Abstract: The present invention relates to a coaxial socket of an impedance matching structure for semiconductor chip testing and a manufacturing method thereof. The coaxial socket includes a test socket locating substrate, a test socket body, a test socket cover, and a test probe. A polymer I and a polymer II are installed and fastened in the test socket body and the test socket cover respectively. A probe slot I and a probe slot II are provided in the polymer I and the polymer II respectively. The test probe is inserted through the probe slot I and the probe slot II. In the present invention, the test socket body and the test socket cover are made of conductive metal, and single-end impedance matching of 50 ohms or differential impedance matching of 100 ohms is performed between them and the probe, to achieve superb signal transmission and heat conduction.

Abstract: The present invention relates to a semiconductor test socket of a hybrid coaxial structure and a manufacturing method thereof. The test socket includes a test socket locating plate, an insulation test socket body, a built-in conductive socket body, a built-in conductive socket cover, and an insulation test socket cover. The test socket locating plate, the insulation test socket body, and the insulation test socket cover are sequentially disposed from top to bottom. An opening is provided on the insulation test socket body. The built-in conductive socket body and the built-in conductive socket cover are disposed in the opening. In the present invention, relatively good inter-channel isolation is achieved by using the coaxial structure made of conductive metal, thereby greatly reducing manufacturing costs and a production period of the test socket.

Abstract: The present invention relates to a coaxial socket of an impedance matching structure for semiconductor chip testing and a manufacturing method thereof. The coaxial socket includes a test socket locating substrate, a test socket body, a test socket cover, and a test probe. A polymer I and a polymer II are installed and fastened in the test socket body and the test socket cover respectively. A probe slot I and a probe slot II are provided in the polymer I and the polymer II respectively. The test probe is inserted through the probe slot I and the probe slot II. In the present invention, the test socket body and the test socket cover are made of conductive metal, and single-end impedance matching of 50 ohms or differential impedance matching of 100 ohms is performed between them and the probe, to achieve superb signal transmission and heat conduction.

Abstract: Provided is a vertical probe card, the vertical probe card includes: a printed circuit board (PCB) including a bottom hole and a PCB pad surrounding the bottom hole; a cover plate disposed on the PCB and including a cover hole, where the cover hole and the bottom hole are disposed coaxial with each other and form a receiving space; and a probe received in the receiving space. The probe includes a probe head passing through the cover hole to extend out of the cover plate and to contact with a chip, where an end, which is provided with the probe head, of the probe is a first end; and a protruding portion disposed in the mid-portion of the probe and in contact with the PCB pad, where a part between the probe head and the protruding portion of the probe and the protruding portion are conductors.

Abstract: Provided is a vertical probe card, the vertical probe card includes: a printed circuit board (PCB) including a bottom hole and a PCB pad surrounding the bottom hole; a cover plate disposed on the PCB and including a cover hole, where the cover hole and the bottom hole are disposed coaxial with each other and form a receiving space; and a probe received in the receiving space. The probe includes a probe head passing through the cover hole to extend out of the cover plate and to contact with a chip, where an end, which is provided with the probe head, of the probe is a first end; and a protruding portion disposed in the mid-portion of the probe and in contact with the PCB pad, where a part between the probe head and the protruding portion of the probe and the protruding portion are conductors.