Patents by Inventor Yu-Te Kao

Yu-Te Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9244161
    Abstract: An ultrasound transmission circuit comprises a pulse generating circuit, a feedback circuit and a processing circuit. The feedback circuit outputs a trigger signal according to a first pulse signal arriving at an ultrasound transducer. The processing circuit records a first time point at which the first pulse signal is generated, and records a second time point at which the first pulse signal arrives the ultrasound transducer according to the trigger signal. The processing circuit adjusts a first delay value according to a variance between the first time point and the second time point to generate a second delay value, and drives the pulse generating circuit according to the second delay value to generate a second pulse signal.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: January 26, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chin Hsia, Yu-Te Kao
  • Publication number: 20140133270
    Abstract: An ultrasound transmission circuit comprises a pulse generating circuit, a feedback circuit and a processing circuit. The feedback circuit outputs a trigger signal according to a first pulse signal arriving at an ultrasound transducer. The processing circuit records a first time point at which the first pulse signal is generated, and records a second time point at which the first pulse signal arrives the ultrasound transducer according to the trigger signal. The processing circuit adjusts a first delay value according to a variance between the first time point and the second time point to generate a second delay value, and drives the pulse generating circuit according to the second delay value to generate a second pulse signal.
    Type: Application
    Filed: May 13, 2013
    Publication date: May 15, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chin HSIA, Yu-Te KAO
  • Patent number: 8594958
    Abstract: A method of electrical device characterization comprises: providing an array of electrical devices arranged in rows and columns, wherein each electrical device has a first terminal, a second terminal and a third terminal; clamping a first voltage at a first terminal of a selected electrical device via a first buffer or an first external voltage source; clamping a second voltage at a second terminal of a selected electrical device via a second buffer or a second external voltage source; controlling a third buffer to couple the third terminal of the selected electrical device to a first terminal or a second terminal of at least one non-selected column of electrical devices; and deriving a characterization result via the third terminal of the selected electrical device; wherein the array of electrical devices, the first buffer, the second buffer and the third buffer are on a same die or a same module.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: November 26, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Kao-Cheng Lin, Yu-Te Kao, Wen-Jung Liao
  • Publication number: 20120253719
    Abstract: A method of electrical device characterization comprises: providing an array of electrical devices arranged in rows and columns, wherein each electrical device has a first terminal, a second terminal and a third terminal; clamping a first voltage at a first terminal of a selected electrical device via a first buffer or an first external voltage source; clamping a second voltage at a second terminal of a selected electrical device via a second buffer or a second external voltage source; controlling a third buffer to couple the third terminal of the selected electrical device to a first terminal or a second terminal of at least one non-selected column of electrical devices; and deriving a characterization result via the third terminal of the selected electrical device; wherein the array of electrical devices, the first buffer, the second buffer and the third buffer are on a same die or a same module.
    Type: Application
    Filed: March 31, 2011
    Publication date: October 4, 2012
    Inventors: Kao-Cheng Lin, Yu-Te Kao, Wen-Jung Liao