Patents by Inventor Yu Hu

Yu Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11984410
    Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu
  • Patent number: 11981753
    Abstract: Disclosed are a peptide compound and an application thereof, and a composition containing the peptide compound. The present invention provides a peptide compound YA-156, and a pharmaceutically acceptable salt, a tautomer, a solvate, a crystal form or a prodrug thereof. The compound has good stability and good activity for Kiss1R.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: May 14, 2024
    Assignee: ShangPharma Innovation Inc.
    Inventors: Yvonne Angell, Yu Wu, Yan Wang, Weimin Liu, Kin Chiu Fong, Jie Wen, Yonghan Hu
  • Patent number: 11981604
    Abstract: A concrete crack repair material based on nano materials includes raw materials as follows: seaweed, sulphoaluminate cement, natural sand, nano-silica fume, calcium formate, fly ash, anhydrous calcium sulphoaluminate, a polyester fiber, a water reducing agent, a corrosion inhibitor and water. By reasonably selecting the raw materials of the concrete crack repair material and making a reasonable ratio of the raw materials, the concrete crack repair material is obtained with excellent performance such as good compressive strength, bending strength and bond strength, and excellent impermeability and frost resistance. The concrete crack repair material can be used for the concrete crack repair in the marine environment, which has very important application values.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: May 14, 2024
    Assignee: NingboTech University
    Inventors: Chonggen Pan, Yu Hu, Shiyang Qu, Jiawei Zang
  • Publication number: 20240153911
    Abstract: A method for forming a semiconductor device and a semiconductor device are disclosed. The method includes: forming a stacked chip assembly, and at least one of the stacked chip assembly is bonded to a surface of a package wafer by chip-to-wafer bonding; obtaining a first reconstructed wafer by performing wafer reconstruction through forming a first filling cap layer over surfaces of the package wafer and the stacked chip assembly(ies) on the package wafer. With this method, stacked chip assembly with chip-level dimension can be stacked with a package wafer with wafer-level dimension, thus enabling dense stacking of chips. In addition, other stacked chip assembly(ies) can be bonded to the first reconstructed wafer by chip-to-wafer bonding, resulting in even denser stacking of chips and high process efficiency and helping in reducing the process cost and shortening the manufacturing time. The semiconductor device can be fabricated using the method.
    Type: Application
    Filed: December 21, 2022
    Publication date: May 9, 2024
    Inventors: Yu ZHOU, Sheng HU, Peng SUN
  • Publication number: 20240142749
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is configured to connect a first optical element, and the first movable assembly is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly in a first dimension.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Inventors: Chao-Chang HU, Chen-Hsien FAN, Chih-Wen CHIANG, Chien-Yu KAO
  • Publication number: 20240139336
    Abstract: The present invention provides methods, compositions, systems, and kits comprising nano-satellite complexes and/or serum albumin carrier complexes, which are used for modulating antigen-specific immune response (e.g., enhancing anti-tumor immunity). In certain embodiments, the nano-satellite complexes comprise: a) a core nanoparticle complex comprising a biocompatible coating surrounding a nanoparticle core; b) at least one satellite particle attached to, or absorbed to, the biocompatible coating; and c) an antigenic component conjugated to, or absorbed to, the at least one satellite particle component. In certain embodiments, the complexes further comprise: d) a type I interferon agonist agent. In some embodiments, the serum albumin complexes comprise: a) at least part of a serum albumin protein, b) an antigenic component conjugated to the carrier protein, and c) a type I interferon agonist agent.
    Type: Application
    Filed: April 6, 2023
    Publication date: May 2, 2024
    Inventors: Yu Lei, Yee Sun Tan, Kanokwan Sansanaphongpricha, Duxin Sun, Hongwei Chen, Hongxiang Hu
  • Publication number: 20240145895
    Abstract: Disclosed is a circular filter assembly, relating to the field of wireless communication. The circular filter assembly includes: a dielectric filter and a dielectric waveguide circulator. The dielectric waveguide circulator is provided with at least three end portions. An end of the dielectric filter is connected to one of the end portions. A cascade matching window is disposed at a connection between the dielectric filter and the end portion, and the cascade matching window is used for adjusting impedance of the circular filter assembly. The dielectric waveguide circulator and the dielectric filter are integrally formed. By integrally forming the dielectric waveguide circulator and the dielectric filter, connecting members between the dielectric waveguide circulator and the dielectric filter can be reduced. In addition, the cascade matching window is added to perform impedance adjustment, to obtain the same standing wave indicator as a conventional connection using a connector.
