Patents by Inventor Yu-Ting Lai
Yu-Ting Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240095168Abstract: A computing system performs shared cache allocation to allocate cache resources to groups of tasks. The computing system monitors the bandwidth at a memory hierarchy device that is at a next level to the cache in a memory hierarchy of the computing system. The computing system estimates a change in dynamic power from a corresponding change in the bandwidth before and after the cache resources are allocated. The allocation of the cache resources are adjusted according to an allocation policy that receives inputs including the estimated change in the dynamic power and a performance indication of task execution.Type: ApplicationFiled: August 17, 2023Publication date: March 21, 2024Inventors: Yu-Pin Chen, Jia-Ming Chen, Chien-Yuan Lai, Ya Ting Chang, Cheng-Tse Chen
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Publication number: 20240095177Abstract: A computing system performs partial cache deactivation. The computing system estimates the leakage power of a cache based on operating conditions of the cache including voltage and temperature. The computing system further identifies a region of the cache as a candidate for deactivation based on cache hit counts. The computing system then adjusts the size of the region for the deactivation based on the leakage power and a bandwidth of a memory hierarchy device. The memory hierarchy device is at the next level to the cache in a memory hierarchy of the computing system.Type: ApplicationFiled: August 17, 2023Publication date: March 21, 2024Inventors: Yu-Pin Chen, Jia-Ming Chen, Chien-Yuan Lai, Ya Ting Chang, Cheng-Tse Chen
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Patent number: 11365019Abstract: A strapping machine includes a driver, first and second power output units, and a switching unit. The first power output unit includes a first drive shaft being co-rotatable with a main shaft of the driver only when the main shaft rotates in a first rotational direction via a first one-way bearing for driving the switching unit, and for clamping, hot-melting and cutting a strap. The second power output unit includes a second drive shaft being co-rotatable with the main shaft only when the main shaft rotates in a second rotational direction via a second one-way bearing, and a plurality of output gear trains being engagable with the second drive shaft via the switching unit for feeding, retracting and tensioning the strap.Type: GrantFiled: May 5, 2020Date of Patent: June 21, 2022Assignee: EXPACK INDUSTRIAL CORPORATIONInventor: Yu-Ting Lai
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Patent number: 11315231Abstract: An industrial image inspection method includes: generating a test latent vector of a test image; measuring a distance between a training latent vector of a normal image and the test latent vector of the test image; and judging whether the test image is normal or defected according to the distance between the training latent vector of the normal image and the test latent vector of the test image.Type: GrantFiled: December 12, 2018Date of Patent: April 26, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Ting Lai, Jwu-Sheng Hu, Ya-Hui Tsai, Keng-Hao Chang
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Patent number: 11267674Abstract: A strap feeding device includes first driving and driven rollers, second driving and driven rollers, an actuating unit, and a detecting unit. The actuating unit can move the second driving roller between a released position, where the second driven roller is spaced apart from the second driving roller, and a contact, where the second driven roller contacts the second driving roller and is co-rotatable with the second driving roller to clamp and move a strap. The control device controls rotation of the first and second driving rollers to feed and return the strap, detects rotation of the first driven roller, and controls the actuating unit to move the second driven roller to the contact and released positions.Type: GrantFiled: May 7, 2020Date of Patent: March 8, 2022Assignee: EXPACK INDUSTRIAI. CORPORATIONInventor: Yu-Ting Lai
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Patent number: 11090895Abstract: A feeding device is adapted to be installed to a box folding machine for delivering a plurality of unfolded cardboard boxes, and includes a base unit, a positioning unit and a box pushing unit. The base unit is operable for moving the cardboard boxes to push two stopping members of the positioning unit to rotate from a stopping position, where the cardboard boxes are retained between upstream and downstream ends of the base unit, to a releasing position, where one of the cardboard boxes is moved out of the downstream end to a standby position. The box pushing unit is operable to push the one of the cardboard boxes from the standby position to a ready-to-fold position, where the one of the cardboard boxes is ready to be folded.Type: GrantFiled: June 18, 2020Date of Patent: August 17, 2021Assignee: EXPACK INDUSTRIAL CORPORATIONInventor: Yu-Ting Lai
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Publication number: 20210070004Abstract: A feeding device is adapted to be installed to a box folding machine for delivering a plurality of unfolded cardboard boxes, and includes a base unit, a positioning unit and a box pushing unit. The base unit is operable for moving the cardboard boxes to push two stopping members of the positioning unit to rotate from a stopping position, where the cardboard boxes are retained between upstream and downstream ends of the base unit, to a releasing position, where one of the cardboard boxes is moved out of the downstream end to a standby position. The box pushing unit is operable to push the one of the cardboard boxes from the standby position to a ready-to-fold position, where the one of the cardboard boxes is ready to be folded.Type: ApplicationFiled: June 18, 2020Publication date: March 11, 2021Applicant: EXPACK INDUSTRIAL CORPORATIONInventor: Yu-Ting LAI
