Abstract: Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gate material to a recessed surface, wherein the recessed surface includes a first horn at a first edge, a second horn at a second edge, and a valley located between the first horn and the second horn; depositing an etch-retarding layer over the recessed surface, wherein the etch-retarding layer has a central region over the valley and has edge regions over the horns, and wherein the central region of the etch-retarding layer is thicker than the edge regions of the etch-retarding layer; and performing a second etch process to recess the horns to establish the gate material with a desired profile.

Abstract: A semiconductor device is disclosed. The semiconductor device includes a semiconductor fin. The semiconductor device includes first spacers over the semiconductor fin. The semiconductor device includes a metal gate structure, over the semiconductor fin, that is sandwiched at least by the first spacers. The semiconductor device includes a gate electrode contacting the metal gate structure. An interface between the metal gate structure and the gate electrode has its side portions extending toward the semiconductor fin with a first distance and a central portion extending toward the semiconductor fin with a second distance, the first distance being substantially less than the second distance.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A lance for feeding an additive wire into a quantity of molten metal below the surface of the molten metal. The lance has an inlet end which receives additive wire and an outlet end which dispenses the additive wire. The lance has an exterior sleeve of cardboard which has an inner surface. A portion of the inner surface of the exterior sleeve contacts an interior sleeve made of a refractory material. At the inlet end of the lance is a cardboard inlet outer sleeve and a cardboard inlet inner sleeve inside of the outer sleeve. The lance can have a coupling for fitting to a wire feeding apparatus.

Abstract: A lance for feeding an additive wire into a quantity of molten metal below the surface of the molten metal. The lance has an inlet end which receives additive wire and an outlet end which dispenses the additive wire. The lance has an exterior sleeve of cardboard which has an inner surface. A portion of the inner surface of the exterior sleeve contacts an interior sleeve made of a refractory material. At the inlet end of the lance is a cardboard inlet outer sleeve and a cardboard inlet inner sleeve inside of the outer sleeve. The lance can have a coupling for fitting to a wire feeding apparatus.

Abstract: The punching and riveting tool includes a pipe shaft, an energy storage spring, a weight control rod, a front cap, a collision head, a punching head, a rear cap, a pressing button, a binding spring and a lock nut. The pipe shaft is in the shape of a hollow pipe, and two ends of the energy storage spring are linked with the weight control rod and the collision head respectively. The collision head is configured with a collision part on the upper end, and a binding slot on the lower end, and the punching head is configured on the bottom end of the collision head. The pressing button is configured with a go-through part and a binding part, and the binding spring with the pressing button are configured in the counterbore of the rear cap. The lock nut is linked onto the tail end of the weight control rod.