    Type: Application
    Filed: January 29, 2022
    Publication date: May 2, 2024
    Inventors: Wenxin CAI, Yu CAO, Yahui HU
  • Publication number: 20240143145
    Abstract: A method and apparatus for aiming at a virtual object in a virtual environment, which: displays a user interface (UI), the UI including a picture of a virtual environment including a first virtual object and at least one second virtual object located in the virtual environment; displays a dot aiming indicator in the virtual environment in response to an aiming instruction, the dot aiming indicator being used for indicating an aiming point selected by an aiming operation on a ground plane of the virtual environment; and controls the first virtual object to aim at a target virtual object, which is a virtual object selected from a second virtual object in a target selection range which is a selection range determined by using the aiming point as a benchmark.
    Type: Application
    Filed: December 28, 2023
    Publication date: May 2, 2024
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yu Lin WAN, Jianmiao Weng, Xun Hu, Shan Dong Su, Yong Zhang
  • Patent number: 11966241
    Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Neng Chen, Yen-Lin Liu, Chia-Wei Hsu, Jo-Yu Wu, Chang-Fen Hu, Shao-Yu Li, Bo-Ting Chen
  • Patent number: 11966612
    Abstract: A method for migrating data by a source network interface card includes: receiving a first migration instruction; sending a read instruction to the source SSD when receiving the first migration instruction, where the read instruction is used to instruct the source SSD to read the to-be-migrated data into the source migration cache; and sending a second migration instruction to a target intelligent network interface card of the target storage array after the to-be-migrated data is read from the source SSD, where the second migration instruction is used to instruct the target intelligent network interface card to migrate the to-be-migrated data in the source migration cache to the target storage array.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: April 23, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ge Du, Yu Hu
  • Patent number: 11967525
    Abstract: Embodiments of the disclosure relate to methods of depositing tungsten. Some embodiments of the disclosure provide methods for depositing tungsten which are performed at relatively low temperatures. Some embodiments of the disclosure provide methods in which the ratio between reactant gasses is controlled. Some embodiments of the disclosure provide selective deposition of tungsten. Some embodiments of the disclosure provide methods for depositing tungsten films at a low temperature with relatively low roughness, stress and impurity levels.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: April 23, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Yi Xu, Yufei Hu, Yu Lei, Kazuya Daito, Da He, Jiajie Cen
  • Patent number: 11968832
    Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the disclosed method comprises forming a plurality of dielectric stacks stacked on one another over a substrate to create a multiple-stack staircase structure. Each one of the plurality of dielectric stacks comprises a plurality of dielectric pairs arranged along a direction perpendicular to a top surface of the substrate. The method further comprises forming a filling structure that surrounds the multiple-stack staircase structure, forming a semiconductor channel extending through the multiple-staircase structure, wherein the semiconductor channel comprises unaligned sidewall surfaces, and forming a supporting pillar extending through at least one of the multiple-staircase structure and the filling structure, wherein the supporting pillar comprises aligned sidewall surfaces.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: April 23, 2024
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jun Liu, Zongliang Huo, Li Hong Xiao, Zhenyu Lu, Qian Tao, Yushi Hu, Sizhe Li, Zhao Hui Tang, Yu Ting Zhou, Zhaosong Li
  • Patent number: 11968512
    Abstract: In an example, a speaker device may include a first transducer and a second transducer. The first transducer may include a first diaphragm, a first magnetic circuit, and a first voice coil disposed in a magnetic gap of the first magnetic circuit to cause vibration of the first diaphragm. The second transducer may include a second diaphragm, a second magnet circuit, and a second voice coil disposed in a magnetic gap of the second magnetic circuit to cause vibration of the second diaphragm. Further, the speaker device may include a magnetic plate having a first surface coupled to the first transducer and a second surface coupled to the second transducer. The first surface is opposite to the second surface.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yen-Hsin Ho, Yi-Ying Lai, Chen-Hui Hu, Chen-Yu Chang
  • Patent number: 11967958
    Abstract: In some embodiments, digital logic components, such as those found in standard cells in integrated circuit devices, are used to synthesize signals with controllable waveforms that result in transmitted signals that meet certain requirements, such as above-threshold high openings and below-threshold over/under-shooting. In some embodiments, driving buffers with logic controls and delay chains are used to achieve controllable slew rates at rising and falling edges to minimize over/under shooting behavior in signals. In some embodiments, control logic and delay chains produce controllable rising/falling “stair-type” edges to obtain optimized damping waveform.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Huan-Neng Chen, Chang-Fen Hu, Shao-Yu Li
  • Publication number: 20240125003
    Abstract: A method of growing a single crystal ingot includes growing a single crystal silicon ingot from a silicon melt in a crucible within an inner chamber, adding a volatile dopant into a feed tube, positioning the feed tube within an inner chamber at a first height relative to a surface of the melt, adjusting the feed tube within the inner chamber to a second height at a speed rate, and heating the volatile dopant to form a gaseous dopant as the feed tube is moved from the first height to the second height at the speed rate. Each of the second height and the speed rate are selected to control a vaporization rate of the volatile dopant. The method also includes introducing dopant species into the melt while growing the ingot by contacting the surface of the melt with the gaseous dopant.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 18, 2024
    Inventors: Chieh HU, Hsien-Ta TSENG, Chun-Sheng WU, William Lynn LUTER, Liang-Chin CHEN, Sumeet BHAGAVAT, Carissima Marie HUDSON, Yu-Chiao Wu
  • Publication number: 20240129175
    Abstract: Provided are a symbol sending method, a symbol receiving method, a sending device, a receiving device, and a storage medium. The symbol sending method includes the following: modulating two bits according to a model of a first constellation diagram to obtain a transmission symbol, where the model of the first constellation diagram satisfies the following: four vertices of the first constellation diagram form a rhombus, the lengths of the two diagonal lines of the rhombus are unequal, and each vertex corresponds to one value of the two bits; and sending the transmission symbol.
