Patents by Inventor Yuan Chao

Yuan Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177319
    Abstract: Many unsupervised domain adaptation (UDA) methods have been proposed to bridge the domain gap by utilizing domain invariant information. Most approaches have chosen depth as such information and achieved remarkable successes. Despite their effectiveness, using depth as domain invariant information in UDA tasks may lead to multiple issues, such as excessively high extraction costs and difficulties in achieving a reliable prediction quality. As a result, we introduce Edge Learning based Domain Adaptation (ELDA), a framework which incorporates edge information into its training process to serve as a type of domain invariant information. Our experiments quantitatively and qualitatively demonstrate that the incorporation of edge information is indeed beneficial and effective, and enables ELDA to outperform the contemporary state-of-the-art methods on two commonly adopted benchmarks for semantic segmentation based UDA tasks.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ting-Hsuan Liao, Huang-Ru Liao, Shan-Ya Yang, Jie-En Yao, Li-Yuan Tsao, Hsu-Shen Liu, Bo-Wun Cheng, Chen-Hao Chao, Chia-Che Chang, Yi-Chen Lo, Chun-Yi Lee
  • Patent number: 11991882
    Abstract: A method for fabricating a memory device includes: providing a substrate; forming a first dielectric layer over the substrate; forming a plurality of conductive layers and a plurality of dielectric layers alternately and horizontally disposed on the substrate; forming a channel column structure on the substrate and in the plurality of conductive layers and the plurality of dielectric layers, where a side wall of the channel column structure is in contact with the plurality of conductive layers; forming a second dielectric layer covering the first dielectric layer; and forming, in the first and second dielectric layers, a conductive column structure adjacent to the channel column structure and in contact with one of the plurality of conductive layers, where the conductive column structure includes a liner insulating layer as a shell layer.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: May 21, 2024
    Assignee: MACRONIX International Co., Ltd.
    Inventors: Yao-An Chung, Yuan-Chieh Chiu, Ting-Feng Liao, Kuang-Wen Liu, Kuang-Chao Chen
  • Patent number: 11980026
    Abstract: A random code generating method for the magnetoresistive random access memory is provided. Firstly, a first magnetoresistive random access memory cell and a second magnetoresistive random access memory cell are programmed into an anti-parallel state. Then, an initial value of a control current is set. Then, an enroll action is performed on the first and second magnetoresistive random access memory cells. If the first and second magnetoresistive random access memory cells fail to pass the verification action, the control current is increased by a current increment, and the step of setting the control current is performed again. If the first and second magnetoresistive random access memory cells pass the verification action, a one-bit random code is stored in the first magnetoresistive random access memory cell or the second magnetoresistive random access memory cell.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: May 7, 2024
    Assignee: EMEMORY TECHNOLOGY INC.
    Inventors: Tsung-Mu Lai, Chun-Yuan Lo, Chun-Chieh Chao
  • Publication number: 20240108820
    Abstract: An atomization device and a method of predicting atomization time for the same are provided. The atomization device includes a control module, an atomization module and a breathing sensing module. The method includes: configuring the breath sensing module to detect inhalations of a user using the atomization device, so as to generate initial breath data correspondingly; and configuring the control module to perform: comparing inhalation data of the initial breath data with a valid inhalation standard to obtain valid inhalation data and filter noise; statistically analyzing the valid inhalation data to generate a predicted value of inhalation time; calculating an atomization time according to the predicted value of the inhalation time; and generating a driving signal to drive the atomization module to perform atomization according to the atomization time.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 4, 2024
    Inventors: CHIEN-SHEN TSAI, SHIH-CHAO LUO, YUAN-MING HSU, CHUN-CHIA JUAN
  • Publication number: 20240105351
    Abstract: A method for measuring drop time of a control rod cluster integrated with a rod position measurement device is provided, wherein the method is used to measure the drop time of each control rod cluster, and includes: Si, monitoring a voltage Ua of coils in Group A to capture a rod cluster drop signal; S2, searching a point (tmax, Vmax) with a maximum drop speed or with a local maximum drop speed; S3, retroactively calculating, from tmax, an end of a time period T4 when the control rod cluster starts to drop; S4, retroactively searching, from a minimum value point of a drop reference signal DROPref, a start of the time period T4 when the drop reference signal DROPref drops from a maximum value to 33% thereof; and S5, determining, from tmax forward, a time point t6 when a drop speed of the control rod cluster is lower than 0.
