Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.

Abstract: The present invention provides an aqueous composition and process for the electrodeposition of a layer of zinc containing silicon and phosphorus on a metal substrate. The electrodeposition composition is prepared by reacting metallic silicon and zinc with phosphoric acid and an alkali metal hydroxide in the ratio of between 0.4 and 1.3 moles of alkali metal hydroxide per mole of phosphoric acid, and adjusting the solution to a pH of 2 or higher after completion of the reaction. The coating is deposited on the metal substrate by electrodeposition and comprises about 70% to about 99.5% by weight of zinc, and about 0.10% to about 10% by weight of silicon, and about 0.5% to about 20% by weight of phosphorus.The resultant zinc/silicon/phosphorus coating improves the resistance of the metal substrate to corrosion, wear, galling and stress corrosion cracking.

Abstract: The present invention provides an aqueous composition and process for the electrodeposition of a layer of zinc containing silicon and phosphorus on a metal substrate. The electrodeposition composition is prepared by reacting metallic silicon and zinc with phosphoric acid and an alkali metal hydroxide in the ratio of between 0.4 and 1.3 moles of alkali metal hydroxide per mole of phosphoric acid, and adjusting the solution to a pH of 2 or higher after completion of the reaction. The coating is deposited on the metal substrate by electrodeposition and comprises about 70% to about 99.5% by weight of zinc, and about 0.10% to about 10% by weight of silicon, and about 0.5% to about 20% by weight of phosphorus.The resultant zinc/silicon/phosphorus coating improves the resistance of the metal substrate to corrosion, wear, galling and stress corrosion cracking.

Abstract: An improved method for making conductive metal patterns involving the steps of treating a substrate with a solution comprising a reducible salt of a non-noble metal and a light radiation sensitive reducing compound, exposing said substrate to light radiant energy, fixing with a solution comprised of a complexing agent followed by electroless deposition, the improvement comprising extending the bath life of said fixing solution by maintaining the concentration of the light sensitive reducing compound on the fixing solution so that it does not exceed 0.4 m moles/liter.