Abstract: A method is described. The method includes obtaining a relationship between a thickness of a contamination layer formed on a mask and an amount of compensation energy to remove the contamination layer, obtaining a first thickness of a first contamination layer formed on the mask from a thickness measuring device, and applying first compensation energy calculated from the relationship to a light directed to the mask.

Abstract: A fastener is adapted for assembling a first housing to a second housing. The first housing is provided with a protruding portion and a buckling portion, and the second housing has a first surface, a second surface, and a through hole. The fastener includes a first portion, at least one connecting portion, at least two elastic portions, and a second portion. The first portion movably abuts against the first surface and has a first opening. The connecting portion is accommodated in the through hole. One end of the connecting portion is connected to the first portion. The connecting portion is spaced apart from an inner edge of the second housing by a gap. The two elastic portions inclinedly extend into the first opening. The second portion movably abuts against the second surface and is disposed at the another end of the connecting portion.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A male connector having an electrostatic discharge (ESD) function includes a metal portion, an insulating portion and a cable. The metal portion is inserted into a female connector. One end of the insulating portion is connected to the metal portion and another end of the insulating portion is connected to the cable. The cable includes a plurality of sub-cables and a grounded metal layer. The metal layer surrounds the sub-cables, and is in electrical contact with the metal portion. Static electricity on the metal portion is conducted to ground via the metal layer.

Abstract: An exemplary shielding assembly includes a printed circuit board (PCB) and a shielding case. The PCB includes a sensitive circuit and a grounding layer. A groove extends from a top surface of the PCB down into the inside of the PCB, and the groove is in communication with the grounding layer. The shielding case is inserted into the groove and covers the sensitive circuit, and the shielding case is electrically connected with the grounding layer.

Abstract: A male connector having an electrostatic discharge (ESD) function includes a metal portion, an insulating portion and a cable. The metal portion is inserted into a female connector. One end of the insulating portion is connected to the metal portion and another end of the insulating portion is connected to the cable. The cable includes a plurality of sub-cables and a grounded metal layer. The metal layer surrounds the sub-cables, and is in electrical contact with the metal portion. Static electricity on the metal portion is conducted to ground via the metal layer.

Abstract: A power adapter includes a power converter circuit, a direct current (DC) plug and a magnetic switch. The power converter circuit converts power signals of a power source into DC power signals. The DC plug is engageable with a jack of a powered device, and transmits the DC power signals to the powered device. The DC plug includes a magnetic force conducting wire to conduct magnetic force of a magnetic element when the powered device is powered. The magnetic switch, connected between the power source and the power converter circuit, is turned on or off according to if the magnetic force conducting wire conducts the magnetic force or not so as to control the power source to provide power to the power converter circuit.

Abstract: A power adapter includes a power converter circuit, a direct current (DC) plug and a magnetic switch. The power converter circuit converts power signals of a power source into DC power signals. The DC plug is engageable with a jack of a powered device, and transmits the DC power signals to the powered device. The DC plug includes a magnetic force conducting wire to conduct magnetic force of a magnetic element when the powered device is powered. The magnetic switch, connected between the power source and the power converter circuit, is turned on or off according to if the magnetic force conducting wire conducts the magnetic force or not so as to control the power source to provide power to the power converter circuit.

Abstract: A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.

Abstract: A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.