Abstract: The present invention provides a permanent magnet-electromagnet synergistic coupling-based high-speed solenoid valve with a high dynamic response and a low rebound, including a shell and an iron core. The iron core is installed in the shell, an axial center through hole is formed in a middle of the iron core, a spring limiting sleeve is installed in the axial center through hole, an armature and a reset spring cavity are sequentially formed below the iron core, an upper portion of a valve rod is located in the spring limiting sleeve, an upper disc permanent magnet, a lower disc permanent magnet and a spring washer are arranged in the spring limiting sleeve, and a giant magnetostrictor is installed between the upper disc permanent magnet and the lower disc permanent magnet. By means of the present invention, electromagnetic force generated during pickup of the armature can be effectively improved.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: Methods, systems, and devices for group-specific resource indications in mobile communication systems are described. An exemplary method for wireless communication includes determining, by a network node, an association among one set of one or more reference signals (RSs) and one or more groups, where each of the one or more RSs is associated with a usage or a time-domain behavior, and transmitting, to the terminal, a signaling message comprising the association. Another exemplary method for wireless communication includes determining, by the network node, a reference signal (RS) configuration, wherein the RS configuration comprises an association between one or more target RSs and a spatial granularity, and transmitting, to a terminal, a message comprising the RS configuration.

Abstract: A transcription of audio speech included in electronic content associated with a meeting is created by an ASR model trained on speech-to-text data. The transcription is post-processed by modifying text included in the transcription, for example, by modifying punctuation, grammar, or formatting introduced by the ASR model and by changing or omitting one or more words that were included in both the audio speech and the transcription. After the transcription is post-processed, output based on the post-processed transcription is generated in the form of a meeting summary and/or template.

Abstract: A method for forming a 3D memory device is disclosed. The method includes: forming an alternating dielectric stack on a substrate; forming a plurality of channel holes penetrating the alternating dielectric stack; forming a channel structure in each channel hole; forming a channel column structure on the channel structure in each channel hole; trimming an upper portion of each channel column structure to form a channel plug; and forming a top selective gate cut between neighboring channel plugs.

Abstract: A fiber deployment system is suitable for field installed fiber tubes such as blown fiber tubes. The fiber deployment system includes a fiber optic connector including a housing assembly having a connector body and a fiber tube attached at a rear end of the connector body. A ferrule assembly mounted on a deployable fiber can be loaded into the connector body through the fiber tube. The fiber tube can be coupled to a field installed fiber tube by a tube coupler.

Abstract: A display substrate and a display device are provided. The display substrate includes a shift register unit, a first clock signal line and a first power line, the shift register unit includes a charge pump circuit, and the charge pump circuit includes a first capacitor, a first transistor and a second capacitor. The charge pump circuit is electrically connected with a first input node and a first node, respectively. A first electrode plate of the first capacitor is connected with the first clock signal line, a second electrode plate of the first capacitor is connected with the first input node, a first electrode plate of the second capacitor is connected with the first power line, a second electrode plate of the second capacitor is connected with the first node, a gate electrode of the first transistor is connected with a first electrode or a second electrode of the first transistor.

Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, a conductive feature on the substrate, and an electrical connection structure on the conductive feature. The electrical connection includes a first grain made of a first metal material, and a first inhibition layer made of a second metal layer that is different than the first metal material. The first inhibition layer extends vertically along a first side of a grain boundary of the first grain and laterally along a bottom of the grain boundary of the first grain.

Abstract: Presented are systems, methods, apparatuses, or computer-readable media for configuring reference signaling. A wireless communication device may determine a set of resources. A number of resources in the set may be equal to or more than one and the set satisfies a character. Each of the resources may be associated with a respective value of information.

Abstract: A golf teaching method and a golf teaching system are provided. The golf teaching method includes: configuring image capturing devices and golf simulator to capture swing images and corresponding simulator data records, when a user performs a golf swing; configuring an expert model that includes expert motion information and corresponding correction suggestion information; configuring a computing device to perform an analysis process on the swing images and the simulator data records to divide the golf swing into user motions according to stages and obtaining records of user motion information corresponding to the plurality of stages, and to compare the user motion information with the corresponding expert motion information in each stage through the expert model, and to provide the corresponding correction suggestion information according to a comparison result; and configuring a user interface to provide the correction suggestion information.

Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.

Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: An electronic device includes a flexible substrate, an anisotropic conductive film, and an electronic element. The flexible substrate includes an active area, a bonding pad, and a plurality of protrusions located on the bonding pad. The anisotropic conductive film includes a plurality of conductive particles. The conductive particles are in contact with the protrusions. The anisotropic conductive film is located between the bonding pad of the flexible substrate and the electronic element.

Abstract: Provided are a power control method and apparatus, and an electronic device, where the method includes: determining at least one piece of maximum transmit power-related information; and sending the at least one piece of maximum transmit power-related information to a first communication node, where each of the at least one piece of maximum transmit power-related information is related to a beam or a beam group.

Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.

Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.

Abstract: A mobile device attachment adapted for a mobile device and a container for food or liquid is provided. The mobile device attachment includes a magnetic connecting member and a connecting member. The magnetic connecting member is selectively magnetically connected to the mobile device and adapted to extend in an escaping direction. The connecting member is disposed between the container and the magnetic connecting member. The mobile device has an image capturing range. When the magnetic connecting member extends in the escaping direction, the container, the magnetic connecting member and the connecting member are located outside the image capturing range. Besides, a container including the mobile device attachment is also provided.

Abstract: A package structure is provided. The package structure includes a semiconductor die and a thermoelectric structure disposed on the semiconductor die. The thermoelectric structure includes P-type semiconductor blocks, N-type semiconductor blocks and metal pads. The P-type semiconductor blocks and the N-type semiconductor blocks are arranged in alternation with the metal pads connecting the P-type semiconductor blocks and the N-type semiconductor blocks. When a current flowing through one of the N-type semiconductor block, one of the metal pad, and one of the P-type semiconductor block in order, the metal pad between the N-type semiconductor block and the P-type semiconductor block forms a cold junction which absorbs heat generated by the semiconductor die.

Abstract: Methods and apparatuses for adjusting and controlling conditions within the environment of a workpiece handling module include sensors for detecting humidity and concentration of harmful gasses. Signals generated by these sensors are utilized to generate signals that control the flow of air into the environment and/or the flow of air and gases out of the environment. By controlling the humidity, negative impacts on processes carried out in the environment are avoided. By controlling the gas concentration, exposure of workers to harmful gases is avoided.