Abstract: A cavity forming method includes the steps of: providing the material modification processing device; according to the cavity topography of the workpiece, utilizing the material modification processing device to perform local modification including: calculating the laser-light shaping and scanning information, and based on the laser-light shaping and scanning information to have the optical axis adjustment unit to adjust positions of the laser-light shaping and scanning processing module and the processing stage, such that the area of the workpiece to be projected by the Bessel beam can be formed as the modified area; and, etching the modified area to form a cavity of the cavity topography. In additional, a material modification processing device is also provided.

Abstract: A semiconductor device includes a device layer, a semiconductor layer, a sensor element, a dielectric layer, a color filter layer, and a micro-lens. The semiconductor layer is over the device layer. The semiconductor layer has a plurality of microstructures thereon. Each of the microstructures has a substantially triangular cross-section. The sensor element is under the microstructures of the semiconductor layer and is configured to sense incident light. The dielectric layer is over the microstructures of the semiconductor layer. The color filter layer is over the dielectric layer. The micro-lens is over the color filter layer.

Abstract: An image sensor device is provided. The image sensor device includes a semiconductor substrate having a front surface, a back surface opposite to the front surface, and a light-sensing region close to the front surface. The image sensor device includes an insulating layer covering the back surface and extending into the semiconductor substrate. The protection layer has a first refractive index, and the first refractive index is less than a second refractive index of the semiconductor substrate and greater than a third refractive index of the insulating layer, and the protection layer conformally and continuously covers the back surface and extends into the semiconductor substrate. The image sensor device includes a reflective structure surrounded by insulating layer in the semiconductor substrate.

Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.

Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.

Abstract: A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.

Abstract: A light emission apparatus includes a laser diode configured to emit a light; a laser driver electrically coupled to the laser diode, the laser driver being configured to drive the laser diode to generate the light; and an optical module arranged to receive the light emitted by the laser diode, the optical module comprising at least one optical element and being configured to adjust the light and emits a transmitting light; wherein the transmitting light emits from the optical module with an illumination angle and the optical module adjusts the light to vary the illumination angle.

Abstract: A coffee filtering device includes a filtering cup, a grinding device, and a base. The filtering cup includes a first peripheral wall and a first bottom wall. First lateral filtering nets are disposed in the first peripheral wall. The first bottom wall includes a longitudinal hole and first lower filtering nets. The grinding device includes a blade unit disposed in the filtering cup and a transmission shaft coupled with the blade unit to rotate therewith. The base is disposed around the filtering cup and includes a second bottom wall connected to a lower end of a second peripheral wall which is coupled with the first peripheral wall of the filtering cup. Second lateral filtering nets are disposed in the second peripheral wall. The second bottom wall includes a longitudinal hole and second lower filtering nets. The transmission shaft extends through the longitudinal holes of the first and second bottom walls.

Abstract: A touch detection circuitry includes an analog-to-digital converter (ADC), a controller, and a packet generator. The ADC is arranged to convert touch signals of a touch panel from analog form into digital form. The controller is electrically connected to the ADC, and is configured to calculate at least one coordinate point and at least one touch size respectively corresponding to at least one touch event on the touch panel based on the touch signals. The packet generator is electrically connected to the controller, and is configured to encapsulate the at least one coordinate point and the at least one touch size into a touch data packet.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A vacuum apparatus includes process chambers, and a transfer chamber coupled to the process chambers. The transfer chamber includes one or more vacuum ports, thorough which a gas inside the transfer chamber is exhausted, and vent ports, from which a vent gas is supplied. The one or more vacuum ports and the vent ports are arranged such that air flows from at least one of the vent ports to the one or more vacuum ports are line-symmetric with respect to a center line of the transfer chamber.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: Methods of amplifying and determining a target nucleotide sequence are provided. The method of amplifying the target nucleotide sequence includes the following steps. A first adaptor and a second adaptor are linked to two ends of a double-stranded nucleic acid molecule with a target nucleotide sequence respectively to form a nucleic acid template, in which the first adaptor includes a Y-form adaptor or a hairpin adaptor and the second adaptor is a hairpin adaptor. Then, a PCR amplification cycle is performed on the nucleic acid template to obtain a PCR amplicon of the target nucleotide sequence.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: An information handling system may include an organic light-emitting diode (OLED) display layer of a video display to display an image to a user; an A-cover forming a housing behind the OLED display layer; and a physically bifurcated display daughter board between the OLED display layer and the A-cover, the physically bifurcated display daughter board including: a first portion of the display daughter board including a source driver integrated circuit (IC) operatively coupled to a processor to receive graphics data; and a second portion of the display daughter board comprising a power management integrated circuit (PMIC) operatively coupled to the first portion and a power source; the second portion of the display daughter board being mechanically coupled to an interior surface of the A-cover to dissipate heat away from the OLED display layer.

