Patents by Inventor Yu Pan
Yu Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11984372Abstract: A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.Type: GrantFiled: July 28, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Teng-Yuan Lo, Lipu Kris Chuang, Hsin-Yu Pan
-
Patent number: 11981604Abstract: A concrete crack repair material based on nano materials includes raw materials as follows: seaweed, sulphoaluminate cement, natural sand, nano-silica fume, calcium formate, fly ash, anhydrous calcium sulphoaluminate, a polyester fiber, a water reducing agent, a corrosion inhibitor and water. By reasonably selecting the raw materials of the concrete crack repair material and making a reasonable ratio of the raw materials, the concrete crack repair material is obtained with excellent performance such as good compressive strength, bending strength and bond strength, and excellent impermeability and frost resistance. The concrete crack repair material can be used for the concrete crack repair in the marine environment, which has very important application values.Type: GrantFiled: May 12, 2023Date of Patent: May 14, 2024Assignee: NingboTech UniversityInventors: Chonggen Pan, Yu Hu, Shiyang Qu, Jiawei Zang
-
Publication number: 20240150354Abstract: The present application provides tricyclic urea compounds that modulate the activity of the V617F variant of JAK2, which are useful in the treatment of various diseases, including cancer.Type: ApplicationFiled: August 24, 2023Publication date: May 9, 2024Inventors: Yanran Ai, Onur Atasoylu, Yu Bai, Joseph Barbosa, David M. Burns, Daniel Levy, Brent Douty, Hao Feng, Leah C. Konkol, Cheng-Tsung Lai, Xun Liu, Song Mei, Jun Pan, Haisheng Wang, Liangxing Wu, Wenqing Yao, Eddy W. Yue
-
Publication number: 20240154517Abstract: A soft-switching power converter includes a main switch, an energy-releasing switch, and an inductive coupled unit. The main switch is a controllable switch. The energy-releasing switch is coupled to the main switch. The inductive coupled unit is coupled to the main switch and the energy-releasing switch. The inductive coupled unit includes a first inductance, a second inductance coupled to the first inductance, and an auxiliary switch unit. The auxiliary switch unit is coupled to the second inductance to form a closed loop. The main switch and the energy-releasing switch are alternately turned on and turned off. The auxiliary switch unit is controlled to start turning on before the main switch is turned on so as to provide at least one current path.Type: ApplicationFiled: January 12, 2024Publication date: May 9, 2024Inventors: Hung-Chieh LIN, Yi-Ping HSIEH, Jin-Zhong HUANG, Hung-Yu HUANG, Chih-Hsien LI, Ciao-Yin PAN
-
Publication number: 20240135892Abstract: Disclosed are a method for adjusting a signal of a display panel, a time controller integrated circuit, a display panel, and a storage medium. The method includes: converting first data into a first data voltage signal using a first data voltage, in response to a set condition being reached, sending the first data voltage signal to a chip on film integrated circuit, the chip on film integrated circuit identifies the first data voltage signal to obtain a second data; acquiring the second data from the chip on film integrated circuit, determining that the chip on film integrated circuit fails to identify the first data in response to the second data being different from the first data; and adjusting the first data voltage until a second data voltage signal converted from the first data using a second data voltage after adjustment being successfully identified by the chip on film integrated circuit.Type: ApplicationFiled: March 3, 2021Publication date: April 25, 2024Inventors: Yunlu CHEN, Changcheng LIU, Liugang ZHOU, Liu HE, Kun YANG, Jianwei SUN, Jun WANG, Yunyun LIANG, Qing LI, Yu QUAN, Yanting HUANG, Zhengru PAN, Bingbing YAN, Jiantao LIU
-
Patent number: 11967898Abstract: A soft-switching power converter includes a main switch, an energy-releasing switch, and an inductive coupled unit. The main switch is a controllable switch. The energy-releasing switch is coupled to the main switch. The inductive coupled unit is coupled to the main switch and the energy-releasing switch. The inductive coupled unit includes a first inductance, a second inductance coupled to the first inductance, and an auxiliary switch unit. The auxiliary switch unit is coupled to the second inductance to form a closed loop. The main switch and the energy-releasing switch are alternately turned on and turned off. The auxiliary switch unit is controlled to start turning on before the main switch is turned on so as to provide at least one current path.Type: GrantFiled: January 6, 2022Date of Patent: April 23, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Hung-Chieh Lin, Yi-Ping Hsieh, Jin-Zhong Huang, Hung-Yu Huang, Chih-Hsien Li, Ciao-Yin Pan
-
Publication number: 20240128232Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.Type: ApplicationFiled: December 28, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung-Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan
