Patents by Inventor Yu-Tsung Wu

Yu-Tsung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240174512
    Abstract: A MEMS probe and manufacturing method thereof are provided. The method is mainly to form connected first-level, second-level, and third-level pin grooves on both sides of the silicon substrate through an etching process, followed by two electroplating processes to deposit nickel-cobalt-phosphorus alloy in the first-level pin groove to form the tip of the microprobe, and to deposit nickel-cobalt alloy in the second-level pin groove and the third-level pin to form the pin head and pin arm, thereby forming a three-level microprobe. A circuit substrate made of ceramic material is disposed with at least one window, the surface of the circuit substrate adjacent to the window is provided with a plurality of circuit pads, and the circuit substrate is abutted to the pin arm of the microprobe. The silicon substrate is then removed, to form a plurality of cantilever microprobes made of nickel-cobalt-phosphorus alloy and nickel-cobalt alloy on the circuit substrate.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Inventors: SHANG-KUANG WU, YU-TSUNG FU, MING-WEI HUANG
  • Publication number: 20240139990
    Abstract: An internal rotor type nail drive device of electric nail gun, comprising a nailing rod and an internal rotor type rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator comprises a stator and a rotor arranged inside the stator, even groups of electromagnetic mutual action components are configured in pairs between the stator and the rotor, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by a specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified, and the kinetic energy for nailing can be increased.
    Type: Application
    Filed: August 22, 2023
    Publication date: May 2, 2024
    Inventors: I-TSUNG WU, CHIA-SHENG LIANG, YU-CHE LIN, WEN-CHIN CHEN
  • Patent number: 11953052
    Abstract: A fastener is adapted for assembling a first housing to a second housing. The first housing is provided with a protruding portion and a buckling portion, and the second housing has a first surface, a second surface, and a through hole. The fastener includes a first portion, at least one connecting portion, at least two elastic portions, and a second portion. The first portion movably abuts against the first surface and has a first opening. The connecting portion is accommodated in the through hole. One end of the connecting portion is connected to the first portion. The connecting portion is spaced apart from an inner edge of the second housing by a gap. The two elastic portions inclinedly extend into the first opening. The second portion movably abuts against the second surface and is disposed at the another end of the connecting portion.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 9, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Jian-Hua Chen, Po-Tsung Shih, Yu-Wei Lin, Ming-Hua Ho, Chih-Hao Wu
  • Patent number: 10755065
    Abstract: A sensor device includes a fingerprint sensing module, configured to sense a first raw image using a first exposure time; and an exposure time adjusting module. The exposure time adjusting module is configured to obtain a first image according to the first raw image; determine whether the first image comprises a flicker noise; and adjust the first exposure time when the first image comprises the flicker noise, so as to mitigate the flicker noise.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: August 25, 2020
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Yu-Tsung Wu, Chi-Ting Chen, Chih-Lun Cheng
  • Publication number: 20200175248
    Abstract: A sensor device includes a fingerprint sensing module, configured to sense a first raw image using a first exposure time; and an exposure time adjusting module. The exposure time adjusting module is configured to obtain a first image according to the first raw image; determine whether the first image comprises a flicker noise; and adjust the first exposure time when the first image comprises the flicker noise, so as to mitigate the flicker noise.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 4, 2020
    Inventors: Yu-Tsung Wu, Chi-Ting Chen, Chih-Lun Cheng
  • Patent number: 7858147
    Abstract: A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: December 28, 2010
    Assignee: National Tsing Hua University
    Inventors: Yu-Tsung Wu, Jen-Hong Huang, Chung-Min Tsai, Huan-Chieh Su, Tri-Rung Yew
  • Publication number: 20090197113
    Abstract: A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer.
    Type: Application
    Filed: August 20, 2008
    Publication date: August 6, 2009
    Applicant: National Tsing Hua University
    Inventors: Yu-Tsung Wu, Jen-Hong Huang, Chung-Min Tsai, Huan-Chieh Su, Tri-Rung Yew