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Publication number: 20200354186Abstract: A strap feeding device includes first driving and driven rollers, second driving and driven rollers, an actuating unit, and a detecting unit. The actuating unit can move the second driving roller between a released position, where the second driven roller is spaced apart from the second driving roller, and a contact, where the second driven roller contacts the second driving roller and is co-rotatable with the second driving roller to clamp and move a strap. The control device controls rotation of the first and second driving rollers to feed and return the strap, detects rotation of the first driven roller, and controls the actuating unit to move the second driven roller to the contact and released positions.Type: ApplicationFiled: May 7, 2020Publication date: November 12, 2020Applicant: EXPACK INDUSTRIAL CORPORATIONInventor: Yu-Ting LAI
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Publication number: 20200354095Abstract: A strapping machine includes a driver, first and second power output units, and a switching unit. The first power output unit includes a first drive shaft being co-rotatable with a main shaft of the driver only when the main shaft rotates in a first rotational direction via a first one-way bearing for driving the switching unit, and for clamping, hot-melting and cutting a strap. The second power output unit includes a second drive shaft being co-rotatable with the main shaft only when the main shaft rotates in a second rotational direction via a second one-way bearing, and a plurality of output gear trains being engagable with the second drive shaft via the switching unit for feeding, retracting and tensioning the strap.Type: ApplicationFiled: May 5, 2020Publication date: November 12, 2020Inventor: Yu-Ting Lai
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Publication number: 20190378263Abstract: An industrial image inspection method includes: generating a test latent vector of a test image; measuring a distance between a training latent vector of a normal image and the test latent vector of the test image; and judging whether the test image is normal or defected according to the distance between the training latent vector of the normal image and the test latent vector of the test image.Type: ApplicationFiled: December 12, 2018Publication date: December 12, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Ting Lai, Jwu-Sheng Hu, Ya-Hui Tsai, Keng-Hao Chang
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Patent number: 9908303Abstract: A foldable box sealing machine includes an upright main frame unit, an upper taping unit mounted on the main frame unit, a platform unit having a base panel mounted rotatably on the main frame unit below the upper taping unit, a lower taping unit disposed below the upper taping unit. The base panel is rotatable between a first position where the base panel is substantially horizontal, and a second position where the base panel is substantially vertical.Type: GrantFiled: October 29, 2014Date of Patent: March 6, 2018Assignee: Expack Indutrial CorporationInventor: Yu-Ting Lai
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Publication number: 20150321437Abstract: A foldable box sealing machine includes an upright main frame unit, an upper taping unit mounted on the main frame unit, a platform unit having a base panel mounted rotatably on the main frame unit below the upper taping unit, a lower taping unit disposed below the upper taping unit. The base panel is rotatable between a first position where the base panel is substantially horizontal, and a second position where the base panel is substantially vertical.Type: ApplicationFiled: October 29, 2014Publication date: November 12, 2015Inventor: Yu-Ting LAI
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Publication number: 20140292793Abstract: The invention discloses an image display device and an image processing method thereof. The image display device includes a processing module and a screen electrically connected to the processing module. The processing module receives a series of digital signals and displays an image frame on the screen based on a first signal—gray level relation. An image block is selected from the image frame. The series of digital signals and a subset of digital signals corresponding to the image block correspond to a first and a second gray level ranges, respectively. The first gray level range covers the second gray level range. The processing module generates a second signal—gray level relation based on the second gray level range and re-displays the image block on the screen based on the subset of digital signals and the second signal—gray level relation, so as to enhance the gray level resolution of the image block.Type: ApplicationFiled: April 2, 2014Publication date: October 2, 2014Applicants: QISDA CORPORATION, QISDA (SUZHOU) CO., Ltd.Inventors: Yu-Ting Lai, Fang-Bin Liu
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Publication number: 20140195503Abstract: A method and a system for managing cache files, adapted for a local end apparatus to manage files cached from a service end apparatus, are provided. In the method, a file is divided into a plurality of segments, and a part of the segments are downloaded from the service end apparatus and stored in the local end apparatus. Then, the segments of the file to be downloaded are increased or decreased according to a utility rate of the file.Type: ApplicationFiled: May 13, 2013Publication date: July 10, 2014Applicant: COMPAL ELECTRONICS, INC.Inventors: Chen-Li Kao, Yu-Ting Lai, Ko-Chun Lin, Shih-Yi Chang, Pei-Ching Hu, Po-Chao Wang, Ching-Tien Nien, Yu-Hung Chen, Chin-Hsun Wu
