Abstract: A method of characterizing semiconductor device includes providing a silicon-on-insulator (SOI) substrate with at least a body-tied (BT) SOI device and a BT dummy device for measurement, respectively measuring tunneling currents (Igb) and scattering parameters (S-parameters) of the BT SOI device and the BT dummy device, subtracting Igb of BT dummy device from that of the BT SOI device to obtain Igb of a floating body (FB) SOI device, filtering characteristics of the BT dummy device out to extract S-parameters of the FB SOI device, and analyzing the S-parameters of the FB SOI device to obtain gate-related capacitances of the FB SOI device.

Abstract: A method of characterizing semiconductor device includes providing a silicon-on-insulator (SOI) substrate with at least a body-tied (BT) SOI device and a BT dummy device for measurement, respectively measuring tunneling currents (Igb) and scattering parameters (S-parameters) of the BT SOI device and the BT dummy device, subtracting Igb of BT dummy device from that of the BT SOI device to obtain Igb of a floating body (FB) SOI device, filtering characteristics of the BT dummy device out to extract S-parameters of the FB SOI device, and analyzing the S-parameters of the FB SOI device to obtain gate-related capacitances of the FB SOI device.

Abstract: A device structure and a method of fabricating an electrostatic discharge (ESD) protection circuit on a semiconductor device. A substrate is provided. A layer of silicon oxide is formed on the substrate. A photoresist mask is formed on the layer of silicon oxide. A species of n-type ions is implanted into the surface to form source/drain regions in the ESD protection area. After removing the photoresist, a metal layer is blanket deposited over the surface. A thermal process is performed to form salicide layers on the source/drain regions. A patterned photoresist is respectively formed to cover a portion of the salicide layer. An etching process is performed to strip away the exposed portion of the salicide layer.

Abstract: A via plug layout structure for connecting different metallic layers. The structure includes a plurality of via plugs arranged in a fan-shaped pattern and a plurality of empty bars positioned between a single via plug and the fanned-out via plugs so that incoming current to the single via plug is equally distributed to every one of the fanned-out via plug and current stress in each fanned-out via plug is identical. Hence, via plugs having particularly serious electromigration problem can be discovered. In addition, single via plug having different critical dimension can be fabricated so that maximum critical dimension sustainable by the via plug is determined after an electromigration test.

Abstract: A system for programming arrays of floating gate memory cells reduces programming current requirements, and reduces wordline and bitline stress during programming. A word-to-be-programmed into a floating gate memory array is divided into a plurality of smaller subwords. Only one subword is programmed at a time, thereby reducing programming current requirements. Additionally, subwords which are successfully programmed are not reprogrammed even if bits in other subwords do not program properly. This creates less wordline stress than previous systems which program an entire word at once, thereby requiring subwords which program successfully to be reprogrammed along with subwords which fail to program. Finally, within each subword only those bits which failed to program are reprogrammed, thereby reducing bitline stress during reprogramming for those bits which were successfully programmed.

Abstract: A floating gate memory device which includes control circuits to generate a repair pulse to repair over-erased cells so they may be repaired block-by-block. This invention includes repairing the cells by applying a repair pulse to the cell's bit line while maintaining the word line voltage above ground. In a different embodiment, the word line voltage is maintained at two different voltage levels above ground. In the first stage, the word line voltage is maintained between approximately 0.1 volts and 0.2 volts for approximately 100 ms while the repair pulse is applied. In the second stage, the word line voltage is maintained between approximately 0.4 volts and 0.5 volts for approximately 100 ms while the repair pulse is applied.

Abstract: Substantial reduction in peak current encountered during an erase process for a flash memory device is achieved by selection of source voltage potential during the erase according to the expected band-to-band tunneling current encountered during the process. During the beginning of the process, a lower source voltage potential is selected, which is high enough to cause significant erasing while suppressing band-to-band tunneling current in a portion of the array, and during a second part of the erasing process, a higher source potential is utilized, which ensures successful erasing of the array, without exceeding the peak current requirements of the power supply used with the device. The first and second parts of the erase sequence will induce band-to-band tunneling current in addition to Fowler-Nordheim tunneling current. The band-to-band tunneling current is characterized by a turn on threshold source potential which is inversely related to the threshold of the cell receiving the voltage sequence.