-
Patent number: 11954011Abstract: An apparatus and a method for executing a customized production line using an artificial intelligence development platform, a computing device and a computer readable storage medium are provided. The apparatus includes: a production line executor configured to generate a native form of the artificial intelligence development platform based on a file set, the native form to be sent to a client accessing the artificial intelligence development platform so as to present a native interactive page of the artificial intelligence development platform; and a standardized platform interface configured to provide an interaction channel between the production line executor and the artificial intelligence development platform. The production line executor is further configured to generate an intermediate result by executing processing logic defined in the file set and to process the intermediate result by interacting with the artificial intelligence development platform via the standardized platform interface.Type: GrantFiled: October 28, 2020Date of Patent: April 9, 2024Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.Inventors: Yongkang Xie, Ruyue Ma, Zhou Xin, Hao Cao, Kuan Shi, Yu Zhou, Yashuai Li, En Shi, Zhiquan Wu, Zihao Pan, Shupeng Li, Mingren Hu, Tian Wu
-
Publication number: 20240112465Abstract: Various embodiments of the teachings herein include an image processing system comprising: a video stream processing device configured to receive a video stream, segment the video stream into multiple frames of pictures arranged in chronological order, and distribute the multiple frames of pictures to edge computing devices in a connected edge computing device group; and a picture collecting device configured to receive pictures from the edge computing device group. The individual edge computing devices in the edge computing device group are each configured to subject the received pictures to target identification, and send the pictures marked with a region in which an identified target is located. The picture collecting device is further configured to restore in chronological order as a video stream the received pictures marked with target identification results.Type: ApplicationFiled: January 18, 2022Publication date: April 4, 2024Applicant: Siemens AktiengesellschaftInventors: Yue Yu, Chang Wei Loh, Wei Yu Chen, Tian Hua Pan, Sheng Bo Hu
-
Publication number: 20240109919Abstract: The present invention disclosure also relates to a pharmaceutical composition that ccomprises the compound as an active ingredient.Type: ApplicationFiled: November 15, 2023Publication date: April 4, 2024Inventors: Qianjiao Yang, Song Shan, Lijun Xin, Desi Pan, Xiaoliang Wang, Yonglian Song, Yu Zhang, Huiyun Huang, Qi Wei, Zhibin Li, Xianping Lu
-
Patent number: 11948068Abstract: The present invention discloses a brain machine interface decoding method based on spiking neural network, comprising: (1) constructing a liquid state machine model based on a spiking neural network, the liquid state machine model consists of an input layer, an middle layer and an output layer, wherein, a connection weight from the input layer to the middle layer is Whh, a loop connection weight inside the middle layer is Whh, a readout weight from the middle layer to the output layer is Wyh; (2) Inputting a neuron spike train signal, and training each weight with the following strategy: (2-1) Using STDP without supervision to train the connection weight Whh from the input layer to the middle layer; (2-2) Setting the loop connection weight Whh inside the middle layer by means of distance model and random connection, and obtaining a middle layer liquid information R(t); (2-3) Using ridge regression with supervision to train the readout weight Wyh from the middle layer to the output layer, and establishing a maType: GrantFiled: October 27, 2021Date of Patent: April 2, 2024Assignee: ZHEJIANG UNIVERSITYInventors: Yu Qi, Tao Fang, Gang Pan, Yueming Wang
-
Patent number: 11948627Abstract: A write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.Type: GrantFiled: August 9, 2022Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hidehiro Fujiwara, Chih-Yu Lin, Sahil Preet Singh, Hsien-Yu Pan, Yen-Huei Chen, Hung-Jen Liao
-
Patent number: 11945542Abstract: Disclosed is an express tricycle target object, falling within the field of intelligent connected vehicle (ICV) test equipment. A base plate, vehicle body support plates, two lateral support plates, a vehicle head support plate, several locking mechanisms and skins are included. The vehicle body support plates, the lateral support plates and the vehicle head support plate are assembled into the shape of the express tricycle target object via the locking mechanisms, and different parts of the skins are arranged with wave-absorbing sponges to reduce a radar cross section or with metal substances to enhance a radar cross section, to solve the problem of the insufficient coverage of traffic accident scenes in current tests of the active safety performance of ICVs.Type: GrantFiled: November 28, 2023Date of Patent: April 2, 2024Assignees: China Automotive Engineering Research Institute Co., Ltd., Intelligent Connected Technology of CAERI Co., Ltd.Inventors: Xinming Wan, Qiang Zhang, Xin Zhang, Yu Tang, Tao Chen, Wei Pan, Yi Li
