Patents by Inventor Yu-Sheng Chiu
Yu-Sheng Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978392Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.Type: GrantFiled: May 31, 2023Date of Patent: May 7, 2024Assignee: NOVATEK Microelectronics Corp.Inventors: Min-Yang Chiu, Yu-Sheng Ma, Jin-Yi Lin, Hsuan-Yu Chen, Jhih-Siou Cheng, Chun-Fu Lin
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Patent number: 11961768Abstract: A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.Type: GrantFiled: May 5, 2023Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ya-Wen Chiu, Da-Yuan Lee, Hsien-Ming Lee, Kai-Cyuan Yang, Yu-Sheng Wang, Chih-Hsiang Fan, Kun-Wa Kuok
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Patent number: 11963369Abstract: The present disclosure relates to an integrated circuit. The integrated circuit has a plurality of bit-line stacks disposed over a substrate and respectively including a plurality of bit-lines stacked onto one another. A data storage structure is over the plurality of bit-line stacks and a selector is over the data storage structure. A word-line is over the selector. The selector is configured to selectively allow current to pass between the plurality of bit-lines and the word-line. The plurality of bit-line stacks include a first bit-line stack, a second bit-line stack, and a third bit-line stack. The first and third bit-line stacks are closest bit-line stacks to opposing sides of the second bit-line stack. The second bit-line stack is separated from the first bit-line stack by a first distance and is further separated from the third bit-line stack by a second distance larger than the first distance.Type: GrantFiled: July 27, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Li Chiang, Chao-Ching Cheng, Jung-Piao Chiu, Tzu-Chiang Chen, Yu-Sheng Chen
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Publication number: 20240111210Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.Type: ApplicationFiled: May 9, 2023Publication date: April 4, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TSING HUA UNIVERSITYInventors: Jui-Hsiung LIU, Pin-Chia LIAO, Ting-An LIN, Ting-An SHIH, Yu-Fang TSENG, Burn Jeng LIN, Tsai-Sheng GAU, Po-Hsiung CHEN, Po-Wen CHIU
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Publication number: 20240112912Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (Al) or formula (A2): Zr12O8(OH)14(RCO2)18??Formula (A1); or Hf6O4(OH)6(RCO2)10??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.Type: ApplicationFiled: July 28, 2023Publication date: April 4, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TSING HUA UNIVERSITYInventors: Jui-Hsiung LIU, Yu-Fang TSENG, Pin-Chia LIAO, Burn Jeng LIN, Tsai-Sheng GAU, Po-Hsiung CHEN, Po-Wen CHIU
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Patent number: 11943609Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device generates a first resolvable set identifier corresponding to the first member device, and generates and transmits target Bluetooth packets containing the first resolvable set identifier to the Bluetooth host device. The second member device generates a resolvable set identifier corresponding to the second member device according to a device set identification information. The Bluetooth host device identifies the first member device as a first privileged device according to the position of the first resolvable set identifier, and transmits a first privileged pairing notice to the first member device and generates a first cypher key. The first member device further generates a second cypher key corresponding to the first cypher key after receiving the first privileged pairing notice.Type: GrantFiled: January 10, 2022Date of Patent: March 26, 2024Assignee: Realtek Semiconductor Corp.Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
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Patent number: 11943608Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably generate and transmit target Bluetooth packets containing an auto-pair request to the Bluetooth host device. The second member device is arranged to operably generate a resolvable set identifier corresponding to the second member device according to a device set identification information. The Bluetooth host device is arranged to operably identify the first member device as a first privileged device according to the auto-pair request in the target Bluetooth packets, and to operably transmit a first privileged pairing notice to the first member device and to operably generate a first cypher key. The first member device further generates a second cypher key corresponding to the first cypher key after receiving the first privileged pairing notice.Type: GrantFiled: January 10, 2022Date of Patent: March 26, 2024Assignee: Realtek Semiconductor Corp.Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