    Type: Application
    Filed: January 14, 2021
    Publication date: March 28, 2024
    Applicant: NUCLEAR POWER OPERATIONS RESEARCH INSTITUTE (NPRI)
    Inventors: Zhengke CHANG, Minghui ZHANG, Yuan HUANG, Ye TIAN, Shaohua XU, Xinxin LIU, Weijian ZHU, Yiming MA, Shengfeng XU, Bo CHAO, Ning TAO, Zihua YANG, Desong LANG, Qichao WANG
  • Patent number: 11923405
    Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen
  • Publication number: 20240072230
    Abstract: An electronic device is provided, including a substrate and a plurality of electronic units disposed on the substrate. The substrate includes a first edge extending along a first direction and a second edge extending along a second direction. The electronic units include first, second, and third electronic units arranged adjacently along the first direction. The first electronic unit is closer to the second edge than the third electronic unit. A pitch between the second and third electronic units is greater than a pitch between the first and second electronic units. The electronic units include fourth, fifth and sixth electronic units arranged adjacently along the second direction. The fourth electronic unit is closer to the first edge than the sixth electronic unit. A pitch between the fourth and fifth electronic units is greater than a pitch between the fifth and sixth electronic units.
    Type: Application
    Filed: November 5, 2023
    Publication date: February 29, 2024
    Inventors: Shun-Yuan HU, Ming-I Chao
  • Publication number: 20230204662
    Abstract: A multi-die integrated circuit uses an on-chip test distribution module to distribute test data to different dies, such as processor chiplets. The test distribution module receives test input data from an external source via one or more integrated circuit pins and distributes the test input data to the different dies, such that the different dies are able to concurrently apply the test data to one or more circuits. Based on application of the test input data the different dies concurrently generate corresponding test results that are used to identify and address design or operation errors at the dies.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 29, 2023
    Inventors: Arie MARGULIS, Tassanee PAYAKAPAN, Yuan Chao
  • Publication number: 20230013733
    Abstract: The invention relates to a microcarrier, comprising a continuous medium of a biocompatible polymer for culturing cells and having a three-dimensional scaffold architecture delineated peripherally by a continuous outer wall, in which spherical macropores are stacked to one another and interconnected by connecting pores. The continuous outer wall is formed with exposure pores at positions where it is in contact with the macropores, through which the interior of the microcarrier may be in fluid communication with the ambient culture medium. The microcarrier herein is produced by cast-molding and, therefore, has a continuous outer wall which provides additional mechanical strength while maintaining high porosity. The microcarrier thus produced is configured in the form of a basic geometrical body. The invention further relates to a cast-molding process for producing the microcarrier.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 19, 2023
    Inventors: Pan LIN, Tzu-Yuan CHAO, Guan-Chi CHEN, Yi-Fan HSIEH
  • Patent number: 11530256
    Abstract: The present disclosure relates to an antibody or antigen-binding fragment thereof that specifically bind to ?-toxin of Staphylococcal aureus. The present disclosure also relates to a pharmaceutical composition, a method for treating and/or preventing diseases and/or disorders caused by Staphylococcal aureus infection in a subject in need, and a method for detecting ?-toxin of Staphylococcal aureus in a sample.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: December 20, 2022
    Assignee: SYNERMORE BIOLOGICS (SUZHOU) CO., LTD.
    Inventors: Tzu-Yuan Chao, Ching-Wen Chang, Eric Tsao
  • Publication number: 20220377460
    Abstract: A dipole pair audio system (e.g., integrated into an artificial reality headset) comprising a first audio assembly and a second audio assembly. The first audio assembly is configured to generate first acoustic pressure waves, and vent the first acoustic pressure waves into a local area via a first positive vent and a first negative vent. The second audio assembly is configured to generate second acoustic pressure waves, and vent the second acoustic pressure waves into the local area via a second positive vent and a second negative vent. The first acoustic pressure waves and the second acoustic pressure waves are the same and in phase for frequencies below a threshold frequency, and are the same but are out of phase for frequencies at or above the threshold frequency.
    Type: Application
    Filed: May 21, 2021
    Publication date: November 24, 2022
    Inventors: Simon Porter, Rick Yuan Chao, Marshall Chiu
  • Patent number: 11504393
    Abstract: The invention is to provide a hydrogen sulfide sustained releasing dressing and a manufacturing method thereof. The hydrogen sulfide sustained releasing dressing includes a hydrocolloid, a surfactant and sodium hydro sulfide. The manufacturing method includes (a) heating and stirring a hydrocolloid material; (b) adding a surfactant and sodium hydrosulfide into the hydrocolloid material; and (c) injecting the hydrocolloid material containing the surfactant and the sodium hydrosulfide into a mold for thermoforming a hydrogen sulfide sustained releasing dressing.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: November 22, 2022
    Assignee: BenQ Materials Corporation
    Inventors: Lie-Sian Yap, Chih-Yuan Chao, Yu-Pu Wang
  • Patent number: 11485953
    Abstract: The present disclosure provides for a cell stabilizing medium which comprises gelatin. The cell stabilizing medium help maintain cell viability, e.g., after thawing of a biological material post-cryopreservation.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: November 1, 2022
    Assignee: TRANSWELL BIOTECH CO., LTD.
