Patents by Inventor Yu-Hsun Wang

Yu-Hsun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973005
    Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20240133745
    Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 25, 2024
    Inventors: Chein-Hsun WANG, Ming LE, Tung-Yang LEE, Yu-Chih LIANG, Wen-Chie HUANG, Chen-Tang HUANG, Jenping KU
  • Publication number: 20240136472
    Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Inventors: Chao-Hsing CHEN, Jia-Kuen WANG, Tzu-Yao TSENG, Tsung-Hsun CHIANG, Bo-Jiun HU, Wen-Hung CHUANG, Yu-Ling LIN
  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Publication number: 20240014100
    Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
    Type: Application
    Filed: August 7, 2023
    Publication date: January 11, 2024
    Inventors: Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20230011493
    Abstract: A package assembly includes an interposer module on a package substrate, a thermal interface material (TIM) film on the interposer module, and a package lid that includes a plate portion on the TIM film and a step region projecting away from the plate portion and located over the TIM film and over an edge region of the interposer module.
    Type: Application
    Filed: March 29, 2022
    Publication date: January 12, 2023
    Inventors: Ping-Yin HSIEH, Yu-Hsun WANG, Li-Hui CHENG, Szu-Wei LU
  • Publication number: 20220359345
    Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 10, 2022
    Inventors: Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20210331287
    Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.
    Type: Application
    Filed: December 28, 2020
    Publication date: October 28, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chieh LO, Yu-Hsun WANG, Pei-Chun LIN, Chih-Hsuan SHIH, Shu HUANG
  • Publication number: 20170190375
    Abstract: A direction control method for the self-balancing electric vehicle and electric vehicle using the same are disclosed in the present invention.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 6, 2017
    Inventors: Li Sheng LO, Chih Hsiang YANG, Chia Sheng HSU, Yu Hsun WANG, Chi Wei FAN, Jing Jo BEI
  • Patent number: 8678296
    Abstract: On a two-dimensional optical identification device with same gray level, a plurality of two-dimensional optical identification codes are arranged, each having a plurality of data blocks and an outer positioning block. Each data block has a plurality of defined patterns, and each defined pattern is located in one of virtual areas produced by equally dividing the data block. The outer positioning block has a plurality of first positioning points and a first direction identification point, and is placed at two adjacent boundaries of the plurality of data blocks for defining the positions of the plurality of data blocks. A fixed position data block is selected as a data block coding indication block for indicating the coding of the other data blocks.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: March 25, 2014
    Assignee: Generalplus Technology Inc.
    Inventors: Shih-Chien Lin, Yu-Hsun Wang
  • Patent number: 8534565
    Abstract: A two-dimensional optical identification device for a quick decoding operation in a same gray level and decoding method applied to the same. The two-dimensional optical identification device has at least one two-dimensional optical identification with the same gray level. The two-dimensional optical identification has a first positioning block, a plurality of data blocks, and a second positioning block. The first positioning block has a plurality of first positioning points. The data blocks are placed around the first positioning block. The second positioning block has a plurality of second positioning points and a second direction identification point for providing the direction of the two-dimensional optical identification, and the second positioning block is placed at each boundary of the plurality of data blocks for defining the positions of the plurality of data blocks. The second direction identification point indicates an identification direction of the two-dimensional optical identification.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: September 17, 2013
    Assignee: Generalplus Technology Inc.
    Inventors: Shih-Chien Lin, Yu-Hsun Wang
  • Publication number: 20120298761
    Abstract: On a two-dimensional optical identification device with same gray level, a plurality of two-dimensional optical identification codes are arranged, each having a plurality of data blocks and an outer positioning block. Each data block has a plurality of defined patterns, and each defined pattern is located in one of virtual areas produced by equally dividing the data block. The outer positioning block has a plurality of first positioning points and a first direction identification point, and is placed at two adjacent boundaries of the plurality of data blocks for defining the positions of the plurality of data blocks. A fixed position data block is selected as a data block coding indication block for indicating the coding of the other data blocks.
    Type: Application
    Filed: November 7, 2011
    Publication date: November 29, 2012
    Applicant: Generalplus Technology Inc.
    Inventors: Shih-Chien LIN, Yu-Hsun WANG
  • Publication number: 20120298754
    Abstract: A two-dimensional optical identification device for a quick decoding operation in a same gray level and decoding method applied to the same. The two-dimensional optical identification device has at least one two-dimensional optical identification with the same gray level. The two-dimensional optical identification has a first positioning block, a plurality of data blocks, and a second positioning block. The first positioning block has a plurality of first positioning points. The data blocks are placed around the first positioning block. The second positioning block has a plurality of second positioning points and a second direction identification point for providing the direction of the two-dimensional optical identification, and the second positioning block is placed at each boundary of the plurality of data blocks for defining the positions of the plurality of data blocks. The second direction identification point indicates an identification direction of the two-dimensional optical identification.
    Type: Application
    Filed: November 7, 2011
    Publication date: November 29, 2012
    Applicant: Generalplus Technology Inc.
    Inventors: Shih-Chien Lin, Yu-Hsun Wang