    Type: Application
    Filed: April 13, 2022
    Publication date: April 18, 2024
    Inventors: Zhifeng YUAN, Yu XIN, Guanghui YU, Liujun HU, Jin XU
  • Publication number: 20240125780
    Abstract: Some embodiments of the disclosure provide a method for detecting an anti-chimeric antigen receptor (CAR) antibody against humanized CAR T cells. In some examples, the method include following steps. S1. Transfecting a humanized CAR into Chinese hamster ovary (CHO) cells into using lentivirus to generate CHO cells expressing CAR as target cells. S2. Collecting samples to be tested. S3. Preparing different concentrations of standards using human proteins corresponding to a target of the CAR and establishing a standard curve. S4. Incubating the target cells with the different concentrations of standards and the samples to be tested, and capturing the anti-CAR antibody. S5. Incubating a phycoerythrin (PE)-conjugated anti-human IgG Fc antibody with CHO cells for labeling. S6. Calculating the anti-CAR antibody by detecting average fluorescence intensities of the standards, blank control, and the samples to be tested using flow cytometry.
    Type: Application
    Filed: August 31, 2023
    Publication date: April 18, 2024
    Applicant: UNION HOSPITAL TONGJI MEDICAL COLLEGE HUST
    Inventors: Heng MEI, Yu HU, Zhongpei HUANG, Chenggong LI, Wenjing LUO
  • Publication number: 20240125004
    Abstract: A method of growing a single crystal ingot includes growing a single crystal silicon ingot from a silicon melt in a crucible within an inner chamber, adding a volatile dopant into a feed tube, positioning the feed tube within an inner chamber at a first height relative to a surface of the melt, adjusting the feed tube within the inner chamber to a second height at a speed rate, and heating the volatile dopant to form a gaseous dopant as the feed tube is moved from the first height to the second height at the speed rate. Each of the second height and the speed rate are selected to control a vaporization rate of the volatile dopant. The method also includes introducing dopant species into the melt while growing the ingot by contacting the surface of the melt with the gaseous dopant.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 18, 2024
    Inventors: Chieh HU, Hsien-Ta TSENG, Chun-Sheng WU, William Lynn LUTER, Liang-Chin CHEN, Sumeet BHAGAVAT, Carissima Marie HUDSON, Yu-Chiao Wu
  • Patent number: 11962058
    Abstract: Disclosed is a circular filter assembly, relating to the field of wireless communication. The circular filter assembly includes: a dielectric filter and a dielectric waveguide circulator. The dielectric waveguide circulator is provided with at least three end portions. An end of the dielectric filter is connected to one of the end portions. A cascade matching window is disposed at a connection between the dielectric filter and the end portion, and the cascade matching window is used for adjusting impedance of the circular filter assembly. The dielectric waveguide circulator and the dielectric filter are integrally formed. By integrally forming the dielectric waveguide circulator and the dielectric filter, connecting members between the dielectric waveguide circulator and the dielectric filter can be reduced. In addition, the cascade matching window is added to perform impedance adjustment, to obtain the same standing wave indicator as a conventional connection using a connector.
    Type: Grant
    Filed: January 29, 2022
    Date of Patent: April 16, 2024
    Assignee: Chengdu Lingyi Communication Technology Co., Ltd.
    Inventors: Wenxin Cai, Yu Cao, Yahui Hu