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Patent number: 11924631Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device generates a first cypher key according to an instruction from the first member device and a device information of the first member device after receiving a selection command. The first member device establishes a connection with the Bluetooth host device, and generates a second cypher key corresponding to the first cypher key according to a device information of the Bluetooth host device.Type: GrantFiled: January 10, 2022Date of Patent: March 5, 2024Assignee: Realtek Semiconductor Corp.Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
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Publication number: 20240071974Abstract: A semiconductor package includes a substrate and at least one integrated circuit (IC) die. Substrate solder resist has substrate solder resist openings exposing substrate bonding pads of the bonding surface of the substrate, and die solder resist has aligned die solder resist openings exposing die bonding pads of the bonding surface of the IC die. A ball grid array (BGA) electrically connects the die bonding pads with substrate bonding pads via the die solder resist openings and the substrate solder resist openings. The die solder resist openings include a subset A of the die solder resist openings in a region A of the bonding surface of the IC die and a subset B of the die solder resist openings in a region B of the bonding surface of the IC die. The die solder resist openings of subset A are larger than those of subset B.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Inventors: Yu-Sheng Lin, Chen-Nan Chiu, Jyun-Lin Wu, Yao-Chun Chuang
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Publication number: 20230288290Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.Type: ApplicationFiled: March 11, 2022Publication date: September 14, 2023Inventors: Hsien-Yu CHEN, Yu-Sheng CHIU, Chih-Chun CHENG, Wen-Nan CHENG, Chi-Ming LIU
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Publication number: 20230244826Abstract: A method and a system for building digital twin models allow the setting of a shape and dimensions of a simplified geometric solid corresponding to a component of a feeding system; after sampling the solid to obtain second position data, calculates a set of model eigenvalues and a set of model eigenvectors by a modal analysis method according to a material data of the component, the second position data and second size data of the solid; and defines the solid as a digital twin model of the component when it is determined by a modal verification method that a set of actual eigenvectors of the component is similar to the set of model eigenvectors. Data amounts of the second position and size data are far less than data amounts of first position and size data of an image of the component.Type: ApplicationFiled: January 28, 2022Publication date: August 3, 2023Inventors: Po-Lin Lee, Hsien-Yu Chen, Yu-Sheng Chiu, Wen-Nan Cheng, Chih-Chun Cheng
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Patent number: 11119001Abstract: A machine tool health monitoring method which is to use a predetermined plurality of vibration sensors on a plurality of components of a machine tool and to drive motors of the machine tool to excite the machine tool using an electronic device while the health status of the machine tool is good, and then to perform a diagnostic process to obtain a characteristic cluster consisting of a plurality of modals, and then to define the characteristic cluster as a sample health characteristic cluster. The diagnostic process includes the procedures of vibration transmissibility obtaining, singular value decomposition, curve fitting and modal establishing. In addition, excite the machine tool and proceed the diagnosis process to obtain a current health characteristic cluster. Finally, the current health characteristic cluster is compared with the sample health characteristic cluster to judge whether the machine tool is healthy or not.Type: GrantFiled: March 5, 2020Date of Patent: September 14, 2021Assignees: NATIONAL CHUNG CHENG UNIVERSITY, TONGTAI MACHINE & TOOL CO., LTD.Inventors: Chih-Chun Cheng, Yu-Sheng Chiu, Wen-Nan Cheng, Ping-Chun Tsai, Yu-Hsin Kuo, Wei-Jen Chen, De-Shin Liu, Chen-Wei Chuang, Chih-Ta Wu, Wen-Peng Tseng, Wen-Chieh Kuo
