Patents by Inventor Yu-Hsien Wu
Yu-Hsien Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240194591Abstract: A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.Type: ApplicationFiled: February 20, 2024Publication date: June 13, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
-
Publication number: 20240176094Abstract: An optical system is provided, including a first module configured to hold a first optical member. The first module includes a first movable portion, a first fixed portion, and a first driving assembly. The first movable portion is configured to connect the first optical member, and is movable relative to the fixed portion. The first driving assembly is configured to drive the first movable portion to move relative to the fixed portion.Type: ApplicationFiled: November 28, 2023Publication date: May 30, 2024Inventors: Chia-Che WU, Chao-Chang HU, Yung-Hsien YEH, Chih-Wei WENG, Chih-Wen CHIANG, Yu-Chiao LO, Sin-Jhong SONG
-
Publication number: 20240176398Abstract: A carrier for solid state devices includes a plurality of panels, at least one gate, and an addition. The plurality of panels includes a first panel, a second panel, and a third panel. The at least one gate is attached to the second panel and the third panel. The at least one gate is configured to be in one of a first position or a second position. When the at least one gate is in the first position, an opening for receiving solid state devices is at least partially occluded to a first width that is smaller than a length of one of the solid state devices. When the at least one gate is in the second position, the opening for receiving the solid state devices is increased to a second width that is larger than the length of the one of the solid state devices.Type: ApplicationFiled: November 29, 2022Publication date: May 30, 2024Inventors: Yaw-Tzorng TSORNG, Tung-Hsien WU, Chin-Ho KUO, Yu-Hsuan CHEN
-
Publication number: 20240176159Abstract: An optical system that includes a first module is provided. The first module includes a first movable portion, a first fixed portion, and a first driving assembly. The first movable portion is configured to connect the first optical member, and is movable relative to the first fixed portion. The first driving assembly is configured to drive the first movable portion to move relative to the first fixed portion.Type: ApplicationFiled: November 28, 2023Publication date: May 30, 2024Inventors: Chia-Che WU, Chao-Chang HU, Yung-Hsien YEH, Chih-Wei WENG, Chih-Wen CHIANG, Yu-Chiao LO, Sin-Jhong SONG
-
Publication number: 20240172374Abstract: A bracket module and a computing device including the bracket module are disclosed. The bracket module includes a housing structure. The housing structure includes a plurality of slots. Each slot is configured to accept a device inserted therein. The housing structure is configured for attachment in a chassis of the computing device. The bracket module further includes a tray structure. The tray structure includes a fixed end connected to the housing structure and a free end opposite from the fixed end. The tray structure is configured to rotate relative to the housing structure about the fixed end. The bracket module further includes at least one fastener configured to engage the tray structure with the housing structure in an open position.Type: ApplicationFiled: November 21, 2022Publication date: May 23, 2024Inventors: Yaw-Tzorng TSORNG, Tung-Hsien WU, Yu-Ying TSENG, Hsiang-Pu NI
-
Patent number: 11990182Abstract: An operation method for a memory device is provided. The memory device includes a two-terminal selector and a resistance variable storage element coupled to the two-terminal selector. The method includes providing a voltage pulse to the memory device. A voltage applied across the two-terminal selector during a falling part of the voltage pulse falls below a holding voltage of the two-terminal selector. A voltage falling rate of the falling part at which the voltage applied across the two-terminal selector reaches the holding voltage is raised for reducing threshold voltage drift of the two-terminal selector.Type: GrantFiled: January 18, 2022Date of Patent: May 21, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hengyuan Lee, Cheng-Hsien Wu, Yu-Sheng Chen, Elia Ambrosi, Chien-Min Lee, Xinyu Bao
-
Publication number: 20240155798Abstract: A carrier for different form factors for insertion in a slot of a computing device is disclosed. The different form factors have different thicknesses defined by the E1.S specification. The carrier includes a base holding a first type of form factor. A bezel is configurable for insertion in a slot for a device of the first type of form factor. The bezel has an attachment surface. The base is attachable to the attachment surface of the bezel. A second type of form factor is also attachable to the attachment surface of the bezel. A cover encloses the first type of form factor when joined to the base. The base and cover are discarded when the second type of form factor is attached to the bezel. The attached bezel and second type of form factor may also be inserted in the slot.Type: ApplicationFiled: December 14, 2022Publication date: May 9, 2024Inventors: Yaw-Tzorng TSORNG, Tung-Hsien WU, Yu-Ying TSENG, Wei-Jie CHEN
