Patents by Inventor Yu-Hsiang Jiang

Yu-Hsiang Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130112238
    Abstract: A condensing lens includes a lens body and a prism structure. The lens body has a first surface and a second surface opposite to each other. The prism structure is disposed on the second surface of the lens body and has a plurality of annular prism units. The prism structure has at least two focuses in accordance with the annular prism units, and the focuses are distributed on a plane which is parallel to the first surface of the lens body.
    Type: Application
    Filed: December 22, 2011
    Publication date: May 9, 2013
    Inventors: Ming-Hsiung LAI, Yu-Hsiang Jiang, You-Chi Chen
  • Publication number: 20130112386
    Abstract: A heat dissipating device includes a base and a plurality of heat dissipating layers. The base has a first surface and a second surface which are opposite to each other. The heat dissipating layers are formed on the first surface of the base in sequence. Each heat dissipating layer has at least one heat dissipating structure, which includes a heat storage/dissipation area and a heat conductive area. The heat storage/dissipation area surrounds the heat conductive area, and a gap is configured between the heat storage/dissipation area and the heat conductive area. The heat storage/dissipation areas of two adjacent heat dissipating layers contact with each other, while the heat conductive areas of two adjacent heat dissipating layers contact with each other.
    Type: Application
    Filed: December 22, 2011
    Publication date: May 9, 2013
    Inventors: Ming-Hsiung LAI, Yu-Hsiang Jiang, You-Chi Chen
  • Publication number: 20130114209
    Abstract: An electronic apparatus includes a heat dissipating module and an electronic device. The heat dissipating module includes a base and a plurality of heat dissipating layers. The heat dissipating layers are formed on a surface of the base in sequence. Each heat dissipation layer has at least one heat dissipating structure, and the heat dissipation structure has a heat storage/dissipation area and a heat conductive area. The heat storage/dissipation area surrounds the heat conductive area, and a gap is configured between the heat storage/dissipation area and the heat conductive area. The electronic device is attached to the heat dissipating module. A heat management device is also disclosed.
    Type: Application
    Filed: December 22, 2011
    Publication date: May 9, 2013
    Inventors: Ming-Hsiung LAI, Yu-Hsiang Jiang, You-Chi Chen