Patents by Inventor Yu-Wen Tan

Yu-Wen Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120317
    Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
  • Patent number: 8313672
    Abstract: A kind of manufacturing method for dual functions with varistor material and device has one of the characteristics among capacitance, inductance, voltage suppressor and thermistor in addition to surge absorbing characteristic, which microstructural compositions include a glass substrate with high resistance and three kinds of low-resistance conductive or semiconductive particles in micron, submicron and nanometer size uniformly distributed in the glass substrate to provide with good surge absorbing characteristic.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: November 20, 2012
    Assignee: Leader Well Technology Co., Ltd.
    Inventors: Yu-Wen Tan, Jie-An Zhu, Li-Yun Zhang
  • Publication number: 20090321691
    Abstract: A kind of manufacturing method for dual functions with varistor material and device has one of the characteristics among capacitance, inductance, voltage suppressor and thermistor in addition to surge absorbing characteristic, which microstructural compositions include a glass substrate with high resistance and three kinds of low-resistance conductive or semiconductive particles in micron, submicron and nanometer size uniformly distributed in the glass substrate to provide with good surge absorbing characteristic.
    Type: Application
    Filed: September 3, 2009
    Publication date: December 31, 2009
    Applicant: LEADER WELL TECHNOLOGY CO., LTD.
    Inventors: Yu-Wen Tan, Jie-An Zhu, Li-Yun Zhang
  • Publication number: 20080286582
    Abstract: A surge absorbing material with dual functions has one of the characteristics among capacitance, inductance, voltage suppressor and thermistor in addition to surge absorbing characteristic, which microstructural compositions include a glass substrate with high resistance and three kinds of low-resistance conductive or semiconductive particles in micron, submicron and nanometer size uniformly distributed in the glass substrate to provide with good surge absorbing characteristic.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: LEADER WELL TECHNOLOGY CO., LTD.
    Inventors: Yu-Wen Tan, Jie-An Zhu, Li-Yun Zhang