Abstract: The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal.

Abstract: A defect detection method for a multilayer daisy chain structure, including: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a daisy chain structure; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that the multilayer daisy chain has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

Abstract: A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

Abstract: A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

Abstract: An electronic apparatus with a detection function includes a normal function circuit, a dummy function circuit and a processing module. The normal function circuit operates according to an operation signal. The dummy function circuit operates to generate a result signal according to a test signal and is a small size circuit of the normal function circuit. The test signal and operation signal are same function signals, and the test signal has an electrical characteristic larger than that of the operation signal. The processing module generates the operation signal and the test signal at the same time, accumulates an operation time of the dummy function circuit, and determines whether the dummy function circuit is faulty by detecting the result signal. When the dummy function circuit is faulty, the processing module calculates a remaining lifetime of the normal function circuit according to the test signal, the operation signal and the operation time.

Abstract: A chip-to-chip signal transmission system including a first unit set and a second unit set arranged in a first direction is provided. The first unit set and the second unit are configured to perform the signal transmission between a first chip and a second chip. There is a shift between the first unit set and the second unit set in a second direction such that the first unit set and the second unit set are shifted in the second direction and an overlapping region is formed. By adjusting the size of the overlapping region, the signal noise and the signal attenuation due to the misalignment between the first chip and the second chip or the electromagnetic interference of the adjacent signals are reduced and the signal transmission quality is thus improved. Furthermore, a method for arranging chips is also provided.

Abstract: The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal.

Abstract: A display panel includes a first substrate, a shading module, a second substrate, optical sensors, and a parallel-to-serial converter. The shading module is disposed on the first substrate. The second substrate is disposed corresponding to the first substrate. The optical sensors are disposed on the second substrate, and are disposed corresponding to the shading module. The optical sensors are configured to output sensing signals according to an offset amount between the optical sensors and the shading module. One of the optical sensors includes a first switch and a second switch, in which the first switch and the second switch are coupled in cascade. The parallel-to-serial converter is configured to generate the serial signal according to the sensing signals.

Abstract: An interposer structure and a manufacturing method thereof are provided. The interposer structure includes a flexible substrate, a plurality of conductive pillars, a first patterned conductive layer, and a second patterned conductive layer. The flexible substrate includes a first surface and a second surface opposite to the first surface and has a plurality of through holes extending from the first surface to the second surface. A material of the flexible substrate is an insulator. The conductive pillars are disposed in the through holes. The first patterned conductive layer is disposed on the first surface of the flexible substrate and is electrically connected to the conductive pillars. The second patterned conductive layer is disposed on the second surface of the flexible substrate and is electrically connected to the conductive pillars.

Abstract: A display panel includes a first substrate, a shading module, a second substrate, optical sensors, and a parallel-to-serial converter. The shading module is disposed on the first substrate. The second substrate is disposed corresponding to the first substrate. The optical sensors are disposed on the second substrate, and are disposed corresponding to the shading module. The optical sensors are configured to output sensing signals according to an offset amount between the optical sensors and the shading module. One of the optical sensors includes a first switch and a second switch, in which the first switch and the second switch are coupled in cascade. The parallel-to-serial converter is configured to generate the serial signal according to the sensing signals.

Abstract: The invention is directed to a wireless sensor network system. The wireless sensor network system is adapted for a medication information security environment, and the wireless sensor network system comprising a first sensor node, a second sensor node and a central node. The first sensor node sends a request for registration and a user identification. The central node generates and stores a first set of random number and a second set of random number when receiving the request for registration and the user identification. The central node sends the first set of random number and the second set of random number to the first sensor node and the second sensor node respectively.

Abstract: A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal.

Abstract: The invention is directed to a wireless sensor network system. The wireless sensor network system is adapted for a medication information security environment, and the wireless sensor network system comprising a first sensor node, a second sensor node and a central node. The first sensor node sends a request for registration and a user identification. The central node generates and stores a first set of random number and a second set of random number when receiving the request for registration and the user identification. The central node sends the first set of random number and the second set of random number to the first sensor node and the second sensor node respectively.

Abstract: The invention is directed to a wireless sensor network system. The wireless sensor network system is adapted for a medication information security environment, and the wireless sensor network system comprising a first sensor node, a second sensor node and a central node. The first sensor node sends a request for registration and a user identification. The central node generates and stores a first set of random number and a second set of random number when receiving the request for registration and the user identification. The central node sends the first set of random number and the second set of random number to the first sensor node and the second sensor node respectively.

Abstract: A signal transmission system and a signal transmission circuit are provided. The system includes a first chip and a second chip. A rising pulse signal (RPS) and a falling pulse signal (FPS) are generated by a transmission module on the first chip in response to a waveform of an input signal.

Abstract: A signal transmission system and a signal transmission circuit are provided. The system includes a first chip and a second chip. A rising pulse signal (RPS) and a falling pulse signal (FPS) are generated by a transmission module on the first chip in response to a waveform of an input signal. The RPS corresponds to rising edges of the input signal, the FPS corresponds to falling edges of the input signal, and the RPS and the FPS are transmitted by a first transmission unit and a second transmission unit both located on a surface of the first chip.

Abstract: The invention is directed to a wireless sensor network system. The wireless sensor network system is adapted for a medication information security environment, and the wireless sensor network system comprising a first sensor node, a second sensor node and a central node. The first sensor node sends a request for registration and a user identification. The central node generates and stores a first set of random number and a second set of random number when receiving the request for registration and the user identification. The central node sends the first set of random number and the second set of random number to the first sensor node and the second sensor node respectively.

Abstract: A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal.

Abstract: A liquid dispenser is mounted on a container and has a shell, a spout assembly, an injection assembly, a power pack and an activating assembly. The shell is mounted on the container and has an injection tube. The spout assembly is formed on and protrudes from the shell. The injection assembly is mounted in the shell pumps air into the injection tube to force liquid from the spout assembly. The activating assembly selectively activates the injection assembly and selectively seals or opens an air passage to the injection tube.

Abstract: A liquid dispenser is mounted on a container and has a shell, a spout assembly, an injection assembly, a power pack and an activating assembly. The shell is mounted on the container and has an injection tube. The spout assembly is formed on and protrudes from the shell. The injection assembly is mounted in the shell pumps air into the injection tube to force liquid from the spout assembly. The activating assembly selectively activates the injection assembly and selectively seals or opens an air passage to the injection tube.