Abstract: A hinge mechanism and a clamshell device thereof are disclosed. The clamshell device includes a first cover and a second cover and the first cover can rotate with respect to the second cover via the hinge mechanism. The hinge mechanism includes a main body, an elastic component, and a base. The main body is connected to the first cover and includes a shaft and a projecting part. The elastic component covers the shaft. An internal diameter of the elastic component matches with an outer diameter of the shaft so as to generate a friction force. The first cover can be maintained at any angle by the friction force. The elastic component has a groove used for connecting with the projecting part when the main body rotates to a specific angle. The base is connected to the second cover and has a stop structure used for fixing the elastic component.

Abstract: A circuit provides a first current corresponding to the differential input Inn and Inp, and a second current corresponding to the common mode input Vcm. The circuit then mirrors the differential current and the common mode current to a third current and a fourth current. Based on the difference between the mirrored differential current and the mirrored common mode current, the circuit pulls up or pulls down these currents to balance the corresponding difference between the differential input and the common mode input. In effect, the circuit adjusts the input common mode voltage to a desired level, without providing an opportunity for it to rise to an unwanted level.

Abstract: A circuit provides a first current corresponding to the differential input Inn and Inp, and a second current corresponding to the common mode input Vcm. The circuit then mirrors the differential current and the common mode current to a third current and a fourth current. Based on the difference between the mirrored differential current and the mirrored common mode current, the circuit pulls up or pulls down these currents to balance the corresponding difference between the differential input and the common mode input. In effect, the circuit adjusts the input common mode voltage to a desired level, without providing an opportunity for it to rise to an unwanted level.

Abstract: A signal transmission system includes a first clock signal generator and a second clock signal generator. The first clock signal generator is configured for generating a first clock signal according to clock information derived from a transmitted signal, wherein the transmitted signal is changed in response to a frequency change of a second clock signal, and the first clock signal generator enters a frequency-unlocked state if the second clock signal has a frequency transition from a first frequency to a second frequency during a first time period. The second clock signal generator is configured for generating the second clock signal having the frequency transition from the first frequency to the second frequency during a second time period longer than the first time period such that the first clock signal generator stays in a frequency-locked state during the second time period.

Abstract: A circuit provides a first current corresponding to the differential input Inn and Inp, and a second current corresponding to the common mode input Vcm. The circuit then mirrors the differential current and the common mode current to a third current and a fourth current. Based on the difference between the mirrored differential current and the mirrored common mode current, the circuit pulls up or pulls down these currents to balance the corresponding difference between the differential input and the common mode input. In effect, the circuit adjusts the input common mode voltage to a desired level, without providing an opportunity for it to rise to an unwanted level.

Abstract: An anti-cancer active substance from Antrodia Camphorata, produced from mycelium of Antrodia Camphorata by following steps: (1) culturing mycelium of Antrodia Camphorata by liquid fermentation; (2) extracting the thus-obtained mycelium with ethanol and concentrating the extracted solution to obtain an ethanol extract; (3) dissolving the ethanol extract in water, and extracting with equal volume of ethyl acetate to obtain ethyl acetate extract; (4) purifying the ethyl acetate extract by silica gel column chromatography using hexane/ethyl acetate gradient as the mobile phase to obtain an eluate fraction g; and (5) purifying the eluate fraction g by silica gel column chromatography using hexane/ethyl acetate gradient as the mobile phase to obtain a specific eluate fraction which could be purified further to obtain the anti-cancer active substance from Antrodia Camphorata.

Abstract: A circuit provides a first current corresponding to the differential input Inn and Inp, and a second current corresponding to the common mode input Vcm. The circuit then mirrors the differential current and the common mode current to a third current and a fourth current. Based on the difference between the mirrored differential current and the mirrored common mode current, the circuit pulls up or pulls down these currents to balance the corresponding difference between the differential input and the common mode input. In effect, the circuit adjusts the input common mode voltage to a desired level, without providing an opportunity for it to rise to an unwanted level.

Abstract: A resonator system such as a microresonator system and a method of making same are provided. In at least one embodiment, a mechanical circuit-based approach for boosting the Q of a vibrating micromechanical resonator is disclosed. A low Q resonator is embedded into a mechanically-coupled array of much higher Q resonators to raise the functional Q of the composite resonator by a factor approximately equal to the number of resonators in the array. The availability of such a circuit-based Q-enhancement technique has far reaching implications, especially considering the possibility of raising the functional Q of a piezoelectric resonator by merely mechanically coupling it to an array of much higher Q capacitively-transduced ones to simultaneously obtain the most attractive characteristics of both technologies: low impedance from the piezo-device and high-Q from the capacitive ones. Furthermore, the manufacturing repeatability of such micromechanical resonator-based products is enhanced.

Abstract: A micro-electro-mechanical system (MEMS) includes a micro-mechanical structure that is capable of generating a first electrical signal. An analog-to-digital converter (ADC) is coupled with the micro-mechanical structure. The MEMS is free from including any amplifier between the micro-mechanical structure and the ADC.

