Abstract: A method for determining a collision distance includes receiving a series of data points from a second vehicle that were during the second vehicle driving on a historical path, the data points contain path information and steering wheel angle, the path information contains position information; determining whether the first vehicle is located within a preset area range corresponding to the second vehicle using a series of positions of the second vehicle and the current position of the first vehicle; if the first vehicle is currently located within the preset area range, determining a lane change state of the second vehicle in the historical path according to the steering wheel angle, the lane change state represents the second vehicle changing lanes; and determining the collision distance between the vehicles according to the lane change state, the current position of the first vehicle, and the series of data points.

Abstract: The present invention relates to a groundwater circulation well system with pressure-adjustable hydrodynamic cavitation, including a circulation well body, a sucked and injected water circulation assembly and a hydrodynamic cavitator. The sucked and injected water circulation assembly is based on a water suction and injection pump. The hydrodynamic cavitator is provided, inside a vortex chamber, with a vortex water inlet column capable of changing a water passing aperture. The hydrodynamic cavitator is capable of changing a bubbling pressure and a breaking pressure of hydrodynamic cavitation bubbles in the vortex water inlet column. The hydrodynamic cavitator generates vortices in the circulation well body to accelerate uniform mixing of a remediation agent and the groundwater. Energy from collapsing and bursting of the hydrodynamic cavitation bubbles activates the remediation agent such that contaminants in the groundwater are efficiently degraded.

Abstract: A buffered negative electrode-electrolyte assembly includes: a porous negative electrode comprising a metal, a transition metal nitride, or a combination thereof; a solid-state electrolyte; and a buffer layer between the porous negative electrode and the solid-state electrolyte. The buffer layer comprising a buffer composition according to Formula (1) MmNnZzHhXx. The buffer composition has an electronic conductivity that is less than or equal to 1×10-2 times an electronic conductivity of the solid-state electrolyte, and the buffer composition has an ionic conductivity less than or equal to 1×10-6 times an ionic conductivity of the solid-state electrolyte.

Abstract: A buffered negative electrode-electrolyte assembly includes: a porous negative electrode comprising a metal, a transition metal nitride, or a combination thereof; a solid-state electrolyte; and a buffer layer between the porous negative electrode and the solid-state electrolyte. The buffer layer comprising a buffer composition according to Formula (1) MmNnZzHhXx. The buffer composition has an electronic conductivity that is less than or equal to 1×10?2 times an electronic conductivity of the solid-state electrolyte, and the buffer composition has an ionic conductivity less than or equal to 1×10?6 times an ionic conductivity of the solid-state electrolyte.

Abstract: An anode includes a mixed ionic-electronic conductor (MIEC) with an open pore structure. The open pore structure includes open pores to facilitate motion of an alkali metal into and/or out of the MIEC. The open pore structure thus provides open space to relieve the stresses generated by the alkali metal when charging/discharging a battery. The MIEC is formed from a material that is thermodynamically and electrochemically stable against the alkali metal to prevent the formation of solid-electrolyte interphase (SEI) debris and the formation of dead alkali metal. The MIEC may also be passive (the MIEC does not store or release alkali metal). In one example, the open pore structure may be an array of substantially aligned tubules with a width less than about 300 nm, a wall thickness between about 1 nm to about 30 nm, and a height of at least 10 um arranged as a honeycomb.

Abstract: A mixed ionic-electronic conductor (MIEC) in contact with a solid electrolyte includes a material having a bandgap less than 3 eV. The material includes an end-member phase directly connected to an alkali metal by a tie-line in an equilibrium phase diagram. The material is thermodynamically stable with a solid electrolyte. The MIEC includes plurality of open pores, formed within the MIEC, to facilitate motion of the alkali metal to at least one of store the alkali metal in the plurality of open pores or release the alkali metal from the plurality of open pores. The solid electrolyte has an ionic conductivity to ions of the alkali metal greater than 1 mS cm?1, a thickness less than 100 ?m, and comprises at least one of a ceramic or a polymer.