-
Publication number: 20240147711Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Inventors: PERNG-FEI YUH, YIH WANG, MENG-SHENG CHANG, JUI-CHE TSAI, KU-FENG LIN, YU-WEI LIN, KEH-JENG CHANG, CHANSYUN DAVID YANG, SHAO-TING WU, SHAO-YU CHOU, PHILEX MING-YAN FAN, YOSHITAKA YAMAUCHI, TZU-HSIEN YANG
-
Publication number: 20240128876Abstract: A switching control circuit for use in controlling a resonant flyback power converter generates a first driving signal and a second driving signal. The first driving signal is configured to turn on the first transistor to generate a first current to magnetize a transformer and charge a resonant capacitor. The transformer and charge a resonant capacitor are connected in series. The second driving signal is configured to turn on the second transistor to generate a second current to discharge the resonant capacitor. During a power-on period of the resonant flyback power converter, the second driving signal includes a plurality of short-pulses configured to turn on the second transistor for discharging the resonant capacitor. A pulse-width of the short-pulses of the second driving signal is short to an extent that the second current does not exceed a current limit threshold.Type: ApplicationFiled: June 15, 2023Publication date: April 18, 2024Inventors: Yu-Chang Chen, Ta-Yung Yang, Kun-Yu Lin, Fu-Ciao Syu, Chia-Hsien Yang, Hsin-Yi Wu
-
Patent number: 11946771Abstract: An aerial vehicle including a body, a first ranging device, a second ranging device and a controller is provided. The first ranging device is disposed on the body and is configured to detect a first distance between the first ranging device and the reflector. The second ranging device is disposed on the body and is configured to detect a second distance between the second ranging device and the reflector. The controller is configured to obtain an included angle between a direction of the body and the reflector according to the first distance and the second distance.Type: GrantFiled: April 1, 2020Date of Patent: April 2, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yuan-Chu Tai, Chung-Hsien Wu, Yu-Kai Wang
-
Patent number: 11943935Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.Type: GrantFiled: September 26, 2022Date of Patent: March 26, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
-
Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
-
Publication number: 20240030372Abstract: A display device includes a substrate, a plurality of electrical connection groups, a plurality of light-emitting elements, a light-transmitting plate, and an adhesive layer. The electrical connection groups may be formed in the substrate. The light-emitting elements may be disposed on the substrate. Each of the light-emitting elements may be electrically connected to the corresponding electrical connection group. The light-transmitting plate may cover the light-emitting elements. The adhesive layer may be formed between the light-transmitting plate and each of the light-emitting elements.Type: ApplicationFiled: June 2, 2023Publication date: January 25, 2024Inventors: Yuan-Ju CHENG, Wei-Ling HUA, Yu-Hsien WU
-
Publication number: 20230327053Abstract: A display apparatus is provided. The display apparatus includes a substrate, a transistor, a metal layer, and a light-emitting diode. The transistor is disposed on the substrate. The metal layer is disposed on the transistor and electrically connected to the transistor, wherein a first distance is between the upper surface of the metal layer and the substrate in a direction perpendicular to the substrate. The light-emitting diode is disposed on the metal layer, wherein the light-emitting diode includes a light-emitting diode body and an electrode, the light-emitting diode body is electrically connected to the metal layer via the electrode, the light-emitting diode body has a first surface and a second surface opposite to the first surface, the first surface and the second surface are parallel to the substrate, and in the direction above, a second distance is between the first surface and the second surface, wherein the ratio of the second distance to the first distance is greater than or equal to 0.Type: ApplicationFiled: June 12, 2023Publication date: October 12, 2023Applicant: Innolux CorporationInventors: Kuan-Feng Lee, Ting-Kai Hung, Yu-Hsien Wu, Chia-Hsiung Chang
-
Patent number: 11768314Abstract: The invention provides a projection method and system. The method includes providing a first sensing group sensing a space and generating a first sensing result to determine whether a user is in an entering or exiting state relative to the space; providing a second sensing group sensing a first or second object in the space according to the first sensing result and generating a second sensing result; and generating a prompt information according to the second sensing result and displaying the prompt information. The system includes a first sensing group, a second sensing group, and a display device. The method and system of the invention sense the space according to the entering and exiting state of the user to effectively reduce the inspection steps of the user for the space, thereby effectively improving the safety of the space, and improving the operating convenience of the user of the space.Type: GrantFiled: June 23, 2021Date of Patent: September 26, 2023Assignee: Coretronic CorporationInventors: Chi-Tang Hsieh, Chih-Hsien Tsai, Yu-Hsien Wu