-
Publication number: 20240103378Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Inventors: Tai-Yu CHEN, Tzu-Jung PAN, Kuan-Hung CHEN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
-
Patent number: 11942442Abstract: A package structure includes a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is sandwiched between and electrically coupled to the first redistribution circuit structure and the second redistribution circuit structure. The waveguide structure is located aside and electrically coupled to the semiconductor die, wherein the waveguide structure includes a part of the first redistribution circuit structure, a part of the second redistribution circuit structure and a plurality of first through vias each connecting to the part of the first redistribution circuit structure and the part of the second redistribution circuit structure. The antenna is located on the semiconductor die, wherein the second redistribution circuit structure is sandwiched between the antenna and the semiconductor die, and the antenna is electrically communicated with the semiconductor die through the waveguide structure.Type: GrantFiled: October 26, 2020Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sen-Kuei Hsu, Hsin-Yu Pan
-
Patent number: 11942448Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive pad having a generally planar top surface that includes a cavity having a bottom surface and sidewalls extending from the bottom surface of the cavity to the top surface of the pad. An electronic device is attached to the top surface of the electrically conductive pad. A wire bond is attached from the electronic device to the bottom surface of the cavity. A molding compound encapsulates the electronic device.Type: GrantFiled: July 16, 2021Date of Patent: March 26, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Bo-Hsun Pan, Hung-Yu Chou, Chung-Hao Lin, Yuh-Harng Chien
-
Patent number: 11938567Abstract: A laser fusion welding device includes a 1.9 ?m laser light source, a control unit and a light spot adjusting device. The control unit is configured to control the laser light source and the light spot adjusting device to adjust a laser power density at an object to be subjected to fusion welding. The 1.9 ?m laser light source has output power of 100-500 W. The control unit includes a time control unit, a power control unit and a light spot control unit. The time control unit is configured to control a turn-on time of the laser light source. The power control unit is configured to control the output power of the laser light source. The light spot control unit is configured to control the light spot adjusting device to adjust a size of a light spot at the object to be subjected to fusion welding.Type: GrantFiled: July 11, 2023Date of Patent: March 26, 2024Assignee: XINJIANG TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY, CHINESE ACADEMY OF SCIENCESInventors: Linjun Li, Shilie Pan, Xiaoming Duan, Yu Zhou, Yingjie Shen, Qianqian Hao, Yuqiang Yang, Xin He
-
Publication number: 20240098544Abstract: Systems and methods for indicating positioning information in wireless communication systems are disclosed. In one aspect, a method includes receiving, by a wireless communication device from a network, network timing error information; and reporting, by the wireless communication device to the network, downlink measurement results and User Equipment (UE) timing error information, wherein, the network timing error information comprises at least one of Transmission and Reception Point (TRP) transmission Timing Error Group (TEG) information and TRP reception TEG information; the UE timing error information comprises at least one of UE transmission TEG information and UE reception TEG information.Type: ApplicationFiled: August 30, 2023Publication date: March 21, 2024Applicant: ZTE CORPORATIONInventors: Yu PAN, Guozeng ZHENG, Chuangxin JIANG, Shujuan ZHANG, Zhaohua LU
-
Patent number: 11937266Abstract: A method and apparatus are disclosed. In an example from the perspective of a first device, a grant is received from a network node. The grant allocates a set of sidelink data resources. One or more sidelink data transmissions are performed on the set of sidelink data resources. A second feedback information associated with the one or more sidelink data transmissions is received and/or detected. An uplink resource is derived. A first feedback information is transmitted on the uplink resource to the network node. The first feedback information is set based upon the second feedback information.Type: GrantFiled: October 17, 2022Date of Patent: March 19, 2024Assignee: ASUSTek Computer Inc.Inventors: Ming-Che Li, Li-Chih Tseng, Wei-Yu Chen, Li-Te Pan
-
Patent number: D1022669Type: GrantFiled: May 12, 2023Date of Patent: April 16, 2024Assignee: Hangzhou Jeep tower Clothing Enterprises Co., Ltd.Inventors: Yu Pan, Michael Alexander Mayer