Patents by Inventor Yu-Lin Sung

Yu-Lin Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10032661
    Abstract: A semiconductor device, method, and tool of manufacture includes a semiconductor manufacturing tool. The semiconductor manufacturing tool includes push pins in a chuck and an edge ring over the chuck. The push pins are configured to hold a wafer, and are operable to vary a height of the wafer with respect to the chuck. The edge ring has a first width at a base proximate the chuck, and a second width at a point distal the chuck. The first width is greater than the second width. A distance from the wafer to the edge ring varies when the push pins vary the height of the wafer with respect to the chuck.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: July 24, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Je Chuang, Yu-Lin Sung, Yi-Wei Chiu, Tzu-Chan Weng
  • Publication number: 20180144970
    Abstract: A semiconductor device, method, and tool of manufacture includes a semiconductor manufacturing tool. The semiconductor manufacturing tool includes push pins in a chuck and an edge ring over the chuck. The push pins are configured to hold a wafer, and are operable to vary a height of the wafer with respect to the chuck. The edge ring has a first width at a base proximate the chuck, and a second width at a point distal the chuck. The first width is greater than the second width. A distance from the wafer to the edge ring varies when the push pins vary the height of the wafer with respect to the chuck.
    Type: Application
    Filed: November 18, 2016
    Publication date: May 24, 2018
    Inventors: Meng-Je Chuang, Yu-Lin Sung, Yi-Wei Chiu, Tzu-Chan Weng