Patents by Inventor Yuan-Chuan Steven Chen

Yuan-Chuan Steven Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method to monitor die edge defects
    Patent number: 10026664
    Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: July 17, 2018
    Assignee: INTEL CORPORATION
    Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen
  • APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS
    Publication number: 20170141006
    Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
    Type: Application
    Filed: January 31, 2017
    Publication date: May 18, 2017
    Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen
  • Apparatus and method to monitor die edge defects
    Patent number: 9564381
    Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: February 7, 2017
    Assignee: Intel Corporation
    Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen
  • APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS
    Publication number: 20160043011
    Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
    Type: Application
    Filed: October 6, 2015
    Publication date: February 11, 2016
    Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen
  • Apparatus and method to monitor die edge defects
    Patent number: 9159646
    Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: October 13, 2015
    Assignee: Intel Corporation
    Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen
  • APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS
    Publication number: 20140168879
    Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen
  • Integrated circuit testing with laser stimulation and emission analysis
    Patent number: 7777507
    Abstract: A diagnostic tool for testing an integrated circuit device directs a beam of laser energy to stimulate at least a portion of the device. In one mode, electromagnetic waves from said device may be detected at the same time in response to the stimulation. A processor collects image data and determines as a function of the collected image data whether the device has a defect. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: August 17, 2010
    Assignee: Intel Corporation
    Inventors: Daniel Richard Bockelman, Yuan-Chuan Steven Chen, Christopher John Brookreson, Md Asifur Rahman
  • INTEGRATED CIRCUIT TESTING WITH LASER STIMULATION AND EMISSION ANALYSIS
    Publication number: 20080238435
    Abstract: A diagnostic tool for testing an integrated circuit device directs a beam of laser energy to stimulate at least a portion of the device. In one mode, electromagnetic waves from said device may be detected at the same time in response to the stimulation. A processor collects image data and determines as a function of the collected image data whether the device has a defect. Other embodiments are described and claimed.
    Type: Application
    Filed: March 26, 2007
    Publication date: October 2, 2008
    Inventors: Daniel Richard Bockelman, Yuan-Chuan Steven Chen, Christopher John Brookreson, Md Asifur Rahman