Abstract: A method of sensing melt-front position and velocity is applicable for injection-molding systems. Firstly, at least one actuation signal value of the melt-injection device of the injection-molding system is retrieved, and at least one state variable value of the injection-molding system is measured. Then, the retrieved actuation signal values and the measured state variable values are substituted into a plurality of simultaneous equations to calculate the melt-front position and velocity of the injection-molding system.

Abstract: A method for verifying user identification receives an original symbol input by a user via a touch screen of an electronic device. A symbolic password is determined according to the original symbol. The method receives a login symbol input by the user via the touch screen and determines if the login symbol matches the symbolic password. The user is allowed to access the electronic device if the login symbol matches the symbolic password.

Abstract: Micromechanical structures having at least one lateral capacitive transducer gap filled with a dielectric and method of making same are provided. VHF and UHF MEMS-based vibrating micromechanical resonators filled with new solid dielectric capacitive transducer gaps to replace previously used air gaps have been demonstrated at 160 MHz, with Q's˜20,200 on par with those of air-gap resonators, and motional resistances (Rx's) more than 8× smaller at similar frequencies and bias conditions. This degree of motional resistance reduction comes about via not only the higher dielectric constant provided by a solid-filled electrode-to-resonator gap, but also by the ability to achieve smaller solid gaps than air gaps. These advantages with the right dielectric material may now allow capacitively-transduced resonators to match to the 50-377? impedances expected by off-chip components (e.g., antennas) in many wireless applications without the need for high voltages.

Abstract: A video capture device with attention attractive feature comprising: a video capture device; an attention attractive device, connecting to the video capture device; wherein the attention attractive device is used to attract the sight of eyes for video capture device to capture a better image.

Abstract: A method of sensing melt-front position and velocity is applicable for injection-molding systems. Firstly, at least one actuation signal value of the melt-injection device of the injection-molding system is retrieved, and at least one state variable value of the injection-molding system is measured. Then, the retrieved actuation signal values and the measured state variable values are substituted into a plurality of simultaneous equations to calculate the melt-front position and velocity of the injection-molding system.

Abstract: A resonator system such as a microresonator system and a method of making same are provided. In at least one embodiment, a mechanical circuit-based approach for boosting the Q of a vibrating micromechanical resonator is disclosed. A low Q resonator is embedded into a mechanically-coupled array of much higher Q resonators to raise the functional Q of the composite resonator by a factor approximately equal to the number of resonators in the array. The availability of such a circuit-based Q-enhancement technique has far reaching implications, especially considering the possibility of raising the functional Q of a piezoelectric resonator by merely mechanically coupling it to an array of much higher Q capacitively-transduced ones to simultaneously obtain the most attractive characteristics of both technologies: low impedance from the piezo-device and high-Q from the capacitive ones. Furthermore, the manufacturing repeatability of such micromechanical resonator-based products is enhanced.

Abstract: A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.

Abstract: Micromechanical structures having at least one lateral capacitive transducer gap filled with a dielectric and method of making same are provided. VHF and UHF MEMS-based vibrating micromechanical resonators filled with new solid dielectric capacitive transducer gaps to replace previously used air gaps have been demonstrated at 160 MHz, with Q's˜20,200 on par with those of air-gap resonators, and motional resistances (Rx's) more than 8× smaller at similar frequencies and bias conditions. This degree of motional resistance reduction comes about via not only the higher dielectric constant provided by a solid-filled electrode-to-resonator gap, but also by the ability to achieve smaller solid gaps than air gaps. These advantages with the right dielectric material may now allow capacitively-transduced resonators to match to the 50-377? impedances expected by off-chip components (e.g., antennas) in many wireless applications without the need for high voltages.

Abstract: The invention proposes a pipelined FFT processor for UWB system, comprising a first module for implementing radix-2 FFT algorithm; a second module is to realize radix-8 FFT algorithm; a third module is to realize radix-8 FFT algorithm; a plurality of conjugate blocks; a division block; and a plurality of multiplexers. The proposed pipelined FFT architecture called Mixed-Radix Multi-Path Delay Feedback (MRMDF) can provide higher throughput rate by using the multi-data-path scheme. The high-radix FFT algorithm is also realized in our processor to reduce the number of complex multiplications.

Abstract: A lead-frame-based semiconductor package and a lead frame thereof are proposed. The semiconductor package includes: the lead frame having at least one die pad and a plurality of leads around the die pad, wherein a plurality of grooves and runners are formed on a surface of the die pad, and each of the grooves is connected to an edge of the die pad by at least one of the runners; at least one chip mounted on the other surface of the die pad and electrically connected to the plurality of leads; and an encapsulant for encapsulating the chip, with the runners and grooves being exposed from the encapsulant. Thus, the flash problem in the prior art can be solved by means of the runners and grooves.

Abstract: A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.