Abstract: A method and device for identifying the washing quality of a feather material are applied to a feather material washing apparatus and essentially entail: a sampling unit that takes an appropriate amount of the water discharged from the feather material washing apparatus as a water sample, an impurity removing module that removes feather fiber and impurities that may compromise inspection accuracy, and a laser sensing device that senses, while the water sample is static, a transparency value of a portion of the water sample that extends across a predetermined distance, in order to identify the washing quality of a washed feather material. The method and device for identifying the washing quality of a feather material exercise intelligent judgment to enable a consistent standard, to ensure the efficiency and quality of a feather material washing procedure, and to reduce the associated costs.

Abstract: An apparatus includes a slicer circuit, a frequency acquisition circuit, a phase acquisition circuit and an oscillator circuit. The slicer circuit may be configured to (i) generate an output signal by slicing a data signal in response to a clock signal and (ii) generate a crossing signal in response to the data signal and the clock signal. The frequency acquisition circuit may be configured to generate a first control signal and a second control signal in response to the data signal and the clock signal. The phase acquisition circuit may be configured to generate a third control signal in response to the first control signal and the data crossing signal. The oscillator circuit may be configured to generate the clock signal in response to the second control signal and the third control signal. The second control signal may shift an adjustable frequency range of the clock signal.

Abstract: An operation member for an electronic device is provided. The electronic device includes a casing having portions defining an opening and a circuit module having a circuit board. The circuit board includes a controller. The operation member includes a body including an operating end and a coupling end, and a skirt member. The body is configured to partially protrude through the opening of the casing for operating. The skirt member is arranged at the coupling end. The skirt member includes a base plate outwardly extending from the coupling end, a wall upwardly extending from peripheral portions of the base plate, and a groove defined between the wall and the body. The operation member is configured to associate with the electronic device, and the operation member with the body and the skirt is completely separated from the casing.

Abstract: An operation member for an electronic device is provided. The electronic device includes a casing having portions defining an opening and a circuit module having a circuit board. The circuit board includes a controller. The operation member includes a body including an operating end and a coupling end, and a skirt member. The body is configured to partially protrude through the opening of the casing for operating. The skirt member is arranged at the coupling end. The skirt member includes a base plate outwardly extending from the coupling end, a wall upwardly extending from peripheral portions of the base plate, and a groove defined between the wall and the body. The operation member is configured to associate with the electronic device, and the operation member with the body and the skirt is completely separated from the casing.

Abstract: An operation member includes a body having an operating end and a coupling end, and a skirt member. The skirt member is arranged at the coupling end. The skirt member includes a base plate outwardly extending from the coupling end, a wall extending from the base plate, and a groove defined between the outer surface of the wall and the body. The electronic device includes a casing, an operation member, and a circuit module. The casing has portions defining an opening. The circuit module has a circuit board including a controller disposed thereon. The above-mentioned operation member is sleeved onto the controller and passes through the opening. The outer surface of the operation member and the opening define a gap therebetween. The groove is correspondingly arranged proximate to the gap to gather small particles entering the gap.

Abstract: A mounting mechanism for gripping DIN rail comprises: a main body and a latching body. The main body includes a first mounting portion having a stopper member and at least one first retaining unit, and a second mounting portion. The latching portion is movably disposed in the first mounting portion and includes at least one resilient portion and at least one second retaining unit. When one end of the latching body protrudes into the second mounting portion, the range of movement of the latching body spans from a position wherein the resilient portion abuts the stopper member to a position in wherein the second retaining unit abuts the first retaining unit. The main body is movably latched onto the DIN rail through the second mounting portion, and is fixed to a position on the DIN rail through one end of the latching body protruding into the second mounting portion.

Abstract: A mounting mechanism for gripping DIN rail comprises: a main body and a latching body. The main body includes a first mounting portion having a stopper member and at least one first retaining unit, and a second mounting portion. The latching portion is movably disposed in the first mounting portion and includes at least one resilient portion and at least one second retaining unit. When one end of the latching body protrudes into the second mounting portion, the range of movement of the latching body spans from a position wherein the resilient portion abuts the stopper member to a position in wherein the second retaining unit abuts the first retaining unit. The main body is movably latched onto the DIN rail through the second mounting portion, and is fixed to a position on the DIN rail through one end of the latching body protruding into the second mounting portion.

Abstract: An operation member includes a body having an operating end and a coupling end, and a skirt member. The skirt member is arranged at the coupling end. The skirt member includes a base plate outwardly extending from the coupling end, a wall extending from the base plate, and a groove defined between the outer surface of the wall and the body. The electronic device includes a casing, an operation member, and a circuit module. The casing has portions defining an opening. The circuit module has a circuit board including a controller disposed thereon. The above-mentioned operation member is sleeved onto the controller and passes through the opening. The outer surface of the operation member and the opening define a gap therebetween. The groove is correspondingly arranged proximate to the gap to gather small particles entering the gap.

