Patents by Inventor Yuanwei WANG

Yuanwei WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929550
    Abstract: A radio frequency (RF) connector includes an insulating portion configured in a cylindrical shape; an outer conducting portion configured in a cylindrical shape and disposed to surround an outer circumferential surface of the insulating portion; and an inner conducting portion disposed inside the insulating portion in a hollow shape and having both ends protruding from the insulating portion, the insulating portion electrically separating the outer conducting portion from the inner conducting portion.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: March 12, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yiwei Ma, Rongbiao Su, Yuanwei Wang
  • Patent number: 11289843
    Abstract: A test adapter for establishing a test connection with a circuit board is provided. The circuit board includes an inter-board connector or a planar contact in close contact with the inter-board connector. The test adapter includes a metal housing having a contact surface in contact with a flat surface of the circuit board, a connection end opposite to the contact surface, and a first cavity having a first opening at the center of the contact surface. The test adapter further comprises a first outer conductor and a first inner conductor arranged in the first cavity, and an insulating medium arranged between the first outer conductor and the first inner conductor.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: March 29, 2022
    Inventors: Yumei Wang, Fei Gao, Yuanwei Wang, Futing Lv
  • Publication number: 20210352014
    Abstract: Examples in this disclosure relates to methods and apparatus for routing data packet. One example method includes receiving a data packet, determining a first computation task type corresponding to the data packet, determining, based on a pre-obtained first correspondence between the first computation task type, nodes, and a computing performance corresponding to each of the nodes, at least one of the nodes corresponding to the first computation task type and a first computing performance corresponding to the at least one of the nodes, determining a target node from the at least one of the nodes based on the first computing performance corresponding to the at least one of the nodes and a link status between a local node and each of the at least one of the nodes, determining an address of the target node as a destination address of the data packet, and forwarding the data packet based on the destination address.
    Type: Application
    Filed: July 20, 2021
    Publication date: November 11, 2021
    Inventors: Fengxin SUN, Guanhua ZHUANG, Yuanwei WANG, Feng LI, Xiaomin YANG, Shuheng GU
  • Publication number: 20210328333
    Abstract: A radio frequency (RF) connector includes an insulating portion configured in a cylindrical shape; an outer conducting portion configured in a cylindrical shape and disposed to surround an outer circumferential surface of the insulating portion; and an inner conducting portion disposed inside the insulating portion in a hollow shape and having both ends protruding from the insulating portion, the insulating portion electrically separating the outer conducting portion from the inner conducting portion.
    Type: Application
    Filed: August 21, 2019
    Publication date: October 21, 2021
    Inventors: Yiwei MA, Rongbiao SU, Yuanwei WANG
  • Publication number: 20210305743
    Abstract: A test adapter for establishing a test connection with a circuit board is provided. The circuit board includes an inter-board connector or a planar contact in close contact with the inter-board connector. The test adapter includes a metal housing having a contact surface in contact with a flat surface of the circuit board, a connection end opposite to the contact surface, and a first cavity having a first opening at the center of the contact surface. The test adapter further comprises a first outer conductor and a first inner conductor arranged in the first cavity, and an insulating medium arranged between the first outer conductor and the first inner conductor.
    Type: Application
    Filed: July 24, 2020
    Publication date: September 30, 2021
    Inventors: Yumei WANG, Fei GAO, Yuanwei WANG, Futing LV
  • Patent number: 9920452
    Abstract: The present invention relates to method of preparing a monocrystalline diamond abrasive grain comprising the steps of: sufficiently dispersing a micron-scale monocrystalline diamond and at least a micron-scale metal powder in a sol containing at least a nano-scale metal powder, and controlling the suitable ratio of the two kinds of metal powder with different order of magnitude of particle size, accordingly the micron-scale metal powder can be stuffed into voids among the monocrystalline diamond grains, and only a suitable amount of nano-scale metal powder is required to let the micron-scale metal powder and nano-scale metal powder coat together on the surface of the micron-scale diamond to form an integral and uniform coating layer including at least two kinds of metal grains, thus the resulting monocrystalline diamond abrasive grains have a unique rough-surface morphology, a plurality of contact points and contact surfaces resenting in the grinding process and good self-sharpening.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: March 20, 2018
    Assignee: BEIJING POLYSTAR HITECH CO., LTD.
    Inventors: Zhenyu Wang, Xiaogang Hu, Yuanwei Wang
  • Publication number: 20160281264
    Abstract: The present invention relates to method of preparing a monocrystalline diamond abrasive grain comprising the steps of: sufficiently dispersing a micron-scale monocrystalline diamond and at least a micron-scale metal powder in a sol containing at least a nano-scale metal powder, and controlling the suitable ratio of the two kinds of metal powder with different order of magnitude of particle size, accordingly the micron-scale metal powder can be stuffed into voids among the monocrystalline diamond grains, and only a suitable amount of nano-scale metal powder is required to let the micron-scale metal powder and nano-scale metal powder coat together on the surface of the micron-scale diamond to form an integral and uniform coating layer including at least two kinds of metal grains, thus the resulting monocrystalline diamond abrasive grains have a unique rough-surface morphology, a plurality of contact points and contact surfaces resenting in the grinding process and good self-sharpening.
    Type: Application
    Filed: July 29, 2014
    Publication date: September 29, 2016
    Applicant: BEIJING POLYSTAR HITECH CO., LTD.
    Inventors: Zhenyu WANG, Xiaogang HU, Yuanwei WANG