Abstract: An optical device includes an LED chip, a visible-light luminescent material, and a near-infrared luminescent material, wherein a luminous power of light emitted by the near-infrared and visible-light luminescent materials in a band of 650-1000 nm under the excitation of the LED chip is A, and a sum of a luminous power of light emitted by the near-infrared and visible-light luminescent materials in a band of 350-650 nm under the excitation of the LED chip and a luminous power of residual light emitted by the LED chip in the band of 350-650 nm after the LED chip excites the near-infrared and visible-light luminescent materials is B, with B/A*100% being 0.1%-10%. According to the implementation where the optical device employs the LED chip to combine the near-infrared luminescent material and the visible-light luminescent material simultaneously.

Abstract: The present disclosure provides a radiation inspection device, which has a transportation state and a working state, and includes a container with an adjustable width, and the width of the container in the transportation state is smaller than that in the working state; a radiation inspection apparatus arranged in the container and including a radiation source and a detector, and in the transportation state, the length of the radiation inspection apparatus is arranged along the length direction of the container, and in the working state, the length of the radiation inspection apparatus is arranged along the width direction of the container to perform radiation scanning inspection on vehicles passing through the container along the length direction; a rotating apparatus arranged in the container and configured to rotate the radiation inspection apparatus when the radiation inspection device is switched between the transportation state and the working state.

Abstract: An object detection device is provided, including: a support structure, a ray source assembly, and a detector assembly. The support structure is configured to form a passageway for a passage of a detected object; the ray source assembly is configured to emit a ray; and the detector assembly includes a detector mounting frame connected to the support structure and a plurality of detection units arranged on the detector mounting frame, the detection unit being configured to receive a transmission ray penetrating the detected object and obtain a detection information based on the transmission ray; the support structure includes a vertical support arm having an adjustable height, and a vertical distance from the ray source assembly to a bottom portion of the support structure varies with a height of the vertical support arm. Another object detection device is further provided, including a ray source assembly, a detector assembly and a controller.

Abstract: Embodiments are described for placing a watermark over application windows in a desktop. For each application window that is opened in the desktop, the system can determine whether the application requires a watermark, for example, based on a predefined list that specifies which applications require watermarks. For each application window that requires a watermark, a uncovered watermark region can be calculated where the watermark will appear. An overlay can be placed over the application windows, for example in a top-level window that does not receive mouse and keyboard inputs, and the watermark can be drawn in the overlay over the location of the uncovered watermark region of each application. As a result, watermarks can be placed over a plurality of specified application windows in an efficient and convenient manner.

Abstract: A method of making an integrated circuit includes dividing, in a first layer of an integrated circuit layout, a first arrangement of metal lines into a first set of metal lines and a second set of metal lines, wherein the first set of metal lines is between the second set of metal lines and a periphery of the integrated circuit layout, wherein the first arrangement of metal lines is configured to electrically connect to a plurality of contacts connected to a second layer of the integrated circuit layout after a manufacturing process. The method further includes adjusting a metal line perimeter of at least one metal line in the second set of metal lines to make a second arrangement of metal lines, wherein each adjusted metal line perimeter is separated from contacts in the second layer of the integrated circuit layout by at least a check distance.

Abstract: A method for overlay error correction includes generating a first overlay error based on a first overlay mark, wherein the first overlay error is indicative of a misalignment between a lower pattern and an upper pattern of the first overlay mark. The method also includes generating a second overlay error based on a second overlay mark, in response to an abnormal of the first overlay error is detected. The method further includes determining whether the abnormal of the first overlay error is caused by the misalignment between the lower pattern and the upper pattern depending on the second overlay error.

Abstract: A method includes steps of dividing a first arrangement of metal lines in a circuit layout into two sets of metal lines, a first set of metal lines in a peripheral area, and a second set of metal lines in a center area. The arrangement of metal lines is configured to electrically connect to contacts of a second layer of the circuit layout. The method includes adjusting a metal line perimeter of at least one metal line in the center area to make a second arrangement of metal lines, where each adjusted metal line perimeter is separated from contacts in the second layer of the integrated circuit layout by at least a check distance.

Abstract: A light-emitting diode (LED) display device, including a substrate, a de-mura region, a plurality of mounting blocks, a first LED chip array and a second LED chip array, is disclosed. The substrate includes a first region and a second region adjacent to each other. The de-mura region includes part of the first region and part of the second region. The mounting blocks are arranged in the first and the second region as an array, each mounting block including a first and a second mounting part. The first and the second mounting part are connected in parallel. The first LED chip array includes multiple first LED chips. The second LED chip array includes multiple second LED chips. Each first mounting part is arranged on the first side of the corresponding mounting block, and each second mounting part is arranged on the second side of the corresponding mounting block.

