Abstract: The disclosure relates to a quantum dot structure. The quantum dot structure includes a quantum dot and a cloud-like shell covering a portion of the quantum dot and having an irregular outer surface. The quantum dot includes: a core; a first shell discontinuously around a core surface of the core; and a second shell between the core and the first shell and encapsulating the core surface of the core, wherein the second shell has an irregular outer surface.

Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A cleaning process monitoring system, comprising: a cleaning container comprising an inlet for receiving a cleaning solution and an outlet for draining a waste solution; a particle detector coupled to the outlet and configured to measure a plurality of particle parameters associated with the waste solution so as to provide a real-time monitoring of the cleaning process; a pump coupled to the cleaning container and configured to provide suction force to draw solution through the cleaning system; a controller coupled to the pump and the particle detector and configured to receive the plurality of particle parameters from the particle detector and to provide control to the cleaning system; and a host computer coupled to the controller and configured to provide at least one control parameter to the controller.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: The invention discloses a glass-ceramic composition, a slurry, and a method for manufacturing a dielectric ceramic component with high frequency. The glass-ceramic composition comprises 5-30 wt % of aluminum oxide and 70-95 wt % of BiZnBSiAl glass. The invention mixes the glass-ceramic composition with an organic carrier to make a slurry, processes the slurry into green body, and then densities the green body to obtain dielectric ceramic component with high frequency, which can be sintered and densified under low temperature. Accordingly, the product of quality factor and resonance frequency of the component can meet the requirements of high quality factor and dielectric constant for industries.

Abstract: A co-fired ceramic module includes a ceramic substrate and at least one heat-emitting device. The ceramic substrate has at least one high thermal conductivity material. The heat-emitting device is disposed on the ceramic substrate. The substrate further includes a cavity and the heat-emitting device is disposed in the cavity.

Abstract: A ceramic circuit board and a manufacturing method thereof are disclosed. The method includes the steps of providing a first pre-mold plate and a first ceramic thin plate, stacking the first ceramic thin plate and the first pre-mold plate, and co-firing the first ceramic thin plate and the first pre-mold plate to commonly form the ceramic circuit board.

Abstract: A multi-layer ceramic substrate with an embedded cavity and a manufacturing method thereof are disclosed. The method includes the steps of: providing at least one ceramic thin plate and at least one ceramic pre-mold plate having a surface formed with a conductive layer; stacking the ceramic thin plate and the ceramic pre-mold plate to form a stacked structure with at least one embedded cavity; and sintering the stacked structure.

Abstract: A light-emitting device is provided and includes a circuit, at least one heat-conducting member, a plurality of light-emitting elements, at least one heat-dissipating member and a power supply. The circuit board has at least one trench for the heat-conducting member to be disposed. The plurality of light-emitting element is disposed on the heat-conducting member. The heat dissipating member is disposed on the circuit board and connected to the heat-conducting member. The power supply, is electrically connected with the circuit board to provide the power of the light-emitting elements.

Abstract: A concentration photovoltaic module includes a substrate, a first electrode, a second electrode, a solar cell, at least one electrical connecting element and a frame. The first electrode and the second electrode are disposed in different predetermined positions of the substrate to form a first electrode and a second electrode, respectively. The solar cell is disposed on the first electrode. The electrical connecting element electrically interconnects the second electrode and the solar cell. The frame straddles on the substrate, wherein the solar cell is located in the frame.

Abstract: A fabricating method for a ceramic substrate includes the steps of: providing a ceramic thin plate and a pre-mold plate; stacking the ceramic thin plate and the pre-mold plate together; and sintering the ceramic thin plate and the pre-mold plate, both of which jointly form the ceramic substrate. Also, a ceramic substrate composed of a ceramic thin plate and a pre-mold plate is disclosed. The ceramic substrate is an LTCC substrate, and the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive including crystallized or non-crystallized glass or a glass ceramic, or the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.

Abstract: A fabricating method of a ceramic thin plate includes the steps of providing at least one first pre-mold plate and at least two second pre-mold plates; stacking up the first pre-mold plate and the second pre-mold plates so that the first pre-mold plate is disposed and sandwiched between the two second pre-mold plates; and sintering the first pre-mold plate and the second pre-mold plates at the sintering temperature of the first pre-mold plate so as to make the first pre-mold plate to form the ceramic thin plate. The sintering temperature of the second pre-mold plate is higher than that of the first pre-mold plate.

Abstract: A light-emitting heat-dissipating device includes a substrate and at least a light-emitting package module capable of generating heat. The substrate includes at least a recess and at least one thermally conducting element disposed in the recess. The light-emitting package module is disposed on the thermally conducting element and electrically connected to the substrate of the substrate via solder joints. A manufacturing method of the light-emitting heat-dissipating device is also disclosed.

Abstract: A light-emitting heat-dissipating device includes at least one light-emitting chip and a circuit board. The circuit board has at least one recess and at least one thermally conducting element disposed in the recess. The light-emitting chip is disposed on the thermally conducting element and connected to the circuit board via contact pads electrically connected to a circuit layout of the circuit board. In addition, the light-emitting chip is package by a filler on the circuit board. A packaging method of the light-emitting heat-dissipating device is also disclosed.

Abstract: A dielectric glass-ceramic substrate composed of a dielectric glass-ceramic composition is disclosed. The dielectric glass-ceramic composition includes a ceramic material and a Ba—B—Si glass material. Also, a method of manufacturing a dielectric glass-ceramic substrate includes steps of: mixing a ceramic material and a Ba—B—Si glass material with an organic carrier, forming the ceramic material, the Ba—B—Si glass material and the organic carrier as a pre-mold; and firing the pre-mold to form the dielectric glass-ceramic substrate at a low temperature.