Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.

Abstract: A method of monitoring a clock signal of a server is provided. The server includes a phase-locked loop (PLL), a baseboard management controller (BMC), and a light emitting unit. The method includes steps of: A) the server executing a time synchronization service to obtain a synchronization mode that the PLL is operating in, where the synchronization mode is one of a free-run mode, a locked mode, and a holdover mode; B) the server updating the synchronization mode to the BMC when executing the time synchronization service; and C) the BMC storing the synchronization mode and controlling the light emitting unit to display in one of a plurality of displaying manners that corresponds to the synchronization mode.

Abstract: A user equipment assistance information (UAI) negotiation method, for a user equipment (UE) of mobile communication includes receiving a first OtherConfig element of an RRC reconfiguration message comprising a plurality of configuration parameters with SETUP values from a network terminal; sending a first UAI including a first value of a first configuration parameter of the configuration parameters to the network terminal; and receiving a first RRC reconfiguration message corresponding to the first UAI from the network terminal.

Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.

Abstract: An image sensor includes a group of sensor units and a color filter layer disposed within the group of sensor units. The image sensor further includes a dielectric structure and a plurality of polarization splitters disposed corresponding to the color filter layer. Each of the plurality of polarization splitters has a first meta element extending in a first direction from top view and a second meta element extending in a second direction from top view. The second direction is perpendicular to the first direction.

Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A computing system performs partial cache deactivation. The computing system estimates the leakage power of a cache based on operating conditions of the cache including voltage and temperature. The computing system further identifies a region of the cache as a candidate for deactivation based on cache hit counts. The computing system then adjusts the size of the region for the deactivation based on the leakage power and a bandwidth of a memory hierarchy device. The memory hierarchy device is at the next level to the cache in a memory hierarchy of the computing system.

Abstract: A computing system performs shared cache allocation to allocate cache resources to groups of tasks. The computing system monitors the bandwidth at a memory hierarchy device that is at a next level to the cache in a memory hierarchy of the computing system. The computing system estimates a change in dynamic power from a corresponding change in the bandwidth before and after the cache resources are allocated. The allocation of the cache resources are adjusted according to an allocation policy that receives inputs including the estimated change in the dynamic power and a performance indication of task execution.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A display driving apparatus applied to a panel is disclosed. The panel displays a first image with a first refresh rate. A first refresh cycle corresponding to the first refresh rate includes a refresh period and at least one non-refresh period. The display driving apparatus includes a real-time determination module and a data processing module. The real-time determination module is coupled to the panel and used to immediately determine whether the panel wants to replace the originally displayed first image with a second image during the first refresh cycle. The data processing module is coupled to the real-time determination module and the panel. If a determination result of the real-time determination module is yes, the data processing module immediately controls the panel to start to display the second image at a first time during the first refresh cycle.

Abstract: A display driving apparatus applied to a panel is disclosed. The panel displays a first image with a first refresh rate. A first refresh cycle corresponding to the first refresh rate includes a refresh period and at least one non-refresh period. The display driving apparatus includes a real-time determination module and a data processing module. The real-time determination module is coupled to the panel and used to immediately determine whether the panel wants to replace the originally displayed first image with a second image during the first refresh cycle. The data processing module is coupled to the real-time determination module and the panel. If a determination result of the real-time determination module is yes, the data processing module immediately controls the panel to start to display the second image at a first time during the first refresh cycle.

Abstract: A power supply module with enhanced heat dissipation effect includes a rack including an opening and an accommodating room connected to the opening, as well as at least one power supply including a fitting section inserted from the opening while positioned within the accommodating room, and a heat dissipation section extending toward the outside of the opening from the opening, in which the power supply is formed in the heat dissipation section with a plurality of heat dissipation holes, in such a way that air is capable of entering the power supply from an output end to form heat convection together with the dissipation holes, so as to form a heat dissipation effect with respect to the power supply.

Abstract: A method to avoid over-rebooting of a power supply device comprises Step 1: receiving a power-good signal generated by a power supply device working normally; Step 2: checking whether the power-good signal is received; if no, demanding the power supply device to reboot; and Step 3: recording a count of rebootings of the power supply device; after the power supply device reboots, checking again whether the power-good signal is received; if yes, letting the power supply device keep on working and resetting the count of rebootings; if no, demanding the power supply device to reboot again, accumulating the count of rebootings, and checking whether the count of rebootings is greater than a limited count of rebootings; if yes, forbidding the power supply device to reboot. Thus is solved the problem that a power supply device whose abnormality cannot be removed by rebooting may damage the information device.

Abstract: A power supply for a redundant power system includes a housing, a first circuit board, a second circuit board and a cooling fan. The first and second circuit boards are sequentially disposed in the housing. The length of the first circuit board is smaller than that of the second circuit board. Between the first and second circuit boards is a gap. The first and second circuit boards are each distributed with multiple electronic elements, and are connected by at least one electrical connecting line. The electronic elements form a power supply circuit, in which a bridge rectification module is disposed on the first circuit board and close to the gap. The cooling fan is at least connected to the first circuit board and a second circuit board to locate in the gap, and directly provides the bridge rectification module with a first cooling air current when activated.

Abstract: An inrush current recording module is installed in a power supply unit. The power supply unit has a front-stage power circuit and a back-stage power circuit. The front-stage power circuit includes a first ground terminal, and the back-stage power circuit includes a second ground terminal. The inrush current recording module includes a series circuit and a detection recording unit. The series circuit is formed by a capacitor and a resistor, and includes two ends thereof respectively connected to the first ground terminal and the second ground terminal. The detection recording unit detects the resistor to generate a voltage signal, compares the voltage signal with a voltage determination level, starts timing an inspection period when the voltage signal is greater than the voltage determination level, and records whether a current inrush current is harmful or harmless according to whether a power output signal is obtained within the inspection period.

Abstract: A method to avoid over-rebooting of a power supply device comprises Step 1: receiving a power-good signal generated by a power supply device working normally; Step 2: checking whether the power-good signal is received; if no, demanding the power supply device to reboot; and Step 3: recording a count of rebootings of the power supply device; after the power supply device reboots, checking again whether the power-good signal is received; if yes, letting the power supply device keep on working and resetting the count of rebootings; if no, demanding the power supply device to reboot again, accumulating the count of rebootings, and checking whether the count of rebootings is greater than a limited count of rebootings; if yes, forbidding the power supply device to reboot. Thus is solved the problem that a power supply device whose abnormality cannot be removed by rebooting may damage the information device.

Abstract: A damage identification method for a redundant power supply system is disclosed. The redundant power supply system comprises a plurality of power supply devices and a control unit. In application of the method, the control unit respectively sends switching signals to the power supply devices to boot every power supply device. The control unit checks whether each of the power supply devices sends back a power state signal. If at least one power supply device does not sends back the power state signal, the control unit resends the switching signal to the power supply device to compulsorily reboot the power supply device, which does not output the power state signal. Thereby is solved the problem that the conventional technology cannot instantly exclude temporary abnormalities and causes the user to misjudge the failure of a power supply device.

Abstract: A method for forcibly resetting a microcontroller is provided. A switching module is provided to power a microcontroller. The switching module detects through the control pin whether a notification port of a load connected to the control pin changes its potential level in response to a communication error between the load and the microcontroller detected by the load. When the switching module learns the change in the potential level of the notification pin, a powering status of the switching module is switched to stop powering the microcontroller to cause the microcontroller to stop operating. It is detected through the control pin whether the load again changes the potential level of the notification port in response to the microcontroller having stopped operating. When the change is detected, the powering status of the switching module is switched to again power and reactivate the microcontroller.