Patents by Inventor Yuan-Li Chien

Yuan-Li Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation assembly of M.2 expansion card and electronic device
    Patent number: 11191149
    Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 30, 2021
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Yuan-Li Chien, Yen-Yun Chang
  • HEAT DISSIPATION ASSEMBLY OF M.2 EXPANSION CARD AND ELECTRONIC DEVICE
    Publication number: 20200170101
    Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.
    Type: Application
    Filed: January 8, 2020
    Publication date: May 28, 2020
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Yuan-Li Chien, Yen-Yun Chang
  • HEAT DISSIPATION ASSEMBLY OF M.2 EXPANSION CARD AND ELECTRONIC DEVICE
    Publication number: 20200170100
    Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.
    Type: Application
    Filed: January 21, 2019
    Publication date: May 28, 2020
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Yuan-Li Chien, Yen-Yun Chang
  • Heat dissipation assembly of M.2 expansion card and electronic device
    Patent number: 10645794
    Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: May 5, 2020
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Yuan-Li Chien, Yen-Yun Chang