Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

Abstract: A method for manufacturing an antenna includes the steps of: providing a ferrite sheet; forming a via hole through the ferrite sheet, wherein the via hole is connected between a first surface and a second surface of the ferrite sheet; forming a nonconductive ink layer on the first surface and the second surface and in the via hole of the ferrite sheet; applying a displacement process to the nonconductive ink layer so as to form a first metal layer on the nonconductive ink layer; and applying a thickening process to the first metal layer so as to form a second metal layer on the first metal layer, wherein the first metal layer and the second metal layer both extend from the first surface through the via hole to the second surface of the ferrite sheet.

Abstract: An antenna structure is provided. The antenna structure includes a metal sheet including an antenna branch and a grounding structure, wherein the antenna branch and the grounding structure are formed in one piece from the metal sheet, wherein the metal sheet has a top surface and a bottom surface, and the top surface and the bottom surface are opposite each other; a conductive glue disposed over the bottom surface of the metal sheet; and a supporting material disposed over a bottom surface of the conductive glue, wherein the supporting material is disposed corresponding to the antenna branch of the metal sheet. A method for manufacturing the antenna structure is also provided.

Abstract: An antenna structure includes a ferromagnetic patch, first metal conductive lines, second metal conductive lines, and metal connection elements. The ferromagnetic patch has a first surface and a second surface, and the second surface is opposite to the first surface. The first metal conductive lines are disposed on the first surface of the ferromagnetic patch. The second metal conductive lines are disposed on the second surface of the ferromagnetic patch. The metal connection elements penetrate the ferromagnetic patch. The metal connection elements further connect the first metal conductive lines to the second metal conductive lines, respectively.

Abstract: An antenna structure is provided. The antenna structure includes a metal sheet including an antenna branch and a grounding structure, wherein the antenna branch and the grounding structure are formed in one piece from the metal sheet, wherein the metal sheet has a top surface and a bottom surface, and the top surface and the bottom surface are opposite each other; a conductive glue disposed over the bottom surface of the metal sheet; and a supporting material disposed over a bottom surface of the conductive glue, wherein the supporting material is disposed corresponding to the antenna branch of the metal sheet. A method for manufacturing the antenna structure is also provided.

Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

Abstract: An antenna structure includes a ferromagnetic patch, first metal conductive lines, second metal conductive lines, and metal connection elements. The ferromagnetic patch has a first surface and a second surface, and the second surface is opposite to the first surface. The first metal conductive lines are disposed on the first surface of the ferromagnetic patch. The second metal conductive lines are disposed on the second surface of the ferromagnetic patch. The metal connection elements penetrate the ferromagnetic patch. The metal connection elements further connect the first metal conductive lines to the second metal conductive lines, respectively.

Abstract: A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.

Abstract: A method for manufacturing an antenna includes the steps of: providing a ferrite sheet; forming a via hole through the ferrite sheet, wherein the via hole is connected between a first surface and a second surface of the ferrite sheet; forming a nonconductive ink layer on the first surface and the second surface and in the via hole of the ferrite sheet; applying a displacement process to the nonconductive ink layer so as to form a first metal layer on the nonconductive ink layer; and applying a thickening process to the first metal layer so as to form a second metal layer on the first metal layer, wherein the first metal layer and the second metal layer both extend from the first surface through the via hole to the second surface of the ferrite sheet.

Abstract: A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.

Abstract: An embodiment of the invention provides a method for forming an antenna which includes: providing a workpiece having a surface; providing a compression head including a main body, a soft rubber head disposed on the main body, and at least a through-hole, wherein the through-hole penetrates through the main body and the soft rubber head; adsorbing and fixing a conducting film on the soft rubber head through the through-hole; moving the compression head against the surface of the workpiece to press the conducting film onto the surface of the workpiece; removing the compression head; and patterning the conducting film.

Abstract: A portable electronic apparatus with antenna structure is disclosed. The portable electronic apparatus includes an apparatus casing, an antenna structure, and an electronic component. The apparatus casing has an accommodating space and an appearance casing. The antenna structure is disposed adjacent to the appearance casing. The electronic component is disposed in the accommodating space and leaks electromagnetic wave during operation. Thereby, even though the electronic component leaks electromagnetic wave toward the antenna structure, the invention can reduce the influence on the antenna structure by the leaked electromagnetic wave by disposing the antenna structure as away from the electronic component as possible. Therefore, the antenna structure still can work normally during the operation of the electronic component, which solves the problem that an antenna structure of a conventional portable electronic apparatus is easily interrupted in the range of the leaked electromagnetic wave in the prior art.

Abstract: A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.

Abstract: The present invention provides a connecting module having at least one passive component including a substrate, a connecting wire layout, at least one passive component and a chip-setting area, wherein the connecting wire layout is formed on the substrate, the passive components are formed on the connecting wire layout to electrically connect to the connecting wire layout. The chip-setting areas are formed in the substrate locating at different areas from the connecting wire layout, wherein the size of the passive components can be adjusted to match the needed impedance, and the numbers and the location of the chip-setting areas can be adjusted dynamically for reducing the dimension of the module.

Abstract: A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.