Patents by Inventor Yu-Sheng Hung

Yu-Sheng Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130762
    Abstract: An artificial bone plate unit and an assembleable artificial bone plate are provided. The artificial bone plate unit includes a plate body, multiple connecting pins, connecting holes, drug cavities, and drug-releasing openings. The plate body has two main surfaces and a peripheral surface connected between the two main surfaces. The connecting pins and the connecting holes are formed on the plate body and arranged along the peripheral surface on the plate body. The connecting holes correspond in shape to the connecting pins. The drug cavities are formed in the artificial bone plate unit and are connected to the drug-releasing openings. The artificial bone plate units are connected using the connecting pins and the connecting holes to form the assembleable artificial bone plate. The assembleable artificial bone plate can be bent into the shape of a defect area of the skull, which saves material and time.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventors: Tung-Kuo TSAI, Keng-Liang OU, Yung-Kang SHEN, Yin-Chung HUANG, Kuo-Sheng HUNG, Yu-Sin OU
  • Patent number: 11955379
    Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai
  • Publication number: 20240106757
    Abstract: A method of wireless signal transmission management includes transmitting a plurality of data packets to tethering equipment from user equipment to tethering equipment, determining a size of each of the plurality of data packets by the tethering equipment, designating data packets of the plurality of data packets having a specific range of sizes as control signal packets by the tethering equipment, and prioritizing in transmitting the control signal packets to a cellular network by the tethering equipment.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ching-Hao Lee, Yi-Lun Chen, Ho-Wen Pu, Yu-Yu Hung, Jun-Yi Li, Ting-Sheng Lo
  • Patent number: 11922855
    Abstract: An information handling system includes a host processing system and a Liquid Crystal Display device. The host processing system includes a graphics processing unit (GPU) and the LCD device includes a memory device and a DisplayPort Configuration Data (DPCD) register. The host processing system 1) determines whether the first GPU supports a Dynamic Display Shifting (DDS) mode, 2) when the GPU does not support the DDS mode, provides a first indication to the LCD device that the GPU does not support the DDS mode, and 3) when the GPU supports the DDS mode, provides a second indication to the LCD device that the GPU supports the DDS mode. The LCD device retrieves a Panel Self Refresh (PSR) setting from the memory device and stores the PSR setting to the DPCD register in response to the first indication, and retrieves a DDS setting from the memory and stores the DDS setting to the DPCD register in response to the second indication.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: March 5, 2024
    Assignee: Dell Products L.P.
    Inventors: Chun-Yi Chang, Yi-Fan Wang, Meng-Feng Hung, No-Hua Chuang, Yu Sheng Chang
  • Patent number: 10217716
    Abstract: A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: February 26, 2019
    Assignee: MEDIATEK INC.
    Inventors: Ta-Jen Yu, Yu-Sheng Hung, Wen-Sung Hsu
  • Publication number: 20180076166
    Abstract: A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.
    Type: Application
    Filed: June 30, 2017
    Publication date: March 15, 2018
    Inventors: Ta-Jen Yu, Yu-Sheng Hung, Wen-Sung Hsu