Patents by Inventor Yu-Shih Su

Yu-Shih Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fault-tolerant unit and method for through-silicon via
    Patent number: 9177940
    Abstract: A fault-tolerant unit and a fault-tolerant method for through-silicon via (TSV) are provided. The fault-tolerant unit includes TSV structures TSV1˜TSVn, nodes N11˜N1n, nodes N21˜N2n and a switching module. The TSV structure TSVi is connected between the node N1i of the first chip and the node N2i of the second chip, wherein 1?i?n. The switching module is connected between the nodes N21˜N2n of the second chip and a test path of the second chip. In normal operation state, the switching module disconnects the test path and the nodes N21˜N2n when the TSV structures TSV1˜TSVn are valid. The switching module connects the node N2i to at least another one of the nodes N21˜N2n when the TSV structure TSVi is faulty in the normal operation state. In test status, the switching module connects the test path to the nodes N21˜N2n.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: November 3, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Chiao-Ling Lung, Yu-Shih Su, Shih-Chieh Chang, Yiyu Shi
  • FAULT-TOLERANT UNIT AND METHOD FOR THROUGH-SILICON VIA
    Publication number: 20120248438
    Abstract: A fault-tolerant unit and a fault-tolerant method for through-silicon via (TSV) are provided. The fault-tolerant unit includes TSV structures TSV1˜TSVn, nodes N11˜N1n, nodes N21˜N2n and a switching module. The TSV structure TSVi is connected between the node N11 of the first chip and the node N2i of the second chip, wherein 1?i?n. The switching module is connected between the nodes N21˜N2n of the second chip and a test path of the second chip. In normal operation state, the switching module disconnects the test path and the nodes N21˜N2n when the TSV structures TSV1˜TSVn are valid. The switching module connects the node N2i to at least another one of the nodes N21˜N2n when the TSV structure TSVi is faulty in the normal operation state. In test status, the switching module connects the test path to the nodes N21˜N2n.
    Type: Application
    Filed: September 20, 2011
    Publication date: October 4, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chiao-Ling Lung, Yu-Shih Su, Shih-Chieh Chang, Yiyu Shi