Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A package assembly includes an interposer module on a package substrate, a thermal interface material (TIM) film on the interposer module, and a package lid that includes a plate portion on the TIM film and a step region projecting away from the plate portion and located over the TIM film and over an edge region of the interposer module.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.

Abstract: A direction control method for the self-balancing electric vehicle and electric vehicle using the same are disclosed in the present invention.

Abstract: On a two-dimensional optical identification device with same gray level, a plurality of two-dimensional optical identification codes are arranged, each having a plurality of data blocks and an outer positioning block. Each data block has a plurality of defined patterns, and each defined pattern is located in one of virtual areas produced by equally dividing the data block. The outer positioning block has a plurality of first positioning points and a first direction identification point, and is placed at two adjacent boundaries of the plurality of data blocks for defining the positions of the plurality of data blocks. A fixed position data block is selected as a data block coding indication block for indicating the coding of the other data blocks.

Abstract: A two-dimensional optical identification device for a quick decoding operation in a same gray level and decoding method applied to the same. The two-dimensional optical identification device has at least one two-dimensional optical identification with the same gray level. The two-dimensional optical identification has a first positioning block, a plurality of data blocks, and a second positioning block. The first positioning block has a plurality of first positioning points. The data blocks are placed around the first positioning block. The second positioning block has a plurality of second positioning points and a second direction identification point for providing the direction of the two-dimensional optical identification, and the second positioning block is placed at each boundary of the plurality of data blocks for defining the positions of the plurality of data blocks. The second direction identification point indicates an identification direction of the two-dimensional optical identification.

Abstract: On a two-dimensional optical identification device with same gray level, a plurality of two-dimensional optical identification codes are arranged, each having a plurality of data blocks and an outer positioning block. Each data block has a plurality of defined patterns, and each defined pattern is located in one of virtual areas produced by equally dividing the data block. The outer positioning block has a plurality of first positioning points and a first direction identification point, and is placed at two adjacent boundaries of the plurality of data blocks for defining the positions of the plurality of data blocks. A fixed position data block is selected as a data block coding indication block for indicating the coding of the other data blocks.

Abstract: A two-dimensional optical identification device for a quick decoding operation in a same gray level and decoding method applied to the same. The two-dimensional optical identification device has at least one two-dimensional optical identification with the same gray level. The two-dimensional optical identification has a first positioning block, a plurality of data blocks, and a second positioning block. The first positioning block has a plurality of first positioning points. The data blocks are placed around the first positioning block. The second positioning block has a plurality of second positioning points and a second direction identification point for providing the direction of the two-dimensional optical identification, and the second positioning block is placed at each boundary of the plurality of data blocks for defining the positions of the plurality of data blocks. The second direction identification point indicates an identification direction of the two-dimensional optical identification.