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Publication number: 20210123830Abstract: A machine tool health monitoring method which is to use a predetermined plurality of vibration sensors on a plurality of components of a machine tool and to drive motors of the machine tool to excite the machine tool using an electronic device while the health status of the machine tool is good, and then to perform a diagnostic process to obtain a characteristic cluster consisting of a plurality of modals, and then to define the characteristic cluster as a sample health characteristic cluster. The diagnostic process includes the procedures of vibration transmissibility obtaining, singular value decomposition, curve fitting and modal establishing. In addition, excite the machine tool and proceed the diagnosis process to obtain a current health characteristic cluster. Finally, the current health characteristic cluster is compared with the sample health characteristic cluster to judge whether the machine tool is healthy or not.Type: ApplicationFiled: March 5, 2020Publication date: April 29, 2021Inventors: CHIH-CHUN CHENG, YU-SHENG CHIU, WEN-NAN CHENG, PING-CHUN TSAI, YU-HSIN KUO, WEI-JEN CHEN, DE-SHIN LIU, CHEN-WEI CHUANG, CHIH-TA WU, WEN-PENG TSENG, WEN-CHIEH KUO
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Patent number: 10732152Abstract: A device for monitoring healthy status of machinery mounts is provided, which may include a plurality of vibration detectors, a signal acquisition device and a signal processor. The vibration detectors may detect the vibration signals from of a machine device, where the machine device may include a plurality of machinery mounts. The signal acquisition device may receive the vibration signals of the vibration detectors. The signal processor may execute a modal frequency analysis process to analyze the vibration signals of the vibration detectors, and calculate a vibration mode corresponding to the natural frequency of the machinery mounts in current status to serve as the test mode; then, the signal processor may compare the test mode with a reference mode to determine the healthy status of the machinery mounts, where the reference mode is corresponding to the natural frequency of the machinery mounts in the optimized status.Type: GrantFiled: January 24, 2018Date of Patent: August 4, 2020Assignee: NATIONAL CHUNG CHENG UNIVERSITYInventors: Chih-Chun Cheng, Ping-Chun Tsai, Wen-Nan Cheng, Zhen-Wei Zhuang, Yu-Hsin Kuo, Zhi-Xuan Zhang, Yu-Sheng Chiu, Ren-Zh Lu
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Publication number: 20190162704Abstract: A device for monitoring healthy status of machinery mounts is provided, which may include a plurality of vibration detectors, a signal acquisition device and a signal processor. The vibration detectors may detect the vibration signals from of a machine device, where the machine device may include a plurality of machinery mounts. The signal acquisition device may receive the vibration signals of the vibration detectors. The signal processor may execute a modal frequency analysis process to analyze the vibration signals of the vibration detectors, and calculate a vibration mode corresponding to the natural frequency of the machinery mounts in current status to serve as the test mode; then, the signal processor may compare the test mode with a reference mode to determine the healthy status of the machinery mounts, where the reference mode is corresponding to the natural frequency of the machinery mounts in the optimized status.Type: ApplicationFiled: January 24, 2018Publication date: May 30, 2019Inventors: CHIH-CHUN CHENG, Ping-Chun Tsai, Wen-Nan Cheng, Zhen-Wei Zhuang, Yu-Hsin Kuo, Zhi-Xuan Zhang, Yu-Sheng Chiu, Ren-Zh Lu
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Patent number: 10220480Abstract: A spindle speed adjusting device in machining is provided, which may include a plurality of signal detection modules, a signal capturing module and a signal processing module. Each of the signal detection modules may keep measuring the vibration signals in machining. The signal capturing module may capture the vibration signals. The signal processing module may execute a transmissibility analysis to obtain the transmissibility between the signal detection modules, and execute a frequency response fitting according to the transmissibility to obtain a plurality of system dynamic parameters, and then execute a stability lobe diagram analysis to calculate the optimized spindle speed of the machining tool so as to make the machining tool operate at the optimized spindle speed. The signal processing module may repeatedly execute the transmissibility analysis, the frequency response fitting and the stability lobe diagram analysis to keep updating the optimized spindle speed until the machining process ends.Type: GrantFiled: May 22, 2017Date of Patent: March 5, 2019Assignee: NATIONAL CHUNG CHENG UNIVERSITYInventors: Chih-Chun Cheng, Ping-Chun Tsai, Wen-Nan Cheng, Yu-Hsin Kuo, Yin-Chun Cheng, Yu-Sheng Chiu
