Abstract: The present disclosure relates to a display panel, a temperature compensation method thereof and a display device. The display panel includes: a first substrate; a second substrate; a liquid crystal layer; a plurality of temperature sensors; a plurality of heaters; an electrical signal supply circuit; a processor; and a controller. The display device includes a driving circuit and the display panel. The driving circuit includes a source driving circuit, a gate driving circuit, and a timing controller.

Abstract: The present disclosure relates to a display panel, a temperature compensation method thereof and a display device. The display panel includes: a first substrate; a second substrate; a liquid crystal layer; a plurality of temperature sensors; a plurality of heaters; an electrical signal supply circuit; a processor; and a controller. The display device includes a driving circuit and the display panel. The driving circuit includes a source driving circuit, a gate driving circuit, and a timing controller.

Abstract: The present disclosure discloses a copper etchant solution additives and a method for producing copper etchant solution. The method includes: producing copper etchant solution additives, wherein the copper etchant solution additives is an inorganic solution with cupric ions (Cu2+), and deionized water is a solvent for the copper etchant solution additives and is electric neutrality; before wet-etching, the copper etchant solution additives is added in the copper etchant solution, and the copper etchant solution is with a cupric ions (Cu2+) concentration of 700-1000 ppm. Through the above method, the present disclosure can improve etchant property of copper etchant solution to increase etching rate and uniformity.

Abstract: The present disclosure relates to an array substrate and a display panel. The array substrate includes a substrate, a patterned middle layer arranged on the substrate, and a pixel electrode layer configured with no patterns being arranged on the patterned middle layer. The pixel electrode layer includes at least one protrusion area and at least one depressed area formed in accordance with the patterned middle layer. The array substrate may effectively resolve the dark-stripe issues.

Abstract: The present disclosure discloses a copper etchant solution additives and a method for producing copper etchant solution. The method includes: producing copper etchant solution additives, wherein the copper etchant solution additives is an inorganic solution with cupric ions (Cu2+), and deionized water is a solvent for the copper etchant solution additives and is electric neutrality; before wet-etching, the copper etchant solution additives is added in the copper etchant solution, and the copper etchant solution is with a cupric ions (Cu2+) concentration of 700-1000 ppm. Through the above method, the present disclosure can improve etchant property of copper etchant solution to increase etching rate and uniformity.

Abstract: The present invention discloses a manufacturing method for a switch and an array substrate. The method comprises: firstly, forming sequentially a first metal layer, an insulating layer, a semiconductor layer, an ohmic contact layer, a second metal layer, a third metal layer and a photoresist layer on a base substrate; after patterning the photoresist layer, etching the third metal layer and the second metal layer to form the input electrode and the output electrode of the switch; using a stripper comprising at least 30% by weight of amine in order to remove the photoresist layer and the residual second metal layer; and finally, etching the ohmic contact layer. Through the above steps, the present invention can avoid the electrical abnormality of the switch and increase process yield of the array substrate.

Abstract: The present invention discloses a manufacturing method for a switch and an array substrate. The method comprises: firstly, forming sequentially a first metal layer, an insulating layer, a semiconductor layer, an ohmic contact layer, a second metal layer, a third metal layer and a photoresist layer on a base substrate; after patterning the photoresist layer, etching the third metal layer and the second metal layer to form the input electrode and the output electrode of the switch; using a stripper comprising at least 30% by weight of amine in order to remove the photoresist layer and the residual second metal layer; and finally, etching the ohmic contact layer. Through the above steps, the present invention can avoid the electrical abnormality of the switch and increase process yield of the array substrate.