Abstract: A buffered negative electrode-electrolyte assembly includes: a porous negative electrode comprising a metal, a transition metal nitride, or a combination thereof; a solid-state electrolyte; and a buffer layer between the porous negative electrode and the solid-state electrolyte. The buffer layer comprising a buffer composition according to Formula (1) MmNnZzHhXx. The buffer composition has an electronic conductivity that is less than or equal to 1×10?2 times an electronic conductivity of the solid-state electrolyte, and the buffer composition has an ionic conductivity less than or equal to 1×10?6 times an ionic conductivity of the solid-state electrolyte.

Abstract: An anode includes a mixed ionic-electronic conductor (MIEC) with an open pore structure. The open pore structure includes open pores to facilitate motion of an alkali metal into and/or out of the MIEC. The open pore structure thus provides open space to relieve the stresses generated by the alkali metal when charging/discharging a battery. The MIEC is formed from a material that is thermodynamically and electrochemically stable against the alkali metal to prevent the formation of solid-electrolyte interphase (SEI) debris and the formation of dead alkali metal. The MIEC may also be passive (the MIEC does not store or release alkali metal). In one example, the open pore structure may be an array of substantially aligned tubules with a width less than about 300 nm, a wall thickness between about 1 nm to about 30 nm, and a height of at least 10 um arranged as a honeycomb.

Abstract: A light-emitting diode (LED) lighting fixture is provided as a potential solid state lighting (SSL) replacement fixture for a conventional HID lamp fixture. The LED lighting fixture includes a main housing having a bottom surface supporting an array of LEDs, a top surface and sides, and at least one driver provided in a side housing attached to a side of the main housing to drive the LED array. The thickness of the side housing is equal to or greater than the thickness of the main housing. A plurality of heat spreading fins is arranged on the top surface of the main housing.

Abstract: A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.

Abstract: A light-emitting diode (LED) lighting fixture is provided as a potential solid state lighting (SSL) replacement fixture for a conventional HID lamp fixture. The LED lighting fixture includes a main housing having a bottom surface supporting an array of LEDs, a top surface and sides, and at least one driver provided in a side housing attached to a side of the main housing to drive the LED array. The thickness of the side housing is equal to or greater than the thickness of the main housing. A plurality of heat spreading fins is arranged on the top surface of the main housing.

Abstract: A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.

Abstract: A light-emitting diode (LED) lighting fixture is provided as a potential solid state lighting (SSL) replacement fixture for a conventional HID lamp fixture. The LED lighting fixture includes a main housing having a bottom surface supporting an array of LEDs, a top surface and sides, and at least one driver provided in a side housing attached to a side of the main housing to drive the LED array. The thickness of the side housing is equal to or greater than the thickness of the main housing. A plurality of heat spreading fins is arranged on the top surface of the main housing.

Abstract: A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.

Abstract: A light-emitting diode (LED) lighting fixture is provided as a potential solid state lighting (SSL) replacement fixture for a conventional HID lamp fixture. The LED lighting fixture includes a main housing having a bottom surface supporting an array of LEDs, a top surface and sides, and at least one driver provided in a side housing attached to a side of the main housing to drive the LED array. The thickness of the side housing is equal to or greater than the thickness of the main housing. A plurality of heat spreading fins is arranged on the top surface of the main housing.

Abstract: A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.

Abstract: A light emitting diode (LED) light bulb that includes plural individual elements as sub-assembly elements of the overall light bulb. Different sub-assembly elements of a lens, a LED printed circuit board, a housing also functioning as a heat sink, a lower housing, and other individual sub-assembly components are utilized. The LED printed circuit board sub-assembly containing the LEDs can also be provided relatively close to a base.

Abstract: A light emitting diode (LED) light bulb that includes plural individual elements as sub-assembly elements of the overall light bulb. Different sub-assembly elements of a lens, a LED printed circuit board, a housing also functioning as a heat sink, a lower housing, and other individual sub-assembly components are utilized. The LED printed circuit board sub-assembly containing the LEDs can also be provided relatively close to a base.