Patents by Inventor Yu-Meng Lin

Yu-Meng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Separation apparatus and separation method
    Patent number: 8141611
    Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: March 27, 2012
    Assignee: HTC Corporation
    Inventors: Yao-Hsiang Lai, Ta-Cheng Liu, Jung-Hung Hung, Yu-Meng Lin, Kuo-Lung Yang
  • SEPARATION APPARATUS AND SEPARATION METHOD
    Publication number: 20100107834
    Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
    Type: Application
    Filed: April 9, 2009
    Publication date: May 6, 2010
    Applicant: HTC CORPORATION
    Inventors: Yao-Hsiang Lai, Ta-Cheng Liu, Jung-Hung Hung, Yu-Meng Lin, Kuo-Lung Yang