG-LI YEN, YU-CHENG ZHANG, CHANG-JU HSIEH, CHEN CHAO
  • Patent number: 11942652
    Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: March 26, 2024
    Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chen-Ting Kao, Chi-Cheng Wen, Yu-Sheng Chang, Chih-Cheng Lee, Chiung-Hsiang Wu, Sheng-Li Yen, Yu-Cheng Zhang, Chang-Ju Hsieh, Chen Chao
  • Publication number: 20240085398
    Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Kun-Lung Chen, Tung-Tsun Chen, Cheng-Hsiang Hsieh, Yu-Jie Huang, Jui-Cheng Huang
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11808964
    Abstract: A front light module applied to full lamination includes a display, a front light guide plate, a light-emitting unit, a transparent medium, and a cover layer. The front light guide plate is located over the display and includes a micro-structure. The micro-structure is recessed from an upper surface of the front light guide plate. The light-emitting unit is adjacent to the front light guide plate. The transparent medium is located over the front light guide plate. A space is located between the front light guide plate and the transparent medium. The cover layer is located over the transparent medium.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: November 7, 2023
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yu-Shan Shen, Yu-Hsiang Hsieh, Chien-Ming Chu, Hui-Ying Chiang
  • Patent number: 11527491
    Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: December 13, 2022
    Assignee: Siliconware Precision Industries Co., Ltd
    Inventors: Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
  • Publication number: 20210296261
    Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Inventors: Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
  • Patent number: 11056442
    Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: July 6, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
  • Publication number: 20180254250
    Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
    Type: Application
    Filed: June 15, 2017
    Publication date: September 6, 2018
    Inventors: Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
  • Patent number: 6910083
    Abstract: A method for detecting channels of a host to which hard disk controllers belong is used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: June 21, 2005
    Assignee: Promise Technology, Inc.
    Inventors: Ching Hao Hsu, Yu Hsiang Hsieh
  • Patent number: 6854027
    Abstract: A hard disk device capable of detecting channels of a host to which hard disk controllers belong and are used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: February 8, 2005
    Assignee: Promise Technology, Inc.
    Inventors: Ching Hao Hsu, Yu Hsiang Hsieh
  • Publication number: 20040267975
    Abstract: A method for detecting channels of a host to which hard disk controllers belong is used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.
    Type: Application
    Filed: June 26, 2003
    Publication date: December 30, 2004
    Inventors: Ching Hao Hsu, Yu Hsiang Hsieh
  • Publication number: 20040267976
    Abstract: A hard disk device capable of detecting channels of a host to which hard disk controllers belong and are used to detect the connection relations between several channels of a host and several removable hard disk cases in the hard disk device. Each of the removable hard disk cases has a current sensor for detecting the current variation of the hard disk, transforming the variation into a voltage signal, and transmitting the voltage signal to a enclosure-controller. The enclosure-controller then converts the voltage signal into a flag. The host can read the flag via a serial bus to build the corresponding relation between the channel connected to the hard disk and the enclosure-controller. The effects of easy use and friendly operation can thus be accomplished.
    Type: Application
    Filed: June 26, 2003
    Publication date: December 30, 2004
    Inventors: Ching Hao Hsu, Yu Hsiang Hsieh