Abstract: A method of forming a phase change random access memory (PCRAM) device includes forming a phase change element over a bottom electrode and a top electrode over the phase change element, forming a protection layer around the phase change element, and forming a nitrogen-containing sidewall spacer layer around the protection layer after forming the protection layer.

Abstract: A method forming a gate dielectric over a substrate, and forming a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The method further includes forming a seal on sidewalls of the metal gate structure. The method further includes forming a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, and a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The integrated circuit further includes a seal formed on sidewalls of the metal gate structure. The integrated circuit further includes a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Abstract: A mobile data collector with a keyboard, used to be combined with a mobile electronic device, includes a protective cover, a data reader, and a keyboard module. The protective cover has a bottom plate and a surrounding frame. The surrounding frame is disposed along the perimeter of the bottom plate to form a first accommodation space and a second accommodation space located at one side of the first accommodation space. The mobile electronic device is disposed at the first accommodation space. The data reader is located at a side of the bottom plate opposite to the mobile electronic device and is electrically connected to the mobile electronic device. The keyboard module is disposed in the second accommodation space and electrically connected to the data reader. Thus, the mobile data collector has an input interface for inputting or modifying related information, which enhances usage convenience.

Abstract: A mobile data collector with a keyboard, used to be combined with a mobile electronic device, includes a protective cover, a data reader, and a keyboard module. The protective cover has a bottom plate and a surrounding frame. The surrounding frame is disposed along the perimeter of the bottom plate to form a first accommodation space and a second accommodation space located at one side of the first accommodation space. The mobile electronic device is disposed at the first accommodation space. The data reader is located at a side of the bottom plate opposite to the mobile electronic device and is electrically connected to the mobile electronic device. The keyboard module is disposed in the second accommodation space and electrically connected to the data reader. Thus, the mobile data collector has an input interface for inputting or modifying related information, which enhances usage convenience.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, and a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The integrated circuit further includes a seal formed on sidewalls of the metal gate structure. The integrated circuit further includes a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, a metal gate structure over the semiconductor substrate and the gate dielectric, a dielectric film on the metal gate structure, the dielectric film comprising oxynitride combined with metal from the metal gate, and an interlayer dielectric (ILD) on either side of the metal gate structure.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, a metal gate structure over the semiconductor substrate and the gate dielectric, a dielectric film on the metal gate structure, the dielectric film comprising oxynitride combined with metal from the metal gate, and an interlayer dielectric (ILD) on either side of the metal gate structure.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, a metal gate structure over the semiconductor substrate and the gate dielectric, a dielectric film on the metal gate structure, the dielectric film comprising oxynitride combined with metal from the metal gate, and an interlayer dielectric (ILD) on either side of the metal gate structure.

Abstract: A fixing device includes a clamping portion and a plurality of suction cups mounted on a bottom surface of the clamping portion. The clamping portion defines a through hole extending through a top surface and the bottom surface of the clamping portion. A plurality of clamping pieces extends from an inner surface bounding the through hole toward the axis of the through hole to clamp the probe extending through the through hole. The suction cups are arranged around the through hole.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, a metal gate structure over the semiconductor substrate and the gate dielectric, a dielectric film on the metal gate structure, the dielectric film comprising oxynitride combined with metal from the metal gate, and an interlayer dielectric (ILD) on either side of the metal gate structure.

Abstract: A buck converter configured for converting a voltage output from a power supply to a load includes a first switch, a second switch, an inductor, three compensators and a control microchip. The first switch and the second switch are connected in series between two ends of the power supply. A first end of the inductor is connected to a node between the first switch and the second switch; a second end of the inductor serves as an output terminal connected to the load. The compensators are correspondingly connected to the first switch, the second switch and the inductor. The control microchip is electrically connected to the first and second switches and the node. The control microchip controls the first and second switches to turn on or off, and executes a current protective process when output current of the output terminal exceeds a current protective threshold of the load.

Abstract: A method of making an integrated circuit includes providing a semiconductor substrate and forming a gate dielectric over the substrate, such as a high-k dielectric. A metal gate structure is formed over the semiconductor substrate and the gate dielectric and a thin dielectric film is formed over that. The thin dielectric film includes oxynitride combined with metal from the metal gate. The method further includes providing an interlayer dielectric (ILD) on either side of the metal gate structure.

Abstract: A solid capacitor includes a body, a strip-shaped positive connection terminal and a strip-shaped negative connection terminal extending from the body comprising. Length directions of the positive connection terminal and the negative connection terminal are substantially parallel with each other while width directions of the positive connection terminal and the negative connection terminal are substantially perpendicular to each other.

Abstract: An exemplary heat dissipation structure includes a circuit board, at least one electronic element, and a heat sink. The electronic element is mounted on the circuit board to form a circuit. The heat sink is mounted on the circuit board corresponding to the electronic element to dissipate heat generated by the electronic element. The heat sink is mounted by surface mount technology.

Abstract: A touch control barcode scanner, used for being externally connected to an electric connector of a mobile electronic device thereby enabling the mobile electronic device to provide with barcode scanning function, includes: a main body and a scan module and a touch control module electrically connected with each other. The scan module is disposed in the main body and electrically connected to an external connector inserted in the electric connector; the touch control module is disposed in the main body and installed with a touch control panel corresponding to one side board of the main body; the scan module can be actuated for processing scanning merely through gently touching the touch control panel and the touch control module.

Abstract: A printed circuit board includes a power supply, a plurality of loads, a copper sheet, and a plurality of metal sheets mounted onto the copper sheet. The copper sheet is electronically connected between the power supply and the loads. The power supply outputs a plurality of currents to the loads via a plurality of current traces passing through the copper sheet, the plurality of metal sheets are located along the plurality of current traces.

Abstract: A printed circuit board (PCB) includes a bank or matrix of multi-layer ceramic capacitors (MLCCs). Each MLCC includes positive and negative electrodes respectively connected to a power layer and a ground layer of the PCB through two positive and two negative vias. A portion of the positive vias and a portion of the negative vias utilized by the same column of MLCCs are arranged in two separated lines along the flowing direction of current streams in the power layer.

Abstract: An oscilloscope includes a number of probe assemblies. Each probe assembly includes a probe and a connecting member. The connecting member includes a first connecting portion that may be coiled around the probe and a second connecting portion. The probes are connected together by the connecting members, and can be grounded by soldering one of the second connecting portions to a ground plane.

Abstract: A buck converter configured for converting a voltage output from a power supply to a load includes a first switch, a second switch, an inductor, three compensators and a control microchip. The first switch and the second switch are connected in series between two ends of the power supply. A first end of the inductor is connected to a node between the first switch and the second switch; a second end of the inductor serves as an output terminal connected to the load. The compensators are correspondingly connected to the first switch, the second switch and the inductor. The control microchip is electrically connected to the first and second switches and the node. The control microchip controls the first and second switches to turn on or off, and executes a current protective process when output current of the output terminal exceeds a current protective threshold of the load.