Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.

Abstract: A phototherapy device includes a base, at least one light conversion device and a light source module. The base has an installation slot. The light conversion device is detachably arranged in the installation slot. Each light conversion device includes a plurality of light conversion patterns. The light source module is arranged on a side of the base and configured to provide an excitation beam to the light conversion patterns, so that each of the light conversion patterns emits a converted beam. In this way, the light conversion device of the phototherapy device can be replaced according to the user's needs.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.

Abstract: An example electronic device includes a controller to determine a user touch detection by a power adaptor coupled to the electronic device to operate the electronic device in an AC power mode. The power adaptor may comprise a proximity sensor to detect a user touch for detachment of the power adaptor from the electronic device, and a control circuit to operate a configuration pin in a low output mode to signal user touch detection. The controller may initiate central processing unit (CPU) throttling to reduce power consumption by the electronic device. The controller may further stop CPU throttling in response to detecting that the power adaptor has been detached from the electronic device. Further, the controller may switch the electronic device to a DC power mode to operate using DC power supplied by a battery of the electronic device in response to power adaptor detachment.

Abstract: A collection and test device for a rapid test is provided. The device comprises a test fluid accommodation part having a test fluid accommodation space, a test paper accommodation part having a test paper accommodation space, and a collection probe having a channel for the test fluid to flow out from the collection probe. The two ends of the test paper accommodation part are respectively connected to the test fluid accommodation part and the collection probe, and the test paper accommodation space communicates with the channel of the collection probe. The test fluid accommodation space and the test paper accommodation space are separated from each other by a temporary barrier. The temporary barrier can be manually removed or broken to make the test fluid accommodation space communicate with the test paper accommodation space. The device of the present invention can provide the test results conveniently and rapidly.

Abstract: A real-time system adapted to a PVD apparatus for monitoring and controlling film uniformity is described. The system includes a shielding plate, a monitoring device, and a data processing program. The shielding plate is disposed on an inner wall of a reaction chamber above a wafer stage. An opening in the center of the shielding plate exposes the wafer. The monitoring device including a scanner and a sensor respectively disposed on opposite sidewalls of the reaction chamber between the shielding plate and the wafer stage is used for measuring the flux of the particles on every portion of the wafer to acquire real-time uniformity data including a function of the wafer position and the flux. The data processing program compares the real-time uniformity data and reference uniformity data, and a feedback signal is outputted to the PVD apparatus to adjust the process parameter thereof for controlling film uniformity.

Abstract: An integrated circuit device comprises a substrate, a stack structure including circuit structure having conductive lines positioned on the substrate, a reinforcement structure including at least one supporting member positioned on the substrate and a roof covering the circuit structure and the supporting member and at least one bonding pad positioned on the roof and electrically connected to the conductive lines. A method for preparing an integrated circuit device comprises forming a stack structure including circuit structure having conductive lines on a substrate, forming a reinforcement structure including at least one supporting member on the substrate and a roof covering the supporting member and the circuit structure and forming at least one bonding pad on the roof and electrically connecting to the conductive lines.

Abstract: An integrated circuit device comprises a substrate, a stack structure including circuit structure having conductive lines positioned on the substrate, a reinforcement structure including at least one supporting member positioned on the substrate and a roof covering the circuit structure and the supporting member and at least one bonding pad positioned on the roof and electrically connected to the conductive lines. A method for preparing an integrated circuit device comprises forming a stack structure including circuit structure having conductive lines on a substrate, forming a reinforcement structure including at least one supporting member on the substrate and a roof covering the supporting member and the circuit structure and forming at least one bonding pad on the roof and electrically connecting to the conductive lines.

Abstract: A real-time system adapted to a PVD apparatus for monitoring and controlling film uniformity is described. The system includes a shielding plate, a monitoring device, and a data processing program. The shielding plate is disposed on an inner wall of a reaction chamber above a wafer stage. An opening in the center of the shielding plate exposes the wafer. The monitoring device including a scanner and a sensor respectively disposed on opposite sidewalls of the reaction chamber between the shielding plate and the wafer stage is used for measuring the flux of the particles on every portion of the wafer to acquire real-time uniformity data including a function of the wafer position and the flux. The data processing program compares the real-time uniformity data and reference uniformity data, and a feedback signal is outputted to the PVD apparatus to adjust the process parameter thereof for controlling film uniformity.

Abstract: A gas delivering system for an in situ thermal treatment, a thin film deposition and a use of the same are provided. The gas delivering system integrates a thermal treatment system therein so that a thin film deposition and a by rapid thermal annealing can be performed alternatively on a wafer in a reaction chamber. Accordingly, the density of the thin film can be improved and the thermal budget of the process can be reduced.

Abstract: A collapsible container includes a cylindrical sidewall extending between a top and a bottom of the container. The sidewall is formed of a flexible material which enables the container to be opened to an expanded configuration or closed to a collapsed configuration. A coil spring biases the container to the open configuration. The coil spring has a top coil adjacent the top of the container and a bottom coil adjacent the bottom of the container. A durable bottom layer is affixed to the bottom of the container by stitches.

Abstract: A collapsible container includes a cylindrical sidewall extending between a top and a bottom of the container. The sidewall is formed of a flexible material which enables the container to be opened to an expanded configuration or closed to a collapsed configuration. A coil spring biases the container to the open configuration. The coil spring has a top coil adjacent the top of the container and a bottom coil adjacent the bottom of the container. A durable bottom layer is affixed to the bottom of the container by at least one clamp.

Abstract: A collapsible container includes a cylindrical sidewall extending between a top and a bottom of the container. The sidewall is formed of a flexible material which enables the container to be opened to an expanded configuration or closed to a collapsed configuration. A coil spring biases the container to the open configuration. The coil spring has a top coil adjacent the top of the container and a bottom coil adjacent the bottom of the container. A durable bottom layer is affixed to the bottom of the container by at least one clamp.