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Publication number: 20180130489Abstract: A spindle speed adjusting device in machining is provided, which may include a plurality of signal detection modules, a signal capturing module and a signal processing module. Each of the signal detection modules may keep measuring the vibration signals in machining. The signal capturing module may capture the vibration signals. The signal processing module may execute a transmissibility analysis to obtain the transmissibility between the signal detection modules, and execute a frequency response fitting according to the transmissibility to obtain a plurality of system dynamic parameters, and then execute a stability lobe diagram analysis to calculate the optimized spindle speed of the machining tool so as to make the machining tool operate at the optimized spindle speed. The signal processing module may repeatedly execute the transmissibility analysis, the frequency response fitting and the stability lobe diagram analysis to keep updating the optimized spindle speed until the machining process ends.Type: ApplicationFiled: May 22, 2017Publication date: May 10, 2018Inventors: CHIH-CHUN CHENG, PING-CHUN TSAI, WEN-NAN CHENG, YU-HSIN KUO, YIN-CHUN CHENG, YU-SHENG CHIU
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Publication number: 20150149130Abstract: A power consumption prediction apparatus, method, and non-transitory computer readable storage medium thereof are provided. The power consumption prediction apparatus receives a plurality of power consumption data of an appliance, wherein the power consumption data have a temporal sequence. Each power consumption datum includes a recorded status and a recorded time length, wherein each recorded status is one of a plurality operation statuses of the appliance. The power consumption prediction apparatus calculates an average operation time length of each operation status according to the recorded statuses and the recorded time lengths and calculates at least one transferring probability of each operation status according to the temporal sequence and the power consumption data. Each transferring probability is the probability of entering into a target status from a source status, wherein the source status is one of the operation statuses and the target status is one of the operation statuses.Type: ApplicationFiled: February 28, 2014Publication date: May 28, 2015Applicant: Institute For Information IndustryInventors: Yu-Sheng CHIU, Shiao-Li TSAO, Yung-Chi CHEN, Shih-Tsui KUO
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Patent number: 8854239Abstract: A data processing apparatus and a data processing method thereof are provided. The data processing apparatus includes a register and a processor electrically connected to the register. The register is stored with a plurality of data. The plurality of data each includes a first sub-datum and a second sub-datum. The plurality of first sub-data corresponds to a first column and the plurality of second sub-data corresponds to a second column. The processor compresses the first sub-data by a first compression algorithm according to a first characteristic of the plurality of first sub-data and compresses the second sub-data by a second compression algorithm according to a second characteristic of the plurality of second sub-data.Type: GrantFiled: February 17, 2013Date of Patent: October 7, 2014Assignee: Institute For Information IndustryInventors: Che-Rung Lee, Hao-Ping Kang, Zhi-Hung Chen, Chi-Cheng Chuang, Yu-Sheng Chiu
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Patent number: 8832269Abstract: A workload dispatch device and a workload dispatch method thereof are provided. The workload dispatch device comprises a monitor, a processor and a dispatcher. The monitor is configured to monitor operating conditions of a plurality of servers. The processor is electrically connected to the monitor and configured to execute the following operations: creating an average performance index table for a plurality of algorithms according to the operating conditions of the servers; normalizing the average performance index table; calculating a benchmark for each of the algorithms according to the normalized performance index table and a corresponding weighting table; and choosing a candidate algorithm from the algorithms according to the benchmarks. The dispatcher is electrically connected to the processor and configured to dispatch a workload to the plurality of servers according to the candidate algorithm.Type: GrantFiled: December 13, 2012Date of Patent: September 9, 2014Assignee: Institute for Information IndustryInventors: Cheng-Jen Tang, Chi-Cheng Chuang, Wei-Sen Lin, Yu-Sheng Chiu