Abstract: A carrier for different form factors for insertion in a slot of a computing device is disclosed. The different form factors have different thicknesses defined by the E1.S specification. The carrier includes a base holding a first type of form factor. A bezel is configurable for insertion in a slot for a device of the first type of form factor. The bezel has an attachment surface. The base is attachable to the attachment surface of the bezel. A second type of form factor is also attachable to the attachment surface of the bezel. A cover encloses the first type of form factor when joined to the base. The base and cover are discarded when the second type of form factor is attached to the bezel. The attached bezel and second type of form factor may also be inserted in the slot.

Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.

Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.

Abstract: A semiconductor device and a method of forming the same is disclosed. The semiconductor device includes a substrate, a first well region disposed within the substrate, a second well region disposed adjacent to the first well region and within the substrate, and an array of well regions disposed within the first well region. The first well region includes a first type of dopants, the second well region includes a second type of dopants that is different from the first type of dopants, and the array of well regions include the second type of dopants. The semiconductor device further includes a metal silicide layer disposed on the array of well regions and within the substrate, a metal silicide nitride layer disposed on the metal silicide layer and within the substrate, and a contact structure disposed on the metal silicide nitride layer.

Abstract: A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.

Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A method includes forming first and second semiconductor fins and a gate structure over a substrate; forming a first and second source/drain epitaxy structures over the first and second semiconductor fins; forming an interlayer dielectric (ILD) layer over the first and second source/drain epitaxy structures; etching the gate structure and the ILD layer to form a trench; performing a first surface treatment to modify surfaces of a top portion and a bottom portion of the trench to NH-terminated; performing a second surface treatment to modify the surfaces of the top portion of the trench to N-terminated, while leaving the surfaces of the bottom portion of the trench being NH-terminated; and depositing a first dielectric layer in the trench, wherein the first dielectric layer has a higher deposition rate on the surfaces of the bottom portion of the trench than on the surfaces of the bottom portion of the trench.

Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: A photosensitive assembly includes a circuit board. The circuit board has a first surface, a second surface opposite to the first surface, and a first through hole extending through the first surface and the second surface. A photosensitive chip is disposed on the second surface. The photosensitive chip has a photosensitive area and a non-photosensitive area connected to the photosensitive area, the non-photosensitive area is electrically connected to one side of the second surface, and the photosensitive area is exposed from the first through hole. A reinforcing plate is disposed on the first surface. A thermal conductive layer is disposed on the photosensitive chip, and the thermal conductive layer includes a silica gel or a metal.

Abstract: A CIS has a monolithic transfer gate electrode embedded in the semiconductor substrate. In some embodiments, the transfer gate electrode is below the surface. In some embodiments, the top of the transfer gate electrode is nearly even with or below a bottom of a floating diffusion region. In some embodiments, the transfer gate electrode wraps partially around the area of the floating diffusion region. In some embodiments, the transfer gate electrode wraps entirely around the area of the floating diffusion region. Embedding the transfer gate in the substrate reduces surface crowding and allows a scale reduction. The wrapping of the transfer gate electrode around the area of the floating diffusion region increases the area of the transfer gate channel while limiting the area that is occupied by the transfer gate.

Abstract: A probe card, a method for designing the probe card, a method for producing a tested semiconductor device, a method for testing an unpackaged semiconductor by the probe card, a device under test, and a probe system are provided. The probe card includes a wiring substrate, a connection carrier board, and a probe device. At least two probes form a differential pair electrically connected to a loopback line of the connection carrier board to form a test signal loopback path. The probe device has a probe device impedance on the test signal loopback path. The loopback line has a loopback line impedance on the test signal loopback path. A difference between the probe device impedance on the test signal loopback path and the loopback line impedance on the test signal loopback path is in an impedance range.

Abstract: Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.

Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.

Abstract: A disassembly device for disassembling a test object includes a first actuating portion and a second actuating portion. The first actuating portion is configured to fix a portion of the test object and apply a first pulling force on the test object. The second actuating portion is configured to fix another portion of the test object and apply a second pulling force on the test object. The first pulling force is opposite to the second pulling force.

Abstract: The present invention is directed to a capacitive touch panel, which primarily includes a singular substrate, a mask layer formed on a border region of the singular substrate, a capacitive sensing layer comprising a plurality of first-axis conductor assemblies and a plurality of second-axis conductor assemblies, wherein the singular substrate, the mask layer and the capacitive sensing layer are integrally formed, and insulated auxiliary medium filled in gaps between the first-axis conductor assemblies and the second-axis conductor assemblies, wherein the refractive index of the auxiliary medium matches the refractive index of the capacitive sensing layer.

Abstract: A screen capturing method and an electronic device using the same are provided. The screen capturing method includes that a continuous track is inputted. The continuous track includes a first stroke and a second stroke, and a first recording point is captured at a first moment of the first stroke, a second recording point is captured at a second moment of the second stroke. The first recording point includes a first velocity, and the second recording point includes a second velocity. The first velocity and the second velocity form an angle. A capturing box of a preset shape is enabled when the strokes meet the determining condition. An image is captured via the capturing box.

Abstract: A screen capturing method and an electronic device using the same are provided. The screen capturing method includes that a continuous track is inputted. The continuous track includes a first stroke and a second stroke, and a first recording point is captured at a first moment of the first stroke, a second recording point is captured at a second moment of the second stroke. The first recording point includes a first velocity, and the second recording point includes a second velocity. The first velocity and the second velocity form an angle. A capturing box of a preset shape is enabled when the strokes meet the determining condition. An image is captured via the capturing box.

Abstract: An additive type bio-decomposable composite is prepared by: mixing a synthesized bio-decomposable resin with refined sodium sulphate and additives in a high-low temperature mixing pot at a high mixing, and then crushing the mixture thus obtained and delivering the crushed mixture to a double-screw extruding machine for processing through blending, granulation and cooling steps into a white, uniform, grained, finished product. The additive type bio-decomposable composite thus prepared can be used with any of a variety of plastic materials for making decomposable plastic products that, when become waste after service, will decompose gradually under a variety of natural environmental conditions and return to nature. Therefore, the use of the additive type bio-decomposable composite in accordance with the present invention can reduce pollution and save the plastic material cost and meet environmentally friendly requirements.

Abstract: The present invention is directed to a capacitive touch panel, which primarily includes a singular substrate, a mask layer formed on a border region of the singular substrate, a capacitive sensing layer comprising a plurality of first-axis conductor assemblies and a plurality of second-axis conductor assemblies, wherein the singular substrate, the mask layer and the capacitive sensing layer are integrally formed, and insulated auxiliary medium filled in gaps between the first-axis conductor assemblies and the second-axis conductor assemblies, wherein the refractive index of the auxiliary medium matches the refractive index of the capacitive sensing layer.

Abstract: A loudspeaker frame has a body, a flange, a plurality of ribs connected therebetween and a metal disc securely retained within the body. The body has a central hole which is concentric to the flange. In an inner periphery of the central hole, a peripheral shoulder is formed for providing support and retaining effect to the metal disc when the frame is injection molded.