Patents by Inventor Yu Tay

Yu Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118815
    Abstract: Aspects concern a data storage system comprising a data storage for storing data comprising a plurality of data elements, wherein each data element is associated with a data storage table, a data storage access interface configured to receive a request for an access to a data element from a data access client wherein the request comprises a identifier of the storage location of the data element and an access controller configured to determine a data storage table with which the data element is associated from the identifier of the storage location, determine whether the data access client has access rights to the determined data storage table allowing the access to the data element and grant the data access client access to the data element if the data access client has access rights to the determined data storage table allowing the access to the data element.
    Type: Application
    Filed: March 30, 2022
    Publication date: April 11, 2024
    Inventors: Arun Ravi MUTHUTHODI VARIKKOTTIL, Wenli WAN, Li Yu TAY, _ NAVDEEP, Parvathy KRISHNASWAMY
  • Patent number: 9625823
    Abstract: A system and method for local film stress calculation is disclosed. The method may include specifying a plurality of measurement points on a substrate, the substrate being configured to receive a film deposition; obtaining a local film thickness measurement for each measurement point; obtaining a local wafer shape parameter for each measurement point; and calculating a local film stress value for each measurement point based on the local film thickness measurement and the local wafer shape parameter for each corresponding measurement point. The method may further include specifying a plurality of estimation points on the substrate; obtaining a local wafer shape parameter for each estimation point; calculating an estimated local film thickness for each estimation point; and calculating a local film stress value for each estimation point based on the estimated local film thickness and the local wafer shape parameter for each corresponding estimation point.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: April 18, 2017
    Assignee: KLA-Tencor Corporation
    Inventors: Torsten R. Kaack, Leonid Poslavsky, Yu Tay