Abstract: A coffee filtering device includes a filtering cup, a grinding device, and a base. The filtering cup includes a first peripheral wall and a first bottom wall. First lateral filtering nets are disposed in the first peripheral wall. The first bottom wall includes a longitudinal hole and first lower filtering nets. The grinding device includes a blade unit disposed in the filtering cup and a transmission shaft coupled with the blade unit to rotate therewith. The base is disposed around the filtering cup and includes a second bottom wall connected to a lower end of a second peripheral wall which is coupled with the first peripheral wall of the filtering cup. Second lateral filtering nets are disposed in the second peripheral wall. The second bottom wall includes a longitudinal hole and second lower filtering nets. The transmission shaft extends through the longitudinal holes of the first and second bottom walls.

Abstract: A display device includes a light source arranged to emit light along a first edge of the display device, and aa light guide plate arranged go receive the emitted light at a minor surface of the light guide plate. The light guide plate includes prismatic elements configured to reemit the light out a first major surface of the light guide plate. A first region of the light guide plate has a first portion of the prismatic elements arranged in a first density to provide a first brightness of the reemitted light reemitted. A second region of the light guide plate has a second portion of the prismatic elements arranged in a second density to provide a second brightness of the reemitted light reemitted. The first region is provided substantially along a first edge of the first major surface, and the second region is provided along a second, a third, and a fourth edge of the first major surface. The first brightness is brighter than the second brightness.

Abstract: An information handling system may include an organic light-emitting diode (OLED) display layer of a video display to display an image to a user; an A-cover forming a housing behind the OLED display layer; and a physically bifurcated display daughter board between the OLED display layer and the A-cover, the physically bifurcated display daughter board including: a first portion of the display daughter board including a source driver integrated circuit (IC) operatively coupled to a processor to receive graphics data; and a second portion of the display daughter board comprising a power management integrated circuit (PMIC) operatively coupled to the first portion and a power source; the second portion of the display daughter board being mechanically coupled to an interior surface of the A-cover to dissipate heat away from the OLED display layer.

Abstract: An eMarker device is used in a cable electrically connected between a first port and a second port, wherein the cable includes a configuration channel communication wire. The eMarker device comprises: a first eMarker disposed near the first port and including a first active protection module coupled to the configuration channel communication wire, wherein the first eMarker is electrically connected to a first power pin of the first port and a second power pin of the second port; and a second eMarker disposed near the second port and including a second active protection module coupled to the configuration channel communication wire, wherein either of the first active protection module and the second active protection module changes an electric characteristic of the configuration channel communication wire to have the first port detect a disconnecting status of the second port when a specified event happens.

Abstract: For adjusting a signal transmission direction in a cable, which is configured to be electrically coupled between a first interface port and a second interface port, an electric characteristic on at least a first pin of the first interface port is detected. Then a signal transmission direction of at least one pair of differential signal transmission channels in the cable is controlled to change from a first direction to a second direction different from the first direction, provided that a communication protocol between the first interface port and the second interface port is changed from a first communication protocol to a second communication protocol, and the electric characteristic complies with a first condition.