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Publication number: 20120131493Abstract: A computer system and a computer information display method thereof are provided. In the method, a computer information management unit stores computer information of an application program in a storage unit. During a system login process of the computer system, a processing unit reads the computer information form the storage unit, and displays the computer information and a login dialog on a screen unit.Type: ApplicationFiled: November 16, 2011Publication date: May 24, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Yu-Ting Lai, Yi-Chang Chen, Chih-Chien Liu, Chih-Hsing Kang
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Publication number: 20090102063Abstract: This invention provides a semiconductor package and a method for fabricating the same. The method includes: forming a first resist layer on a metal carrier; forming a plurality of openings penetrating the first resist layer; forming a conductive metal layer in the openings; removing the first resist layer; covering the metal carrier having the conductive metal layer with a dielectric layer; forming blind vias in the dielectric layer to expose a portion of the conductive metal layer; forming conductive circuit on the dielectric layer and conductive posts in the blind vias, such that the conductive circuit is electrically connected to the conductive metal layer via the conductive posts; electrically connecting at least one chip to the conductive circuit; forming an encapsulant for encapsulating the chip and the conductive circuit; and removing the metal carrier, thereby allowing a semiconductor package to be formed without a chip carrier.Type: ApplicationFiled: October 14, 2008Publication date: April 23, 2009Applicant: Siliconware Precision Industries Co., Ltd.Inventors: Chun-Yuan Lee, Chien Ping Huang, Yu-Ting Lai, Cheng-Hsu Hsiao, Chun-Chi Ke
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Publication number: 20060211232Abstract: A method for manufacturing gold bumps includes providing a substrate including a patterned protective layer, which exposes at least a bonding pad, on a surface, covering a photo resist on the surface of the substrate, performing a photolithography process to pattern the photo resist for exposing a portion of the protective layer and the bonding pad, removing a portion of the protective layer, removing the photo resist, and performing a gold bumping process. The resulting thickness of the protective layer covering the bonding pad is smaller than the resulting thickness of the protective layer covering the substrate.Type: ApplicationFiled: March 16, 2005Publication date: September 21, 2006Inventors: Mei-Jen Liu, Yu-Ting Lai, Kuang-Shin Lee, Ming-Tsung Tung
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Patent number: 7102222Abstract: A conductive trace structure and a semiconductor package having the conductive trace structure are provided. A plurality of conductive traces are formed in and surrounding a chip mounting area on a substrate, for mounting a chip on the chip mounting area. Widened portions are formed on the conductive traces in the chip mounting area and at positions across a periphery of the chip mounting area, the widened portions having a line width larger than that of the rest part of the conductive traces. The widened portions of the conductive traces can sustain concentrated thermal stress from the peripheral area of the chip caused by mismatch in coefficient of thermal expansion between the chip and the substrate. This prevents the conductive traces that pass through the periphery of the chip mounting area from cracks or breaks due to the thermal stress, thereby improving the reliability and yield of the semiconductor package.Type: GrantFiled: May 14, 2004Date of Patent: September 5, 2006Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Kuan-Ting Kuo, Yu-Ting Lai, Chin-Chien Chiang
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Patent number: 6927485Abstract: A substrate for a semiconductor package is provided, which includes: a core layer; at least a metal layer applied over each of upper and lower surfaces of the core layer, wherein the metal layer on the upper surface forms a plurality of conductive traces each having a terminal, and the metal layer on the lower surface is defined with a conductive region and a surrounding peripheral region, allowing the conductive region to form a plurality of conductive traces each having a terminal; and an insulating layer applied over each of the metal layers, wherein terminals of the conductive traces and at least a corner portion of the peripheral region are exposed to outside of the insulating layers. During fabrication of semiconductor packages, after a post molding curing process, the vertically-stacked substrates can be easily separated by virtue of a gap being formed between exposed corner portions of the stacked substrates.Type: GrantFiled: September 11, 2002Date of Patent: August 9, 2005Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Yu-Ting Lai, Ken-Hung Kuo, Shy-Hwa Feng
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Publication number: 20050073038Abstract: A conductive trace structure and a semiconductor package having the conductive trace structure are provided. A plurality of conductive traces are formed in and surrounding a chip mounting area on a substrate, for mounting a chip on the chip mounting area. Widened portions are formed on the conductive traces in the chip mounting area and at positions across a periphery of the chip mounting area, the widened portions having a line width larger than that of the rest part of the conductive traces. The widened portions of the conductive traces can sustain concentrated thermal stress from the peripheral area of the chip caused by mismatch in coefficient of thermal expansion between the chip and the substrate. This prevents the conductive traces that pass through the periphery of the chip mounting area from cracks or breaks due to the thermal stress, thereby improving the reliability and yield of the semiconductor package.Type: ApplicationFiled: May 14, 2004Publication date: April 7, 2005Inventors: Kuan-Ting Kuo, Yu-Ting Lai, Chin-Chien Chiang