Abstract: A method for overlay error correction includes generating a first overlay error based on a first overlay mark, wherein the first overlay error is indicative of a misalignment between a lower pattern and an upper pattern of the first overlay mark. The method also includes generating a second overlay error based on a second overlay mark, in response to an abnormal of the first overlay error is detected. The method further includes determining whether the abnormal of the first overlay error is caused by the misalignment between the lower pattern and the upper pattern depending on the second overlay error.

Abstract: The present disclosure provides a method for overlay error correction. The method includes: obtaining an overlay error based on a lower-layer pattern and an upper-layer pattern of a wafer, wherein the lower-layer pattern is obtained by first fabrication equipment through which the wafer passes, and the upper-layer pattern is obtained by exposure equipment; generating a corrected overlay error based on the overlay error and fabrication processes performed on the wafer after the first fabrication equipment and prior to the exposure equipment; and adjusting the exposure equipment based on the corrected overlay error.

Abstract: The present disclosure provides a mark for overlay error measurement. The mark includes a first pattern and a second pattern. The first pattern is disposed on a substrate and at a first horizontal level. The first pattern includes a plurality of first sub-patterns and a plurality of second sub-patterns. The first sub-patterns extend along a first direction and are arranged along a second direction different from the first direction. The second sub-patterns are arranged along the second direction, wherein a profile of each of the plurality of first sub-patterns is different from a profile of each of the plurality of second sub-patterns. The second pattern is disposed at a second horizontal level different from the first horizontal level.

Abstract: A mark for overlay error measurement and overlay error measurement is provided. The mark includes a first pattern and a second pattern. The first pattern is disposed on a first surface of a substrate. The second pattern is disposed on a second surface of the substrate. The second surface of the substrate is opposite to the first surface of the substrate. The first pattern overlaps at least a portion of the second pattern, and the first pattern and the second pattern collaboratively define a first overlay error.

Abstract: A method of manufacturing a semiconductor device structure is provided. The method includes: providing a substrate; forming a photoresist layer on the substrate; patterning the photoresist layer to form a patterned photoresist layer; forming a pitch adjustment layer on the patterned photoresist layer to define a mask pattern; and determining whether the mask pattern meets a specification of semiconductor fabrication processes; when it is determined that the mask does not meet the specification of semiconductor fabrication processes, performing a rework operation to remove the pitch adjustment layer.

Abstract: A light-emitting diode display panel includes a driving substrate, and a first light-emitting region and a second light-emitting region disposed on the driving substrate. The first light-emitting region has a first region and a second region adjacent to the first region in the first direction. The second light-emitting region is adjacent to the first light-emitting region and has a first corresponding region. The second region is between the first region and the first corresponding region. The light-emitting diode display panel further includes pixels disposed in the first region, the second region, and the first corresponding region. Each pixel includes a first light-emitting unit. The first pitch is between the first light-emitting units in the first region and in the second region. The second pitch is between the first light-emitting units in the second region and the first corresponding region. The first pitch is shorter than the second pitch.

Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.

Abstract: A display device includes a plurality of first packages and a plurality of second packages. The first packages are arranged on the substrate and each of the first packages includes a plurality of first light-emitting chips. The second packages are arranged on the substrate and each of the second packages includes a plurality of second light-emitting chips. The first packages and the second packages are alternately arranged in a first direction, and an arrangement of the first light-emitting chips of the first packages is different from an arrangement of the second light-emitting chips of the second packages.

Abstract: The present disclosure provides a back scattering inspection system and a back scattering inspection method. The back scattering inspection system includes a frame and a back scattering inspection device. The rack includes a track arranged vertically or obliquely relative to the ground, and a space enclosed by the track forms an inspection channel; and the back scattering inspection device includes a back scattering ray emitting device and a back scattering detector, and the back scattering inspection device is movably disposed on the track for inspecting an inspected object passing through the inspection channel. The back scattering inspection system can perform back scattering inspection on a plurality of surfaces of the inspected object.

Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.

Abstract: A logon screen and a user interface (UI) element used in connection with a remote desktop are resized, by presenting the logon screen and UI element in a connection/viewing window having a size that has been reduced to be smaller than the topology of a display screen of a user device. After the logon process is completed, a window of the remote desktop and/or a window of an application installed on the remote desktop can be sized/resized to a larger size for use by the user.