Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.

Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.

Abstract: A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group protected by a blocking agent. The polymer has a functional group reacting to the polyfunctional crosslinker.

Abstract: A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.

Abstract: A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.

Abstract: An encapsulating composition for a light emitting device includes a transparent resin, a plurality of light scattering particles distributed throughout the transparent resin and having an average particle size ranging from 190 nm to 450 nm, and a plurality of phosphor particles distributed throughout the transparent resin. A light emitting device includes the encapsulating composition and a light emitting diode that is encapsulated by the encapsulating composition.

Abstract: An encapsulating composition for a light emitting device includes a transparent resin, a plurality of light scattering particles distributed throughout the transparent resin and having an average particle size ranging from 190 nm to 450 nm, and a plurality of phosphor particles distributed throughout the transparent resin. A light emitting device includes the encapsulating composition and a light emitting diode that is encapsulated by the encapsulating composition.

Abstract: The present invention discloses synthesis of 2,2?-disubstituted 9,9?-spirobifluorene-based triaryldiamine. First, 2,2?-diamino-9,9?-spirobifluorene, a Pd-catalyst as auxiliary and aryl halide BX are provided, wherein X is selected from the group consisting of: Cl, Br and I, B comprises one of the following group: aryl moiety, hetero cycle, multiple fused ring, multiple fused ring with hetero atom(s). Next, a substitution reaction is performed to react the 2,2?-diamino-9,9?-spirobifluorene with the aryl halide BX to produce the 2,2?-disubstituted 9,9?-spirobifluorene-based triaryldiamines. In addition, the present invention discloses organic light emitting devices comprising hole transporting material comprising 2,2?-bis(N,N-disubstituted amino)-9,9?-spirobifluorenes.

Abstract: The present invention discloses a carbazole-based compound with a general formula as following: , wherein Q is a non-conjugate moiety, A comprises one of the following group: aryl moiety, hetero cycle, multiple fused ring, multiple fused ring with hetero atom(s). In addition, the present invention discloses a method for forming the carbazole-based compound.

Abstract: The present invention discloses synthesis of 2,2?-disubstituted 9,9?-spirobifluorene-based triaryldiamine. First, 2,2?-diamino-9,9?-spirobifluorene, a Pd-catalyst as auxiliary and aryl halide BX are provided, wherein X is selected from the group consisting of: Cl, Br and I, B comprises one of the following group: aryl moiety, hetero cycle, multiple fused ring, multiple fused ring with hetero atom(s). Next, a substitution reaction is performed to react the 2,2?-diamino-9,9?-spirobifluorene with the aryl halide BX to produce the 2,2?-disubstituted 9,9?-spirobifluorene-based triaryldiamines. In addition, the present invention discloses organic light emitting devices comprising hole transporting material comprising 2,2?-bis(N,N-disubstituted amino)-9,9?-spirobifluorenes.

Abstract: The present disclosure provides a method and system for semiconductor manufacturing automation. In one example, a method for semiconductor manufacturing automation comprises providing an identification table; defining a scheduled sequence; recording a performed sequence; and issuing a warning, if the scheduled sequence does not match the performed sequence.

Abstract: A manufacturing procedure control method. The method executes tests during transport for object lots. The object lots are carried on a transport vehicle during transport. The object lots that pass the tests are loaded in a manufacturing tool. If a load port and a tag reader are provided on the transport vehicle, additional tests can be performed during transport of the object lots.

Abstract: A manufacturing procedure control method. The method executes tests during transport for object lots. The object lots are carried on a transport vehicle during transport. The object lots that pass the tests are loaded in a manufacturing tool. If a load port and a tag reader are provided on the transport vehicle, additional tests can be performed during transport of the object lots.

Abstract: The present disclosure provides a method and system for semiconductor manufacturing automation. In one example, a method for semiconductor manufacturing automation comprises providing an identification table; defining a scheduled sequence; recording a performed sequence; and issuing a warning, if the scheduled sequence does not match the performed sequence.

Abstract: A fluorene-based pyrimidine-containing conjugated oligomer applied in six different layers in an OLED, respectively, used as an electron-transport emitting layer, an emitting layer, a host in the emitting layer, the ETL, a host in the electron-transport emitting layer, and a hole-blocking layer to upgrade light-emitting efficiency and regulate emitting color of the OLED.

Abstract: A fluorene-based pyrimidine-containing conjugated oligomer applied in six different layers in an OLED, respectively, used as an electron-transport emitting layer, an emitting layer, a host in the emitting layer, the ETL, a host in the electron-transport emitting layer, and a hole-blocking layer to upgrade light-emitting efficiency and regulate emitting color of the OLED.