Abstract: The invention provides a rack with a built-in power distribution unit. The rack with a built-in power distribution unit includes a top, a bottom, the built-in power distribution unit and at least one supporting column. The built-in power distribution unit has a column housing and a plurality of power sockets, wherein the column housing is rotatably configured between the top and the bottom and the plurality of power sockets are configured on the column housing. The least one supporting column is configured between the top and the bottom, supports the top with the built-in power distribution unit, and forms a containing space with the column housing, the top and the bottom.

Abstract: A memory module includes a circuit board and a heat sink. The circuit board is disposed with multiple chip packages separated from each other by a spacing. The heat sink is attached to the chip packages and opened with multiple holes corresponding to the spacings. Thereby, a thermal air flow chamber is formed for an airflow to enter the spacings and exchange heat with the chip packages.

Abstract: A chip-like heat source equipment includes a simulation package, a thermal conductor, a heat source, a thermal grease, and an insulating pad. The thermal conductor is disposed in the simulation package, and has a simulated heat source region on one side. The heat source is disposed on another side of the thermal conductor having the simulated heat source region. The insulating pad is covered on the other side of the thermal conductor having the simulated heat source region and the heat source, such that the heat energy generated by the heat source is transferred to the simulated heat source region via the thermal conductor. In this manner, a structure having the heat generating states similar to that of the real chip is formed.

Abstract: A memory-like heat source device includes a substrate, a conductive layer disposed on the substrate, and at least one simulative heat source region. The simulative heat source region has at least one passive element and a simulative package. The passive element is disposed on the conductive layer and electrically connected to the conductive layer. Once being powered on, the passive element generates thermal energy and is covered by the simulative package. Therefore, a structure extremely similar to a thermal state in a practical memory is constituted.