    Inventors: Ya-Hsuan Chang, Cheng-Yi Lin, Chih-Yuan Chao
  • Publication number: 20220272840
    Abstract: A double-sided and multilayer flexible printed circuit (FPC) substrate contains: a body, multiple tilted vias passing through the body, a sputtering layer, multiple conductive portions, and multiple copper circuit layers. The sputtering layer is adhered on the body and the multiple tilted vias. A respective conductive portion is formed in a respective titled via and is connected with the sputtering layer. The multiple copper circuit layers are located on a top and a bottom of the body and are connected with the sputtering layer, and the multiple copper circuit layers are connected via the multiple conductive portions.
    Type: Application
    Filed: February 22, 2021
    Publication date: August 25, 2022
    Inventors: Sui-Ho Tsai, Cheng-Neng Chen, Yun-Nan Wang, Chih-Yuan Chao, Hsueh-Tsung Lu
  • Patent number: 11406018
    Abstract: A double-sided and multilayer flexible printed circuit (FPC) substrate contains: a body, multiple tilted vias passing through the body, a sputtering layer, multiple conductive portions, and multiple copper circuit layers. The sputtering layer is adhered on the body and the multiple tilted vias. A respective conductive portion is formed in a respective titled via and is connected with the sputtering layer. The multiple copper circuit layers are located on a top and a bottom of the body and are connected with the sputtering layer, and the multiple copper circuit layers are connected via the multiple conductive portions.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: August 2, 2022
    Assignee: APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
    Inventors: Sui-Ho Tsai, Cheng-Neng Chen, Yun-Nan Wang, Chih-Yuan Chao, Hsueh-Tsung Lu
  • Publication number: 20210317193
    Abstract: The present disclosure relates to an antibody or antigen-binding fragment thereof that specifically bind to ?-toxin of Staphylococcal aureus. The present disclosure also relates to a pharmaceutical composition, a method for treating and/or preventing diseases and/or disorders caused by Staphylococcal aureus infection in a subject in need, and a method for detecting ?-toxin of Staphylococcal aureus in a sample.
    Type: Application
    Filed: March 24, 2021
    Publication date: October 14, 2021
    Inventors: Tzu-Yuan CHAO, Ching-Wen CHANG, Eric TSAO
  • Publication number: 20200237811
    Abstract: The invention is to provide a hydrogen sulfide sustained releasing dressing and a manufacturing method thereof. The hydrogen sulfide sustained releasing dressing includes a hydrocolloid, a surfactant and sodium hydro sulfide. The manufacturing method includes (a) heating and stirring a hydrocolloid material; (b) adding a surfactant and sodium hydrosulfide into the hydrocolloid material; and (c) injecting the hydrocolloid material containing the surfactant and the sodium hydrosulfide into a mold for thermoforming a hydrogen sulfide sustained releasing dressing.
    Type: Application
    Filed: December 5, 2019
    Publication date: July 30, 2020
    Inventors: Lie-Sian YAP, Chih-Yuan CHAO, Yu-Pu WANG
  • Publication number: 20180094235
    Abstract: The present disclosure provides for a cell stabilizing medium which comprises gelatin. The cell stabilizing medium help maintain cell viability, e.g., after thawing of a biological material post-cryopreservation.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 5, 2018
    Inventors: Ya-Hsuan CHANG, Cheng-Yi LIN, Chih-Yuan CHAO
  • Publication number: 20180013443
    Abstract: An analog-to-digital conversion device is provided that includes a front SAR ADC and a plurality of rear SAR ADCs. The front SAR ADC is configured to convert an analog input signal into a group of higher bits of a digital output signal in response to different time periods. Each of the rear SAR ADCs is electrically coupled to the front SAR ADC and is configured to receive the analog input signal and the corresponding group of higher bits in response to the different time periods. The rear SAR ADCs convert the analog input signal into a group of lower bits of the digital output signal corresponding to the time period of the group of higher bits.
    Type: Application
    Filed: September 5, 2016
    Publication date: January 11, 2018
    Inventors: Chieh-Yuan CHAO, Ting-Hao WANG, Wen-Juh KANG
  • Patent number: 9620051
    Abstract: Method and apparatus for a display bridge with support for multiple display interfaces are disclosed. The novel display bridge comprises a predriver configured to provide data input signals. A shared output driver is configured to receive the data input signals and provide output display signals compatible for driving MIPI-DSI, EDP, or LVDS displays. A regulator and current source is coupled to the shared output driver configured to regulate the shared output driver operating voltage and provide a current source for the shared output driver. A shared termination output coupled to the shared output driver is configured to provide termination resistance for the output display signals and termination voltage for the termination resistance.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: April 11, 2017
    Assignee: Amlogic Co., Limited
    Inventors: Chao Shi, Chieh-Yuan Chao, Jinguo He, Xiang OuYang