Abstract: A golf club head includes a metal surface and at least one colored, transparent coating layer formed thereon. The colored, transparent coating layer contains a resin material and a coloring material. The colored, transparent coating layer exposes the metal surface of the golf club head in the coloring material that enhances the appearance of the golf club head. In an embodiment, the colored, transparent coating layer includes a first colored layer and a second colored layer. The first colored layer and the second colored layer vary in colors, or the colors of the first colored layer and the second colored layer vary in depth.

Abstract: A surface finishing tool and a fabricating method for forming a pattern on a golf club head are provided. The surface finishing tool comprises a shank, a resilient cylinder, and a rubbing head. The shank has a center axis, and the resilient cylinder is disposed along the center axis and fixed on an end of the shank. The rubbing head has a rough surface and is disposed on the resilient cylinder. The fabricating method applies the surface finishing tool to form the pattern on the golf club head, wherein the surface finishing tool is driven to rotate along the center axis first. Then, the surface finishing tool is moved for keeping the rough surface of the rubbing head contacting with the golf club head, wherein the resilient cylinder is deformed along a profile of the golf club head as the rubbing head contacts with the golf club head.

Abstract: A method for making a precision molding glass includes the steps of: preparing a molding device including first and second molds, the first mold having a first molding surface, a first edge, and a first distal peripheral portion, the second mold having a second molding surface, a second edge, and a second distal peripheral portion; mounting a centering unit having a shearing portion around the molding device; placing a glass material between the first and second molding surfaces; heating the glass material; molding the glass material until the glass material is pressed to have a predetermined central thickness and until an excess amount of the glass material is squeezed out of the first and second edges; lowering the temperature of the glass material; and while the glass material is still soft, moving the centering unit such that the shearing portion removes the excess amount of the glass material.

Abstract: A delamination-preventing substrate and a semiconductor package with the substrate are provided. A metal layer and a solder mask layer are sequentially laminated on a chip attach area of a substrate, and both formed with corresponding openings for partly exposing the substrate. This allows an adhesive for chip-bonding use to be directly attached to the substrate via the openings, so as to reduce contact area between the adhesive and the metal layer, and to increase bonding between the substrate and a chip mounted on the substrate by means of the adhesive. Direct contact between the adhesive and the substrate also helps reduce stress generated between the chip and substrate, thereby preventing stress-induced delamination. Due to weak adhesion between adhesive and metal materials, reduced contact area between the adhesive and the metal layer would further enhance bonding of the chip to the substrate, thereby assuring quality of fabricated package products.

Abstract: A delamination-preventing substrate and a semiconductor package with the substrate are provided. A metal layer and a solder mask layer are sequentially laminated on a chip attach area of a substrate, and both formed with corresponding openings for partly exposing the substrate. This allows an adhesive for chip-bonding use to be directly attached to the substrate via the openings, so as to reduce contact area between the adhesive and the metal layer, and to increase bonding between the substrate and a chip mounted on the substrate by means of the adhesive. Direct contact between the adhesive and the substrate also helps reduce stress generated between the chip and substrate, thereby preventing stress-induced delamination. Due to weak adhesion between adhesive and metal materials, reduced contact area between the adhesive and the metal layer would further enhance bonding of the chip to the substrate, thereby assuring quality of fabricated package products.

Abstract: A semiconductor package and a method for fabricating the same are proposed, in which a chip is attached to a die pad formed with an opening in a manner that the chip covers the opening and a surface of the chip is partially exposed to the opening. A covering layer is formed on the exposed surface of the chip, so as to fill a gap formed between the chip and the die pad in proximity to the opening, and allow air in the gap to be dissipated. This makes an encapsulant formed for encapsulating the chip and the die pad with no void formed therein, so that no die crack or popcorn effect occurs in the fabricated product, and thus quality and reliability of the semiconductor package can be assured.

Abstract: Method of eliminating silicon residual from wafer after dicing saw process includes the steps of adhering a first adhesive tape or coating a cover layer on the surface of a wafer, transferring the adhered or coated wafer to a wafer dicing machine for forming dies, and removing the first adhesive tape or cover layer from the wafer. Silicon residual generated during dicing saw process will be deposited on the first adhesive tape or cover layer without depositing on the die surface. Removing the adhesive tape or cover layer will also remove the silicon residual. Thus wafer surface may be prevented from contamination of silicon residual and the consequent manufacturing processes and product quality won't be adversely affected.