-
Publication number: 20230276650Abstract: A display device is provided. The display device includes a substrate, a driving transistor, a first insulation layer, a first electrode and a second insulation layer. The driving transistor is disposed on the substrate and includes a gate electrode, and the gate electrode projects a first projection profile on the substrate. The first insulation layer is disposed on the driving transistor. The first electrode is disposed on the first insulation layer, and projects a second projection profile on the substrate. The second insulation layer is disposed on the first electrode and the first insulation layer. The second insulation layer has an opening, the opening exposes a portion of the first electrode, and the opening projects a third projection profile on the substrate.Type: ApplicationFiled: May 10, 2023Publication date: August 31, 2023Inventors: Yu-Hsien WU, Yu-Sheng TSAI, Kuan-Feng LEE, Chandra LIUS
-
Patent number: 11715816Abstract: A display apparatus is provided. The display apparatus includes a substrate, a transistor, a metal layer, and a light-emitting diode. The transistor is disposed on the substrate. The metal layer is disposed on the transistor and electrically connected to the transistor, wherein a first distance is between the upper surface of the metal layer and the substrate in a direction perpendicular to the substrate. The light-emitting diode is disposed on the metal layer, wherein the light-emitting diode includes a light-emitting diode body and an electrode, the light-emitting diode body is electrically connected to the metal layer via the electrode, the light-emitting diode body has a first surface and a second surface opposite to the first surface, the first surface and the second surface are parallel to the substrate, and in the direction above, a second distance is between the first surface and the second surface, wherein the ratio of the second distance to the first distance is greater than or equal to 0.Type: GrantFiled: May 3, 2021Date of Patent: August 1, 2023Assignee: Innolux CorporationInventors: Kuan-Feng Lee, Ting-Kai Hung, Yu-Hsien Wu, Chia-Hsiung Chang
-
Patent number: 11683945Abstract: A display device is provided. The display device includes a substrate, a driving transistor, a first insulation layer, a first electrode and a second insulation layer. The driving transistor is disposed on the substrate and includes a gate electrode, and the gate electrode projects a first projection profile on the substrate. The first insulation layer is disposed on the driving transistor. The first electrode is disposed on the first insulation layer, and projects a second projection profile on the substrate. The second insulation layer is disposed on the first electrode and the first insulation layer. The second insulation layer has an opening, the opening exposes a portion of the first electrode, and the opening projects a third projection profile on the substrate.Type: GrantFiled: July 7, 2021Date of Patent: June 20, 2023Assignee: INNOLUX CORPORATIONInventors: Yu-Hsien Wu, Yu-Sheng Tsai, Kuan-Feng Lee, Chandra Lius
-
Publication number: 20230145241Abstract: A display device is provided. The display device includes a substrate having a first edge and a second edge opposite to the first edge. There is a first distance between the first edge and the second edge. The display device also includes a plurality of light-emitting units disposed on the substrate, and a conductive line disposed on the substrate and electrically connected to at least one of the plurality of light-emitting units. The conductive line includes an undulating edge and has an extending length which is greater than or equal to half of the first distance and is less than or equal to the first distance.Type: ApplicationFiled: January 3, 2023Publication date: May 11, 2023Inventors: Kuan-Feng LEE, Yuan-Lin WU, Yu-Hsien WU
-
Patent number: 11556203Abstract: A display device is provided. The display device includes a substrate having a first edge and a second edge opposite to the first edge. There is a first distance between the first edge and the second edge. The display device also includes a plurality of light-emitting units disposed on the substrate, and a conductive line disposed on the substrate and electrically connected to at least one of the plurality of light-emitting units. The conductive line includes an undulating edge and has an extending length which is greater than or equal to half of the first distance and is less than or equal to the first distance.Type: GrantFiled: May 25, 2022Date of Patent: January 17, 2023Assignee: INNOLUX CORPORATIONInventors: Kuan-Feng Lee, Yuan-Lin Wu, Yu-Hsien Wu