Patents by Inventor Yu-Sheng Hsiao

Yu-Sheng Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142400
    Abstract: A bioelectronic system for rare cell separation and an application thereof. The bioelectronic system comprises: an electrode; a conductive polymer layer located on a surface of the electrode; a conductive polymer fiber layer located on the surface of the conductive polymer layer not in contact with the electrode; and a rare cell capturing material located the surface of the conductive polymer fiber layer not in contact with the conductive polymer layer. The conductive polymer layer has a thickness of 10-2000 nanometers. A method for rare cell separation can be provided using the bioelectronic system, and includes: introducing a biological fluid containing a rare cell into the bioelectronic system to capture the rare cell; and providing an electrical stimulus by using the electrode of the bioelectronic system to release the captured rare cell.
    Type: Application
    Filed: March 2, 2022
    Publication date: May 2, 2024
    Inventors: Yu-Sheng HSIAO, Shih-Ming TSAI
  • Publication number: 20240111133
    Abstract: An imaging lens assembly module includes a lens carrier, a rotatable component, an imaging surface and a holder portion. At least one lens element of the imaging lens assembly module is disposed on the lens carrier, and the lens carrier includes an assembling structure. The rotatable component includes a blade set and a rotating element. The blade set includes rotatable blades surrounding an optical axis to form a through hole. The rotating element is connected to the blade set. The imaging surface is located on an image side of the lens carrier. The holder portion is configured to keep a fixed distance between the lens carrier and the imaging surface. The blade set and the rotating element are disposed on the assembling structure, and the blade set and the rotating element rotate relatively to the assembling structure, so that the dimension of the through hole is variable.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 4, 2024
    Inventors: Yu-Tzu CHANG, Hsiu-Yi HSIAO, Ming-Ta CHOU, Te-Sheng TSENG
  • Patent number: 11922044
    Abstract: A solution for deteriorated non-volatile memory is shown. When a controller determines that raw data read from the non-volatile memory is undesirable data, the controller performs safety moving of valid data of an erasure unit that contains the raw data to safely move the valid data of the erasure unit, wherein the erasure unit is a high-risk block, and the raw data in the non-volatile memory is regarded as being in a deteriorated physical address. Prior to being moved in the safety moving, the raw data is changed so that it is different from the undesirable data. In an exemplary embodiment, the undesirable data is all-1's data or all-0's data.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: March 5, 2024
    Assignee: SILICON MOTION, INC.
    Inventors: Yu-Hao Chang, Yu-Han Hsiao, Po-Sheng Chou
  • Patent number: 11913925
    Abstract: A sensing device is provided. The sensing device includes a processing circuit and a multi-sensor integrated single chip. The multi-sensor integrated single chip includes a substrate and a temperature sensor, a pressure sensor, and an environmental sensor disposed on the substrate. The temperature sensor senses temperature. The pressure sensor senses pressure. The environmental sensor senses an environmental state. The processing circuit obtains a first sensed temperature value from the temperature sensor when the environmental sensor does not operate, and it obtains a second sensed temperature value from the temperature sensor when the environmental sensor operates. The processing circuit obtains a sensed pressure value from the pressure sensor. The processing circuit obtains at least one temperature calibration reference of the pressure sensor according to the first and second sensed temperature values and calibrates the sensed pressure value according to the temperature calibration reference.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: February 27, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Che Lo, Yu-Sheng Lin, Po-Jen Su, Ting-Hao Hsiao
  • Publication number: 20230405532
    Abstract: The present invention provides an organic bioelectronic HD device system for the effective removal of protein-bound substances, comprising PEDOT:PSS, a multiwall carbon nanotube, polyethylene oxide (PEO), and (3-glycidyloxypropyl)trimethoxysilane (GOPS). The composite nanofiber platform exhibited (i) long-term water-resistance; (ii) high adhesion strength on the PES membrane; (iii) enhanced electrical properties; and (iv) good anticoagulant ability and negligible hemolysis of red blood cells, suggesting great suitability for use in developing next-generation bioelectronic medicines for HD.
    Type: Application
    Filed: August 30, 2023
    Publication date: December 21, 2023
    Inventors: Yu-Sheng HSIAO, Shih-Chieh YEN, Chia-Hung SU
  • Publication number: 20210086144
    Abstract: The present invention provides an organic bioelectronic HD device system for the effective removal of protein-bound substances, comprising PEDOT:PSS, a multiwall carbon nanotube, polyethylene oxide (PEO), and (3-glycidyloxypropyl)trimethoxysilane (GOPS). The composite nanofiber platform exhibited (i) long-term water-resistance; (ii) high adhesion strength on the PES membrane; (iii) enhanced electrical properties; and (iv) good anticoagulant ability and negligible hemolysis of red blood cells, suggesting great suitability for use in developing next-generation bioelectronic medicines for HD.
    Type: Application
    Filed: September 20, 2020
    Publication date: March 25, 2021
    Inventors: Yu-Sheng HSIAO, Shih-Chieh YEN, Chia-Hung SU
  • Publication number: 20070237969
    Abstract: A method for manufacturing a surface-metallized polyimide material includes performing an alkaline treatment on a surface of a polyimide material to cause ring opening of the polyimide material on the surface; the surface of the polyimide material being subject to an ion exchange process for being displaced by a first metal ion exclusive of palladium ion, gold ion, silver ion, and copper ion; and performing a wet reduction process to reduce the first metal ion on the surface of the polyimide material into a first metal that adheres to the surface of the polyimide material. A surface-metallized polyimide material produced according to the aforementioned method is also disclosed.
    Type: Application
    Filed: December 12, 2006
    Publication date: October 11, 2007
    Inventors: Wha-tzong Whang, Yu-sheng Hsiao
  • Patent number: 4545490
    Abstract: An assembly rack having: a plurality of steel angles each having its two sides bent into L-shaped guide edges which define a guide groove, and provided with a series of holes in each side, and a plurality of slightly L-shaped joint members of sheet metal having a guide groove on each side and provided with screw holes one in each side of the guide groove. The guide edges of the steel angles are engaged in the grooves of the joint members and the two extended portions of the joint members are fitted into the guide grooves of the angles. Vertical and horizontal steel angles thus joined by the joint members are fastened to the joint members by bolts, and the horizontal angles can be positioned at different locations along the vertical steel angles.
    Type: Grant
    Filed: June 6, 1983
    Date of Patent: October 8, 1985
    Inventors: Yu-Sheng Hsiao, Huey-Der Cheng